|
TLP5701
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), IOP=+/-0.6 A, 5000 Vrms, SO6L |
Datasheet
|
|
|
10135570-107500ULF
|
|
Amphenol Communications Solutions
|
ExaMEZZ® 56Gb/s High Speed Mezzanine 4-pair, 7 column, 7.5mm stacking height, 98contacts |
PDF
|
|
|
91570-102LF
|
|
Amphenol Communications Solutions
|
Metral® , Backplane Connectors, Power Pin Assembly. |
PDF
|
|
|
91570-115LF
|
|
Amphenol Communications Solutions
|
Metral® , Backplane Connectors, Power Pin Assembly. |
PDF
|
|
|
69057-012LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 4 Positions, 2.00mm (0.079in) Pitch.. |
PDF
|
|
