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30A10 Abstract: H1163 Contextual Info: DENSE-PAC 8 Megabit CMOS DRAM MICROSYSTEMS DPD512X16M2H3 PRELIMINARY D E S C R IP T IO N : The D PD 5 1 2X16M2H3 "S T A C K " module is a re vo lu tio n ary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for surface	OCR Scan	DPD512X16M2H3 DPD51 100ns 40-PiN 3QA108-13 DDD13S4 30A10 H1163	PDF

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30A10

Abstract: H1163
Contextual Info: DENSE-PAC 8 Megabit CMOS DRAM MICROSYSTEMS DPD512X16M2H3 PRELIMINARY D E S C R IP T IO N : The D PD 5 1 2X16M2H3 "S T A C K " module is a re vo lu tio n ary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for surface

OCR Scan

DPD512X16M2H3 DPD51 100ns 40-PiN 3QA108-13 DDD13S4 30A10 H1163

PDF