DIAMOND CHIP RESISTOR Search Results

power combiner broadband transformers

Abstract: 4 port circulator high power duplexer HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint X-band Gan Hemt resistor parasitic capacitance DIAMOND TECHNOLOGIES DUAL JUNCTION CIRCULATOR CT1310D RFTM 9926 transistor
Contextual Info: Diamond Rf Resistives: The Answer to High Power and Low Capacitance | Novembe. Page 1 of 6 November 2011 issue: Technical Feature Diamond Rf™ Resistives: The Answer to High Power and Low Capacitance A single 0402 resistor, manufactured on a CVD diamond substrate, can dissipate 20 W of continuous

CT0505D

Abstract: CT1310D CR0505D SN95 solder diamond circuit flange RF resistor 50
Contextual Info: CVD Diamond High Power Resistors and Terminations Application Note 0022 General Description: There are many applications in RF design where it is necessary to absorb large amounts of RF power. In order to effectively absorb large amounts of power, resistors and terminations

2y194

Abstract: Fixed Attenuators Surface Mount 30dB M17/113-RG316 MIL-C-17 RG316 RF florida lab florida rf stripline directional couplers 2y194 cable kapton film
Contextual Info: CABLE ASSEMBLIES RF COMPONENTS RESISTORS I TERMINATIONS I ATTENUATORS I CABLE ASSEMBLIES surface mount I flange mount I coaxial Authorized Distributors TERMINATIONS TEMpERATURE VARIABLE ATTENUATORS – THERMOpAD LAB FLEx® CABLE ASSEMBLIES We offer a full line of high power terminations including tab & cover, flange

MTVA0300N07

Abstract: MTVA0300
Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

trm a55

Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

MX25Lxx

Abstract: M25PXX LVCMOS33 ISPVM embedded
Contextual Info: LatticeECP2/M sysCONFIG Usage Guide June 2010 Technical Note TN1108 Introduction The configuration memory in the LatticeECP2 and LatticeECP2M™ FPGAs is built using volatile SRAM; therefore, an external non-volatile configuration memory is required to maintain the configuration data when the power is

TN1169

Abstract: ECP3-35 ECP3-95 LVCMOS33 64SED lattice ECP3 slave SPI Port
Contextual Info: LatticeECP3 sysCONFIG Usage Guide June 2010 Technical Note TN1169 Introduction Configuration is the process of loading or programming a design into volatile memory of an SRAM-based FPGA. This is accomplished via a bitstream file, representing the logical states, that is loaded into the FPGA internal configuration SRAM memory. The functional operation of the device after programming is determined by these internal

SSI-LXN730SOD

Contextual Info: dome lens panel indicators SSI-LXN730 Series 13mm Diamond Cut Lens Indicator »13.80 [#0.543] m PANEL CUTOUT: 0 0 .3 7 5 " PANEL THICKNESS: 4.0m m MAX Lumex Part Number Dice Material HIGH BRIGHTNESS SSI-LXN730SID AllnGaP SSI-LXN730SOD AllnGaP SSI-LXN73QSPGD

LVCMOS25

Abstract: LVCMOS33 machxo256 PFU1 LVDS252 LVCMOS15 PCI33 MachXO sysIO Usage Guide LVCMOS-15 LVCMOS12
Contextual Info: MachXO sysIO Usage Guide September 2010 Technical Note TN1091 Introduction The MachXO sysIO™ buffers provide the ability to easily interface with other devices using advanced system I/O standards. This technical note describes the sysIO standards available and how they can be implemented using

PL14C

Abstract: PR15D PR13C LCMXO2280C-3FTN256C PL15C FT2232HL PT10c PR11D ISPVM LCMXO2280C-B-EVN
Contextual Info:  MachXO2280 Breakout Board Evaluation Kit User’s Guide March 2011 Revision: EB66_01.0  MachXO2280 Breakout Board Evaluation Kit User’s Guide Lattice Semiconductor Introduction Thank you for choosing the Lattice Semiconductor MachXO 2280 Breakout Board Evaluation Kit!

d1n4001

Abstract: CY7C68013A-QFN56 LCMXO2280T144 LCMXO2280C-4TN144C wishbone CY7C68 Mini Project Temperature Sensor vhdl mini projects wishbone rev. b verilog code for I2C WISHBONE INTERFACE
Contextual Info:  MachXO Mini Development Kit User’s Guide August 2011 Revision: EB41_01.1  MachXO Mini Development Kit User’s Guide Lattice Semiconductor Introduction Thank you for choosing the Lattice Semiconductor MachXO Mini Development Kit! This user’s guide describes how to start using the MachXO Mini Development Kit, an easy-to-use platform for evaluating and designing with MachXO PLDs. Along with the evaluation board and accessories, this kit includes a preloaded Mini System-on-Chip SoC demonstration design based on the LatticeMico8™ microcontroller.

