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10131318-0811100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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59112-G38-08-112LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions. |
PDF
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54122-128081100LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch. |
PDF
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54112-408081150LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10131318-08111G0LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, GW Compatible Nylon66, Tray Packing. |
PDF
|
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