DDR3 POWER CONTROLLER I2C Search Results

Contextual Info: 1 CONTENTS Chapter 1 SoCKit Development Kit. . . 4 1.1 Package Contents. 4

MSC8156

Abstract: DDR3 timing MSC8156 datasheet MT41J64M16BLA-15E MICRON ddr3 MT41J64M16 MT41J64M16 S25FL128P DDR3 layout 0x01801 RGMII MSC8156
Contextual Info: Freescale Semiconductor Technical Data Document Number: MSC8156MDDS Rev. 0, 01/2010 MSC8156 Mezzanine Detailed Design Specification 1 1.1 Overview Scope This document provides a detailed design description of the MSC8156 Mezzanine card. It also describes the architecture,

HPsLED

Contextual Info: DE1-SoC User Manual 1 www.terasic.com March 14, 2014 CONTENTS Chapter 1 DE1-SoC Development Kit . 4 1.1 Package Contents. 4

689-pin

Abstract: MPC8308 P1010 BSC9132
Contextual Info: PowerQUICC, QorIQ and QorIQ Qonverge Processors Eyebrow Innovation. Connectivity. Freedom. freescale.com PowerQUICC and QorIQ Processors Selector Guide Processor Selector Guide PowerQUICC II Part Number Speed MHz Ethernet E1/T1 E3/T3 UTOPIA Multi-Channel HDLC

mpc8314

Abstract: PSC9131RDB T4240 P1022DS JESD-207 P3041ds BSC9130 PPCEVAL-CDS-8548 MPC8572DS P2020AMC-SA
Contextual Info: Innovation. Connectivity. Freedom. PowerQUICC and QorIQ Processor Selector Guide PowerQUICC I Part Number MPC870 MPC875 MPC880 MPC885 Ethernet 2 x 10/100 Mbps 1 x 10, 2 x 10/100 Mbps 2 x 10, 2 x 10/100 Mbps 3 x 10, 2 x 10/100 Mbps E1/T1 1 2 2 UTOPIA Y Y Multi-Channel HDLC

Contextual Info: ong COM Express Basic Type 6 Module ate c.co m conga-TS77 Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type 6 Connector Layout CPU Intel® Core™ i7-3615QE (4x 2.3 GHz, 6MB Cache, TDP 45W) Intel® Core™ i7-3612QE (4x 2.1 GHz, 6MB Cache, TDP 35W)

ddr3 MTBF

Abstract: ddr3 RAM MTBF
Contextual Info: Toucan-AF Compact COM Express Type 6 Module with AMD® G-Series Processor Features Type 6 AMD® Fusion APU, single and dual core Up to 4 Gbyte DDR3 RAM Graphics: Radeon HD6250 LVDS, DDI Gigabit Ethernet, 8x USB 2.0 High Definition Audio 4x SATA port Fail-Safe BIOS

Contextual Info: QorIQ Qonverge Platform QorIQ Qonverge B4420QDS Application Development System For applications using the QorIQ Qonverge B4420 baseband SoC Overview The QorIQ Qonverge B4420QDS development system is a complete application development environment intended for engineers developing

P5040QDS-PA

Abstract: P5040 emmc 5.0 emmc spi 2x10GbE P50405021FS EMMC software EMMC HOST CONTROLLER Data Path Acceleration Architecture P-5040
Contextual Info: QorIQ Communications Platforms QorIQ P5040/P5021 Processors Overview The QorIQ P5 family delivers scalable 64-bit processing with single-, dual- and quad-core devices. With frequencies scaling up to 2.4 GHz, a tightly coupled cache hierarchy for low latency, and integrated hardware acceleration, the P5040 quadcore and P5021 (dual-core) devices are ideally suited for compute intensive, powerconscious control plane applications.

VSC8662

Abstract: VSC3316XJK
Contextual Info: QorIQ Qonverge Platform QorIQ Qonverge B4860QDS Application Development System For applications using the QorIQ Qonverge B4860 baseband SoC Overview running at 1.2 GHz, powerful baseband and transport accelerators and high-speed interfaces pertinent to the device high

netlogic tcam

Abstract: TCAM netlogic
Contextual Info: ML631 Virtex-6 HXT FPGA Packet Processor/Traffic Manager Evaluation Board User Guide UG841 v1.0 March 9, 2012 Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum

Contextual Info: ate c.co m conga-BS67 High Performance COM Express Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2655LE, 2.20 GHz, (32 nm process, 4MB cache, 1333 MHz, TDP 25 W) Intel® Core™ i7-2610UE, 1.50 GHz, (32 nm process, 4MB cache, TDP 17 W)

