DIAMOND CHIP RESISTOR Search Results
DIAMOND CHIP RESISTOR Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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GCM32ED70J476KE02L | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for Automotive | |||
GRM022R61C104ME05L | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for General Purpose | |||
GRM033D70J224ME01D | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for General Purpose | |||
GRM155R61H334KE01J | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for General Purpose | |||
GRM2195C2A273JE01J | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for General Purpose |
DIAMOND CHIP RESISTOR Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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CA0505D XXTContextual Info: ATTENUATOR CVD DIAMOND CHIP 20 WATTS DATA SHEET FEATURES EN 13-3904 Revision - SHEET 1 OF 2 Dwg 1013105 PART SERIES: CA0505D XXT APPLICATIONS CVD Diamond Substrate Small Size Highest Thermal Performance Excellent Peak Power Capability Self Passivated Thin Film Resistors |
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CA0505D 423F121 2Y194 CA0505D XXT | |
Diamond Chip Attenuator
Abstract: CA0505D XX
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CA0505D 423F121 2Y194 Diamond Chip Attenuator CA0505D XX | |
A-1297Contextual Info: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through 10Ghz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional |
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10Ghz. MSA3G-01dB-BU. A-1297 | |
Contextual Info: THICK FILM CHIP ATTENUATORS DESCRIPTION Wire and ribbon bondable and Flipchip thick film chip attenuators, printed and fired on 96% alumina. Provides attenuation accuracy for frequencies through lOGhz. Double layer terminations provide additional bonding surface. Abrasive trimming ensures optimum resistor stability. Diamond sawed for dimensional |
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MSA3G-01dB-BU. | |
CR0402D
Abstract: Diamond Chip Resistor
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CR0402D 423F124 2Y194 CR0402D Diamond Chip Resistor | |
CR1010D
Abstract: Diamond Chip Resistor
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CR1010D 423F124 2Y194 CR1010D Diamond Chip Resistor | |
Contextual Info: RESISTOR CVD DIAMOND CHIP 20 WATTS, WRAPPED DATA SHEET PART SERIES: CR0505DX5W2 FEATURES SHEET 1 OF 2 Dwg 1013125 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film |
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CR0505DX5W2 423F124 2Y194 | |
CR0505D
Abstract: Diamond Chip Resistor
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CR0505D 423F124 2Y194 Diamond Chip Resistor | |
CR0603D
Abstract: Diamond Chip Resistor
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CR0603D 423F124 2Y194 Diamond Chip Resistor | |
Contextual Info: RESISTOR CVD DIAMOND CHIP 25 WATTS, WRAPPED DATA SHEET PART SERIES: CR0603DX5W2 FEATURES SHEET 1 OF 2 Dwg 1013145 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film |
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CR0603DX5W2 423F124 2Y194 | |
CR0402DX5W2Contextual Info: RESISTOR CVD DIAMOND CHIP 10 WATTS WRAPPED DATA SHEET PART SERIES: CR0402DX5W2 FEATURES SHEET 1 OF 2 Dwg 1013115 EN 13-3904 Revision - APPLICATIONS Small Size - Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film |
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CR0402DX5W2 423F124 2Y194 CR0402DX5W2 | |
RF MESFET S parametersContextual Info: MwT-A8 ÛÊVt M ic r o w a v e 16 GHz High Power GaAs FET techno lo g y H 0.6 WATT POWER OUTPUT AT 12 GHz +40 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METALVGOLD GATE 1200 MICRON GATE WIDTH DIAMOND-UKE CARBON PASSIVATION CHOICE OF CHIP AND ONE |
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transistor MWTA 06
Abstract: mwta 06
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MwT-A11 MwT-A11 syste80 000Gb23 transistor MWTA 06 mwta 06 | |
power combiner broadband transformers
Abstract: 4 port circulator high power duplexer HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint X-band Gan Hemt resistor parasitic capacitance DIAMOND TECHNOLOGIES DUAL JUNCTION CIRCULATOR CT1310D RFTM 9926 transistor
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2y194
Abstract: Fixed Attenuators Surface Mount 30dB M17/113-RG316 MIL-C-17 RG316 RF florida lab florida rf stripline directional couplers 2y194 cable kapton film
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2Y194 2y194 Fixed Attenuators Surface Mount 30dB M17/113-RG316 MIL-C-17 RG316 RF florida lab florida rf stripline directional couplers 2y194 cable kapton film | |
MTVA0300N07
Abstract: MTVA0300
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trm a55Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-Flex Lab-Flex® S Lab-Flex® AF Semi-Rigid, Conformable & Flexible Semi-Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV |
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Contextual Info: MachXO2 Breakout Board Evaluation Kit User’s Guide January 2014 Revision: EB68_02.2 MachXO2 Breakout Board Evaluation Kit User’s Guide Introduction Thank you for choosing the Lattice Semiconductor MachXO2 Breakout Board Evaluation Kit! This user’s guide describes how to start using the MachXO2 Breakout Board, an easy-to-use platform for evaluating and designing with the MachXO2 ultra-low density FPGA. Along with the board and accessories, this kit |
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MachXO2-7000HE MachXO2-12R16, RC0603JR-070RL CRCW06031R00JNEAHP RC0603FR-07100RL RC0402FR-071KL FT2232HL 93LC56C-I/SN LCMXO2-7000HE-4TG144C | |
QFP lead pitch 0.3mm
Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
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Sep2009 ISO9001 50x50mm QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package | |
MX25Lxx
Abstract: M25PXX LVCMOS33 ISPVM embedded
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TN1108 MX25Lxx M25PXX LVCMOS33 ISPVM embedded | |
Contextual Info: RESISTOR CHIP 5 WATT DATA SHEET PART SERIES: 81-3001B-X-X FEATURES SHEET 1 OF 2 Dwg 81-3001B EN 13-3508 Revision- APPLICATIONS Wide Band Operation High Power Direct Attached Low Capacitance Easy Installation Wide Resistance Range Broadcast High Power Filters |
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81-3001B-X-X 81-3001B 2Y194 423F106 | |
lattice ECP3 Pinouts filesContextual Info: DDR & DDR2 SDRAM Controller IP Cores User’s Guide February 2012 ipug35_05.0 Table of Contents Chapter 1. Introduction . 5 Quick Facts . 5 |
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ipug35 LFSC3GA25E-6F900C lattice ECP3 Pinouts files | |
Contextual Info: RESISTOR CHIP 50 WATT DATA SHEET PART SERIES: 81A7028XXF FEATURES SHEET 1 OF 2 Dwg 81A7028F EN 13-3509 Revision- APPLICATIONS Wide Band Operation High Power Direct Attached Low Capacitance Easy Installation Wide Resistance Range Broadcast High Power Filters |
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81A7028XXF 81A7028F 81A7028X 2007028XXF 2Y194 423F106 | |
Contextual Info: Construction of MSI Precision Chip Resistors 4. Bondability All resistors are fabricated with the resistor film sandwiched between a bottom conductor and a top conductor termination. This construction exposes the maximum bond pad area for multiple wire bonds, |
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