2062 USB

Abstract: BK2125HS101 BAT760 C8051F326 L296 QFN-28
Contextual Info: National Semiconductor Application Note 2062 Anssi Raisanen August 6, 2010 General Description device. The evaluation board has a microcontroller that acts as an USB to I2C interface. Microcontroller is also used to manipulate the digital control signals of the LM3549. LM3549

Contextual Info: PBffl gec plessey CT3201-1.3 THIN AND THICK FILM HYBRID CIRCUITS Hybrid circuit technology is the basis upon which the final performance of any microwave component depends. Thechoice of substrata material is critical and can be alumina, glass ceramic, or quartz based. The interconnect technology is either

Contextual Info: LatticeECP3 Family Handbook HB1009 Version 04.9, August 2012 LatticeECP3 Family Handbook Table of Contents August 2012 Section I. LatticeECP3 Family Data Sheet Introduction Features . 1-1

Contextual Info: MwT-101 2-8 GHz MMIC AMPLIFIER CHIP 1 Al MICROWAVE TECHNOLOGY 4268 Solar W ay Fremont, CA 94538 510-651-6700 FAX 510-651-2208 • 30 dB TYPICAL REVERSE ISOLATION • ¿0.6 dB TYPICAL OUTPUT POWER FLATNESS • 3 mA/dB TYPICAL GAIN EFFICIENCY • -16 dBc TYPICAL SECOND HARMONICS AT Psat

LCMXO2-1200HC-4TG100C

Abstract: RD1046 I2C WISHBONE INTERFACE LCMXO2-1200HC-4TG100 LFXP2-5E-5M132C 8H90 format for design and implementation of microcontroller using vhdl vhdl i2c wishbone interface
Contextual Info: I2C Master with WISHBONE Bus Interface November 2010 Reference Design RD1046 Introduction The I2C Inter-IC Communication bus has become an industrial de-facto standard for short-distance communication among ICs since its introduction in the early 1980s. The I2C bus uses two bidirectional open-drain wires with

Contextual Info: LatticeECP3 Family Handbook HB1009 Version 05.2, May 2013 LatticeECP3 Family Handbook Table of Contents May 2013 Section I. LatticeECP3 Family Data Sheet Introduction Features . 1-1

Contextual Info: MwT-102 2-18 GHz MMIC AMPLIFIER CHIP MICROWAVE TECHNOLOGY 4268 Solar Way Fremont, CA 94538 510-651-6700 FAX 510-651-2208 • 25 dB TYPICAL REVERSE ISOLATION • ±0.75 dB TYPICAL OUTPUT POWER FLATNESS • 7.5 mA/dB TYPICAL GAIN EFFICIENCY • -16 dBe TYPICAL SECOND HARMONICS AT Psat

lattice ECP3 Pinouts files

Contextual Info: LatticeECP3 Family Handbook HB1009 Version 04.7, June 2012 LatticeECP3 Family Handbook Table of Contents June 2012 Section I. LatticeECP3 Family Data Sheet Introduction Features . 1-1

Contextual Info: LatticeECP3 Family Handbook HB1009 Version 04.2, February 2012 LatticeECP3 Family Handbook Table of Contents February 2012 Section I. LatticeECP3 Family Data Sheet Introduction Features . 1-1

bc577

Abstract: AGC OPA660 2N5460 simulation model ca3080 agc 2N5460 ca3080 1N4148 2N3904 AB-185 OPA621
Contextual Info: APPLICATION BULLETIN Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: 602 746-1111 • Twx: 910-952-111 • Telex: 066-6491 • FAX (602) 889-1510 • Immediate Product Info: (800) 548-6132

Contextual Info: MwT-101 2-8 GHz MMIC AMPLIFIER CHIP MICROWAVE TECHNOLOGY 4268 Solar Way Fremont, CA 94538 510-651-6700 FAX 510-651-2208 30 dB TYPICAL REVERSE ISOLATION • 40.6 dB TYPICAL OUTPUT POWER FLATNESS • 3 mA/dB TYPICAL GAIN EFFICIENCY • -16 dBc TYPICAL SECOND HARMONICS AT Psat

An8077

Abstract: LFE3-70E-7FN672C LFSC3GA25E d2009 LFE3-17 LFE2M-20E6F484C RTL code tsmac 89 8937 000 LFE3-70 ECP3 versa layout
Contextual Info: PCI Express 1.1 x1, x4 Endpoint IP Core User’s Guide September 2010 IPUG75_01.7 Table of Contents Chapter 1. Introduction . 6 Quick Facts . 7

Contextual Info: bbE D MI CR O W A V E T E C H N O L O G Y b l E U l G D DDDD3Dfl AMT IMRU V MwT-101 2-8 GHz MMIC AMPLIFIER CHIP MICROWAVE TECHNOLOGY 4268 Solar W ay Fremont, CA 94538 510-651-6700 FAX 510-651-2208 • 30 dB TYPICAL REVERSE ISOLATION • *0.6 dB TYPICAL OUTPUT POWER FLATNESS