DIE CHIP FET Search Results

7416a

Abstract: chip bonding die DIE BONDER
Contextual Info: HSXAWAVS Power FET Chip Handling Instruction Hexawave, Inc. Die Bonding Procedure Equipments and Tools 1. Die Bonder 2. Tweezers Type SS 3. Thermometer Procedure I. Perform all steps in a forcing N2gas environment. 2 Control the heated stage temperature within 310

2N4416A

Abstract: CMPF4416A CP210
Contextual Info: PROCESS CP210 Central Small Signal Transistors TM Semiconductor Corp. N - Channel Silicon Amplifer J FET Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 15 x 15 MILS Die Thickness 8.0 MILS Drain Bonding Pad Area 3.2 X 4.0 MILS Source Bonding Pad Area

2N4393

Abstract: 2N4393 DIE CHIP cp206 GEOMETRY 2N4391 2N4391 ADAM transistor 2n4391 2N4392 CMPF4391 CMPF4392
Contextual Info: CP206 PROCESS Central Small Signal Transistors TM Semiconductor Corp. N - Channel Switch/Chopper J FET Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21 x 18 MILS Die Thickness 8.0 MILS Drain Bonding Pad Area 3.8 X 3.8 MILS Source Bonding Pad Area

ha 11122

Contextual Info: HV70 inc. 34-Channel Symmetric Row Driver Ordering Information_ Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed*

BL51

Abstract: G100 P89C660 P89C668
Contextual Info: phyCORE-P89C668 QuickStart Instructions Using PHYTEC FlashToolsOCF for on-chip Flash and the µVision2 Software Evaluation Development Tool Chain Note: The PHYTEC Spectrum CD includes the electronic version of the phyCORE-P89C66x English Hardware Manual Hinweis: Die PHYTEC Spectrum CD beinhaltet die elektronische

Contextual Info: HV70 LJàSupertex me. 34-Channel Symmetric Row Driver Ordering Information_ Package Options Device 44 J-Lead Quad Plastic Chip Carrier 44 J-Lead Quad Ceramic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-STD-883 Processed*

chips F8680

Abstract: F8680A crt terminal interfacing in 8086 F8680 support chips of 8086 TL08 015 s79 SPDT switch MR25 resistor 22 NEB 063 T32 Chips and Technologies
Contextual Info: Product Overview • F8680A PC/CHIP F8680A PC/CHIP Product Overview A mie single-chip PC, the F8680A PC/CHIP™ features die SuperState R management system, low power consumption, high performance, direct support of PCMCIA 2.0 memory and I/O cards, and flexible memory support

FET 2N5434

Abstract: 2N5432 2N5434 E-41
Contextual Info: ^ /o u t r a CHIP NUMBER CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS .030" 0.762mm It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%. Die Sis«: 30 x 32

Contextual Info: Supertexinc. HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022-C

Contextual Info: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022-C HV7022DJ-C

HV70

Abstract: HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C M0-112 RBHV7022DJ-C A03160
Contextual Info: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C

push-pull converter 230V input

Abstract: HV70 HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C RBHV7022DJ-C
Contextual Info: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C

230v to 12v dc circuit diagrams

Abstract: 12v dc to 230v ac CIRCUITS CONVERTER HV70 HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C RBHV7022DJ-C
Contextual Info: HV7022-C HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C

HV70

Abstract: HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C RBHV7022DJ-C 12v dc to 230v ac CIRCUITS CONVERTER 230v AC to 30V dC converter circuit diagram
Contextual Info: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C

AN3016

Abstract: MAAMGM0002 MAAMGM0002-DIE MAAMGM0002-DIE-SMB MAAMGM0002-SMB MAAMGM-0002
Contextual Info: RoHS Compliant Amplifier, Distributed, 0.1W 1.0-18.0 GHz MAAMGM0002-DIE Rev E Features ♦ ♦ ♦ ♦ 0.1 Watt Saturated Output Power Level 4 dB Typical Noise Figure Select-at-Test Biasing MSAG Process Description The MAAMGM0002-Die is a 0.1W Distributed Amplifier with on-chip

