DIMENSIONS SOIC 16 Search Results

Contextual Info: 16-Lead Small Outline IC SOIC 0.150" Body Width Package Dimensions 16-Lead Small Outline IC (SOIC) 0.150" Inches Symbol Min. A A1 B C D E e H h L N α ccc Millimeters Max. Min. .053 .069 .004 .010 .013 .020 .0075 .010 .386 .394 .150 .158 .050 BSC 1.35 1.75

751G-03

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC CASE 751G–03 ISSUE B DATE 09/05/1997 SCALE 1:1 A D 9 1 8 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION.

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC CASE 751B–05 ISSUE J DATE 04/28/1993 SCALE 1:1 –A– 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

Contextual Info: CASE OUTLINES AND PACKAGE DIMENSIONS SOIC–14 CASE 751A–03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006

DIMENSIONS soic 16

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

p 512

Abstract: DIMENSIONS soic 28 S028-3 PSC-4016
Contextual Info: PACKAGE DIAGRAM OUTLINES SOIC C o n t in u e d PACKAGE DIAGRAM OUTLINES SOIC (C o n tin u e d ) REVISION S DWG f S Y H B □ DCN REV DESCRIPTION DATE 2764 2 03 REDRAW TO JEDEC FORMAT 0 3 /1 5 /9 5 S0 2 8 -3 JEDEC VARIATION NOM LAND PATTERN DIMENSIONS N

1256A-12

Abstract: 8 pin 393 atmel 0420
Contextual Info: Package Drawing 16S2, 16-lead, 0.300" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.508) 0.013 (0.330) 0.299 (7.60) 0.291 (7.39) PIN 1 0.420 (10.7) 0.393 (9.98) 0.050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)

16s1

Contextual Info: Package Drawing 16S1, 16-lead, 0.150" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.51) 0.013 (0.33) 0.158 (4.00) 0.150 (3.80) PIN 1 0.244 (6.20) 0.228 (5.80) .050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)

EIA and EIAJ tape standards

Abstract: EIA-481-3 EIA-481-1A Package Dimensions EIAJ SOIC 8 XICOR DATE CODE EIA and EIAJ standards EIA and EIAJ standards for marking mark code t4 diode 56mm carrier tape EIA-481-1A tsop
Contextual Info: TAPE AND REEL REFERENCE GUIDE TABLE OF CONTENTS Section Page 1.0 Purpose 1 2.0 Scope 1 3.0 Requirements 2-3 Figure One: Embossed Carrier Dimensions for SOIC 8mm & 12mm tapes Embossed Tapes Only 4 Table One: Embossed Carrier Tape Dimensions for 8mm & 12mm tapes Embossed Tapes Only

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS26DR Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width mm (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1

MS-013-AA

Abstract: MS-013AC PS28A 0044 PS16A MS-013-AC MS 013AA PS20A
Contextual Info: Q QUALITY SEMICONDUCTOR, INC. 300-MIL SOIC - Package Code SO Plastic Small Outline Gull-Wing Notes: 1. Refer to applicable symbol list. 2. All dimensions are in inches. 3. N is the number of lead positions. 4. Dimensions D and E are to be measured at maximum material

Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

DIMENSIONS soic 16

Abstract: SOIC-16
Contextual Info: Packaging Information Mechanical Dimensions SOIC-16 1.350 0.053 1.750(0.069) 7° 0.330(0.013) 0.510(0.020) Unit: mm(inch) 1.250(0.049) 1.650(0.065) 7° B A 20:1 0.250(0.010) 0.400(0.016) 9.800(0.386) 10.200(0.402) 0° 8° R0.200(0.008) R0.200(0.008) 0.050(0.002)

07AK

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK 8 1 SCALE 1:1 −X− DATE 16 FEB 2011 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

Contextual Info: SIEMENS IL256 AC INPUT PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER FEATURES Package Dimensions in Inches mm • Guranteed CTR Symmetry, 2:1 Maximum • Bidirectional AC Input • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing, .05*

capacitor 22uF

Abstract: IRM5000 IRM7001
Contextual Info: IRM7001 SIR Modulator/Demodulator Dimensions in inches mm SOIC Package A .393 (10.0) .386 (9.8) B .157 (4.0) .244 (6.2) 8 .150 (3.8) .229 (5.8) 16 9 1 .050 (1.27) BSC .068 (1.75) .054 (1.35) R x 45° .009 (.25) .008 (.19) T .019 (.49) .014 (.35) FEATURES

footprint soic 14

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 16 LEAD WIDE BODY, EXPOSED PAD CASE 751R−02 ISSUE B DATE 18 JUL 2005 −U− SCALE 1:1 A M 16 P 0.25 0.010 M W B 1 M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.

Crystal, 3.6864MHz

Abstract: Crystal, 3.6864MHz datasheet 10k resistor 1/4 watt 1206 datasheet IRM5000 IRM7001 IRMS6118
Contextual Info: IRM7001 SIR Modulator/Demodulator Dimensions in inches mm SOIC Package A .393 (10.0) .386 (9.8) B .157 (4.0) .244 (6.2) 8 .150 (3.8) .229 (5.8) 16 9 1 .050 (1.27) BSC .068 (1.75) .054 (1.35) R x 45° .009 (.25) .008 (.19) T .019 (.49) .014 (.35) .049 (1.25)

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 16 LEAD WIDE BODY, EXPOSED PAD CASE 751AG−01 ISSUE O DATE 26 JUL 2005 −U− SCALE 1:1 A M 16 P 0.25 0.010 M W B 1 M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.

DN-S14

Abstract: jesd48b
Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width mm (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS33DR SOIC

07AA

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC–8 NB CASE 751–07 ISSUE AA DATE 04/23/2002 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width mm W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS33DR SOIC

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width mm (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS247DR SOIC

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width mm W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS03DR SOIC