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39LC46B

Abstract: crc8 Application Note 27 pin configuration of d flip flip 7474 21140-AC 7474 d flip 7474 d-flip flop DC21041 28F020 74F153 74FCT823
Contextual Info: Using the Digital Semiconductor 21041 with Boot ROM, Serial ROM, and External Register: An Application Note Order Number: EC–QJLGB–TE This application note provides information necessary to implement connections between the Digital Semiconductor 21041 Ethernet LAN

39LC46B

Abstract: 28F020 74F153 74FCT823 93LC46B mbz1
Contextual Info: Using the Digital Semiconductor 21041 with Boot ROM, Serial ROM, and External Register: An Application Note Order Number: EC–QJLGB–TE This application note provides information necessary to implement connections between the Digital Semiconductor 21041 Ethernet LAN

Contextual Info: 1MBI30L060 Transistors N-Channel IGBT V BR CES (V)600 V(BR)GES (V)20 I(C) Max. (A)30 Absolute Max. Power Diss. (W)120 Minimum Operating Temp (øC) Maximum Operating Temp (øC)150õ Thermal Resistance Junc-Case1.0 Thermal Resistance Junc-Amb. g(fe) Min. (S) Trans. admitt.

Contextual Info: 1MBI75L060 Transistors N-Channel IGBT V BR CES (V)600 V(BR)GES (V)20 I(C) Max. (A)75 Absolute Max. Power Diss. (W)300 Minimum Operating Temp (øC) Maximum Operating Temp (øC)150õ Thermal Resistance Junc-Case.42 Thermal Resistance Junc-Amb. g(fe) Min. (S) Trans. admitt.

Contextual Info: 1MBI50L060 Transistors N-Channel IGBT V BR CES (V)600 V(BR)GES (V)20 I(C) Max. (A)50 Absolute Max. Power Diss. (W)200 Minimum Operating Temp (øC) Maximum Operating Temp (øC)150õ Thermal Resistance Junc-Case.63 Thermal Resistance Junc-Amb. g(fe) Min. (S) Trans. admitt.