Contextual Info: ww w .c ong ate High Performance COM Express c.co m Dramatically Increased Graphics Performance Formfactor Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-2710QE (SV), 2,1 GHz (32 nm process, 6MB cache, 1333 MHz, TDP 45 W, 989 rPGA package)

spi sata controller

Abstract: MVME7216E-101 MVME2502-02120201E MVME5110 scanbe MVME2500 MVME721ET-101 RS-232 to usb circuit diagram freescale p2020 boot software SDhc socket
Contextual Info: MVME2500 Series VME64 Processor Board QorIQ processor based board provides high performance at a low power envelope nn 800 MHz or 1.2G Hz Freescale QorIQ P2010 and P2020 processors nn 1GB or 2GB DDR3-800, soldered down nn Three on-board Gigabit Ethernet interfaces one front,

SM3252

Abstract: sm325 1000BASE-BX PEX8617 intel i7 processor mtbf VPX redi LPC uart block diagram for Intel PCIe SSD SLT3-PAY-2F2U-14 SLT3-PAY-1F1F2U-14
Contextual Info: iVPX7223 Series 3U VITA 46 VPX & VITA 65 OpenVPX Processor Board Fully rugged 3U SBC for extreme environments nn 2nd generation Intel Core i7 2.20 GHz dual-core integrated processor nn Up to 8GB ECC-protected DDR3-1333, soldered down nn Intel® QM67 platform controller hub PCH

BD82HM55

Contextual Info: COM Express Basic Module c.co m conga-BM57 Maximum Computing Performance Formfactor COM Express Basic, 95 x 125 mm , Type II Connector Layout CPU Intel® Core™ i7-620M, 2.66 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 35 W, PGA package) Intel® Core™ i5-520M, 2.4 GHz (32 nm process, 3MB cache, 1066 MHz, TDP 35 W, PGA package)

it8718

Abstract: rtl8105 F81866D rtl8211cl F81866 fintek io controller intel hm65 PEX8606 intel i5 520M Motherboard intel hm55 express chipset
Contextual Info: Industrial Main Boards Modularize Whenever Possible Customize Whenever Necessary www.arbor.com.tw Contents ARBOR Takes the Why

ARMADA XP

Abstract: ARM v7 MV78460
Contextual Info: Marvell Quad-Core ARMADA XP Series SoC For Enterprise-Class Cloud Computing Applications PRODUCT OVERVIEW The Marvell ARMADA XP Extreme Performance series of multicore processors is the industry’s first quad-core ARM processor designed for enterprise-class cloud computing applications. The Marvell ARMADA XP employs a

Contextual Info: TR4 User Manual 1 www.terasic.com March 18, 2014 CONTENTS CHAPTER 1 OVERVIEW . 1 1.1 GENERAL DESCRIPTION . 1

BDI3000

Abstract: DDR3 memory MPC8572E TRACE32 TRACE32 Lauterbach PME 400 green hills integrity green hills probe E500 controller
Contextual Info: Integrated Communications Processors MPC8572E PowerQUICC III Processor Evolutionary and Revolutionary header inspections, a pattern-matching engine network processors and/or ASICs in the Freescale’s next-generation PowerQUICC® III PME to handle regular expression matching, a

Contextual Info: ong COM Express Type6 Module ate c.co m conga-TFS COM Express Basic, 95 x 125 mm , Type 6 Connector Layout CPU AMD Embedded R-Series processors AMD Embedded R-464L with AMD Radeon™ HD 7660G Graphics (Quad-Core 2.3/3.2 GHz / 35W / PGA) AMD Embedded R-460H with AMD Radeon™ HD 7640G Graphics (Quad-Core 1.9/2.8 GHz / 35W / PGA)

RTL8111

Abstract: Realtek RTL8111
Contextual Info: EmQ-v900 VIA Nano Qseven™ CPU Module Features • • • • • • Soldered Onboard VIA Nano™ U3500 Processor Integrated Gigabit Ethernet Soldered Onboard 1GB DDR3 SDRAM Support Single Channel 24-bit LVDS, DisplayPort RAID 0,1 Supported Extended Operating Temp.: -20 ~ 70°C

K4B510846E-ZC

Contextual Info: Preliminary Unbuffered DIMM DDR3 SDRAM DDR3 SDRAM Specification January 2007 revision 0.1 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

verilog code for max1619

Abstract: pci card schematic
Contextual Info: 1 CONTENTS 0H CHAPTER 1 1H 2H 3H 4H 6H 7H 8H 9H 50H 1.2 KEY FEATURES . 5 51H 1.3 BLOCK DIAGRAM . 6