DIMENSIONS SOIC 16 Search Results

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width mm W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS03DR SOIC

Contextual Info: SFH6318 SFH6319 SIEMENS LOW CURRENT, HIGH GAIN OPTOCOUPLER Package Dimensions in Inches mm .120±.002 (3.05+05) FEATURES • Industry Standard SOIC-8 Surface Mountable Package • High Current Transfer Ratio, 800% n n n n (•39; ± 0 5 ) C a th o d e ^

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS032C − Revised October 2003 The CD4027B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and

CD4514

Abstract: 7703201JA CD4514B CD4514BE CD4514BEE4 CD4514BF CD4514BF3A CD4514BM CD4514BM96 CD4514BM96E4
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS074A – Revised June 2003 The CD4514B and CD4515B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), and 16-lead small-outline packages (M and M96 suffixes).

CD4054BE

Abstract: CD4054BEE4 CD4054BF3A CD4054BM CD4054BM96 CD4054BM96E4 CD4054BM96G4 CD4054BME4 CD4055BE
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS048C − Revised October 2003 The CD4054B-, CD4055B-, and CD4056B-series types are supplied in 16-lead dual-in-line plastic packages E suffix , 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and

948F

Abstract: NB2308A NB2308AC1DG NB2308AC1DR2G NB2308AC1HDG NB2308AI1DG NB2308AI1DR2G
Contextual Info: NB2308A 3.3 V Zero Delay Clock Buffer The NB2308A is a versatile, 3.3 V zero delay buffer designed to distribute high−speed clocks. It is available in a 16 pin package. The part has an on−chip PLL which locks to an input clock presented on the REF pin. The PLL feedback is required to be driven to FBK pin,

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

Contextual Info: [ /Title CD74 HC451 4, CD74 HC451 5 /Subject (High Speed CMOS CD54HC4514, CD74HC4514, CD74HC4515 Data sheet acquired from Harris Semiconductor SCHS280C November 1997 - Revised July 2003 High-Speed CMOS Logic 4- to 16-Line Decoder/Demultiplexer with Input Latches

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 21-Apr-2010 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-8764502EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type UC1524AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

uc3906n

Abstract: UC3906DW
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 4-May-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty UC2906DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2906DWG4 ACTIVE

CD74HC154

Contextual Info: [ /Title CD74 HC154 , CD74 HCT15 4 /Subject (High Speed CMOS Logic 4-to-16 Line Decod er/Dem CD54HC154, CD74HC154, CD54HCT154, CD74HCT154 Data sheet acquired from Harris Semiconductor SCHS152D High-Speed CMOS Logic 4- to 16-Line Decoder/Demultiplexer September 1997 - Revised June 2004

SN74368A

Abstract: SN54LS367A-SP SN74367A SN54365A
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 28-Apr-2011 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-9687802QEA OBSOLETE CDIP J 16 TBD Call TI

Contextual Info: [ /Title CD74 HC406 7, CD74 HCT40 67 /Subject (HighSpeed CMOS CD74HC4067, CD74HCT4067 Data sheet acquired from Harris Semiconductor SCHS209C February 1998 - Revised July 2003 High-Speed CMOS Logic 16-Channel Analog Multiplexer/Demultiplexer Features Description

6843Z

Abstract: 384X 6841Z MARKING 0V L8.2X3 6845Z 6844Z MARKING 42Z ISL6840IB ISL6840IBZ ISL6842
Contextual Info: ISL6840, ISL6841, ISL6842, ISL6843, ISL6844, ISL6845 Data Sheet April 16, 2007 Improved Industry Standard Single-Ended Current Mode PWM Controller The ISL6840, ISL6841, ISL6842, ISL6843, ISL6844, ISL6845 family of adjustable frequency, low power, pulse

Contextual Info: [ /Title CD74 HC406 7, CD74 HCT40 67 /Subject (HighSpeed CMOS CD74HC4067, CD74HCT4067 Data sheet acquired from Harris Semiconductor SCHS209C February 1998 - Revised July 2003 High-Speed CMOS Logic 16-Channel Analog Multiplexer/Demultiplexer Features Description

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2011 PACKAGING INFORMATION Orderable Device 1 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-8764502EA ACTIVE CDIP J 16 1 TBD

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 PACKAGING INFORMATION Orderable Device 1 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-8764502EA ACTIVE CDIP J 16 1 TBD

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS076D − Revised March 2004 The CD4518B and CD4520B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96,

UC3524AN

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 9-May-2012 PACKAGING INFORMATION Orderable Device 1 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-8764502EA ACTIVE CDIP J 16 1 TBD

quad nand

Abstract: CD4043BE Harris CMOS Integrated Circuits
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS041C – Revised March 2003 The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (D, DR, DW, DWR, and