AN3019

Abstract: MAAP-000078-PKG001 MAAP-000078-SMB001 MAAP-000078-SMB004 MAAPGM0078-DIE AN3016
Contextual Info: Amplifier, Power, 12W 2.0-6.0 GHz MAAPGM0078-DIE Rev B Preliminary Datasheet Features ♦ 12 Watt Saturated Output Power Level ♦ Variable Drain Voltage 8-10V Operation ♦ MSAG Process Description The MAAPGM0078-DIE is a 2-stage 12W power amplifier with on-chip bias

MAAP-000070-PKG003

Abstract: AN3016 MAAP-000070-MCH000 MAAP-000070-SMB003
Contextual Info: Amplifier, Power, 1.9W 10.0-13.25 GHz MAAPGM0070-DIE Rev B Preliminary Datasheet Features ♦ 1.9 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0070-DIE is a 4-stage 1.9 W power amplifier with on-chip

MAAPGM0066-DIE

Abstract: MAAP-000066-PKG003
Contextual Info: Amplifier, Power, 2 W 2.5-6.0 GHz MAAPGM0066-DIE Rev B Preliminary Datasheet Features ♦ 2.5 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0066-DIE is a 3-stage 2 W power amplifier with on-chip

MAAPGM0066-DIE

Abstract: MAAP-000066-PKG003
Contextual Info: Amplifier, Power, 2 W 2.5-6.0 GHz MAAPGM0066-DIE Rev C Preliminary Datasheet Features ♦ 2.5 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0066-DIE is a 3-stage 2 W power amplifier with on-chip

AN3016

Abstract: MAAP-000072-PKG003 MAAP-000072-SMB003
Contextual Info: Amplifier, Power, 1 W 17.7-19.7 GHz MAAPGM0072-DIE Rev B Preliminary Datasheet Features ♦ 1 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0072-DIE is a 4-stage 1 W power amplifier with on-chip

MAAPGM0073-DIE

Contextual Info: Amplifier, Power, 1.2W 4.0-8.5 GHz MAAPGM0073-DIE 903275 A Preliminary Datasheet Features ♦ 1.2 Watt Saturated Output Power Level ♦ Variable Drain Voltage 6-10V Operation ♦ MSAG Process Description The MAAPGM0073-DIE is a 3-stage 1.2 W power amplifier with on-chip

MAAPGM0074-DIE

Contextual Info: Amplifier, Power, 8W 2.0-8.0 GHz MAAPGM0074-DIE Rev — Preliminary Datasheet Features ♦ ♦ ♦ ♦ 8 Watt Saturated Output Power Level 2-Octave Bandwidth Variable Drain Voltage 4-10V Operation MSAG Process Description The MAAPGM0074-DIE is a 2-stage 8W power amplifier with on-chip

74hc4000

Abstract: STK089 MAX354 MAX355 MAX383 MAX4530 MAX4555 MAX4614 74CD40 reed relais PHILIPS
Contextual Info: MUX & SWITCH Datenblätter • e nftig Zukü ukte d o r P ANALOG DESIGN GUIDE Kostenlose Muster Anwendungsbeispiele • 1 e sgab u A . 14 Weltweit erster Analogschalter im Ultra-Chip-Scale-Gehäuse Die Bausteine MAX4684–MAX46881 sind die leistungsfähigsten und kleinsten Analogschalter auf

MAAPGM0066-DIE

Abstract: AN3016 DM4030LD DM6030HK RG-90
Contextual Info: MAAPGM0066-DIE Amplifier, Power, 2W 2.5—6.0 GHz M/A-COM Products Rev D Features ♦ 2 Watt Saturated Output Power Level ♦ Variable Drain Voltage 6-10V Operation ♦ No air bridges Description The MAAPGM0066-DIE is a 3-stage 2 W power amplifier with on-chip