DDR3 DIMM R Search Results

DDR3 DIMM

Abstract: 200Pos INNER CARTON LABEL
Contextual Info: 107-68838 Packaging Specification 29May09 Rev A DDR3 DIMM ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of DDR3 DIMM ASSY. 订定 DDR3 DIMM ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product

DDR3 DIMM 240 pinout

Abstract: DDR3 slot 240 pinout DDR3 DIMM pinout DDR3 DIMM footprint DDR3 DIMM DDR3 impedance N4834A eye-fi "Touch DISPLAY" A13-B13
Contextual Info: DDR3 DIMM Probing For Use With the 16900 Series Logic Analyzer Data Sheet Features Agilent offers a wide range of probing • Quick, easy connection between the DIMM connector and Agilent logic analyzers with the interposer or midbus probe solution for DDR3 DIMM measurement. • Compatible with all 240-pin DDR3 SDRAM DIMMs

Contextual Info: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3UL Description Placement The TS256MKR72V3UL is a 256M x 72bits DDR3-1333 VLP Registered DIMM. The TS256MKR72V3UL consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and

Contextual Info: 240PIN DDR3 1066 Registered DIMM TS1GKR72V1N 8GB With 256Mx8 CL7 Description Placement The TS1GKR72V1N is a 1G x 72bits DDR3-1066 Registered DIMM. The TS1GKR72V1N consists of 36pcs 256Mx8bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3N 4GB With 256Mx8 CL9 Description Placement The TS512MKR72V3N is a 512M x 72bits DDR3-1333 Registered DIMM. The TS512MKR72V3N consists of 18pcs 256Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS1GKR72V3Y 8GB With 512Mx4 CL9 Description Placement The TS1GKR72V3Y is a 1024M x 72bits DDR3-1333 Registered DIMM. The TS1GKR72V3Y consists of 36pcs 512Mx4bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3U Description Placement The TS256MKR72V3U is a 256M x 72bits DDR3-1333 Registered DIMM. The TS256MKR72V3U consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3Y 1Rank 4GB With 512Mx4 CL9 Description Placement The TS512MKR72V3Y is a 512M x 72bits DDR3-1333 1Rank Registered DIMM. The TS512MKR72V3Y consists of 18pcs 512Mx4bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 176 ball TFBGA package and

Contextual Info: 240PIN DDR3 1333 Registered DIMM 1024MB With 128Mx8 CL9 TS128MKR72V3U Description Placement The TS128MKR72V3U is a 128M x 72bits DDR3-1333 Registered DIMM. The TS128MKR72V3U consists of 9pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3T 4GB With 256Mx4 CL9 Description Placement The TS512MKR72V3T is a 512M x 72bits DDR3-1333 Registered DIMM. The TS512MKR72V3T consists of 36pcs 256Mx4bits DDR3 SDRAM in FBGA package, 1 pcs register in 177 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1066 Registered DIMM TS512MKR72V1U 4GB With 128Mx8 CL7 Description Placement The TS512MKR72V1U is a 512M x 72bits DDR3-1066 Registered DIMM. The TS512MKR72V1U consists of 36pcs 128Mx8bits DDR3 SDRAM in FBGA package, 1 pcs register in 177 ball TFBGA package and a 2048 bits

TS256MKR72V3N

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS256MKR72V3N 2048MB With 256Mx8 CL9 Description Placement The TS256MKR72V3N is a 256M x 72bits DDR3-1333 Registered DIMM. The TS256MKR72V3N consists of 9pcs 256Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 176 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS1GKR72V3N 8GB With 256Mx8 CL9 Description Placement The TS1GKR72V3N is a 1G x 72bits DDR3-1333 Registered DIMM. The TS1GKR72V3N consists of 36pcs 256Mx8bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits

DDR3 DIMM 240 pinout

Contextual Info: M2Y2G64CB8HC5N / M2Y2G64CB8HC9N 2GB: 256M x 64 Unbuffered DDR3 SDRAM DIMM 240pin Unbuffered DDR3 SDRAM MODULE Based on 128Mx8 DDR3 SDRAM C Die Features • Performance: Speed Sort DIMM  Latency fCK Clock Frequency PC3-8500 PC3-10600 -BE -CG 7 9 533

TS256MSK64V1N

Contextual Info: 204PIN DDR3 1066 SO-DIMM TS256MSK64V1N 2048MB With 256Mx8 CL7 Description Placement The TS256MSK64V1N is a 256M x 64bits DDR3-1066 SO-DIMM. The TS256MSK64V1N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 204PIN DDR3 1333 SO-DIMM 4096MB With 256Mx8 CL9 TS512MSK64V3N Description Placement The TS512MSK64V3N is a 512M x 64bits DDR3-1333 SO-DIMM. The TS512MSK64V3N consists of 16pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 204PIN DDR3 1333 SO-DIMM TS256MSK64V3N 2048MB With 256Mx8 CL9 Description Placement The TS256MSK64V3N is a 256M x 64bits DDR3-1333 SO-DIMM. The TS256MSK64V3N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: Product Specifications PART NO.: VL53B2863A-K9/F8/E7S REV: 1.0 General Information 1GB 128Mx72 DDR3 SDRAM ECC REGISTERED Mini-DIMM 244-PIN Description The VL53B2863A is a 128Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module is single rank, consists

Contextual Info: 240PIN DDR3 1333 Unbuffered DIMM TS512MLK64V3N 4GB With 256Mx8 CL9 Description Placement The TS512MLK64V3N is a 512M x 64bits DDR3-1333 Unbuffered DIMM. The TS512MLK64V3N consists of 16pcs 256Mx8 bits DDR3 SDRAMs in 68 ball FBGA packages and a 2048 bits serial EEPROM on a 240-pin

Contextual Info: 240PIN DDR3 1333 Unbuffered DIMM 2GB With 128Mx8 CL9 TS256MLK64V3U Description Placement The TS256MLK64V3U is a 256M x 64bits DDR3-1333 Unbuffered DIMM. The TS256MLK64V3U consists of 16pcs 128Mx8 bits DDR3 SDRAMs in 68 ball FBGA packages and a 2048 bits serial EEPROM on a 240-pin

Contextual Info: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

Contextual Info: Product Specifications PART NO.: VL51B5263A-K9M REV: 1.1 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module is dual rank, consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in

Contextual Info: Product Specifications PART NO.: VL51B2863A-F8M REV: 1.1 General Information 1GB 128Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B2863A is a 128Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module is single rank, consists of nine CMOS 128Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an

M393B5673DZ1-C

Abstract: M393B5170
Contextual Info: Registered DIMM DDR3 SDRAM DDR3 SDRAM Specification 240pin Registered DIMM based on 1Gb D-die 72-bit ECC 82FBGA with Lead-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.