DATE CODE MURATA Search Results
DATE CODE MURATA Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 5446/BEA | Rochester Electronics LLC | 5446 - Decoder, BCD-To-7-Segment, With Open-Collector Outputs - Dual marked (M38510/01006BEA) |
|
||
| 54LS190/BEA | Rochester Electronics LLC | 54LS190 - BCD Counter, 4-Bit Synchronous Up/Down, With Mode Control - Dual marked (M38510/31513BEA) |
|
||
| TC4511BP | Toshiba Electronic Devices & Storage Corporation | CMOS Logic IC, BCD-to-7-Segment Decoder, DIP16 | Datasheet | ||
| 68305-001LF | Amphenol Communications Solutions | Din Accessory Coding | |||
| 65197-001LF | Amphenol Communications Solutions | Din Accessory Coding Part |
DATE CODE MURATA Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
schematic msp430 cc2560
Abstract: Bluetooth Module CC2560 CC2560 PAN1325 ENW89818C2JF MSP430 MSP-EXP430F5438 PAN1315 2450AT43B100 CC256
|
Original |
pan1315enw89818c2jfds-1315-2400-102schematic msp430 cc2560+7 | |
panasonic dimension 74 television
Abstract: 3DH5 CC2560 command schematic msp430 cc2560 Example code for touch pad interface using msp430 hy 214
|
Original |
pan1315enw89818c2jfds-1315-2400-102mays-1315-2400-102+6 | |
CC2560 command
Abstract: schematic msp430 cc2560 hy 214 digital meter PAN1315ETU PAN13XX CC2560
|
Original |
pan1315enw89818c2jfds-1315-2400-102667-enw-89818c2jf+7 | |
Manufacturer Panasonic Industrial Devices Europe GmbH Hardware
Abstract: PAN1720 panasonic marking lot date code panasonic
|
Original |
enw89820axkfenw89835axkfpan172xpan1721+5 | |
216Q-1315
Abstract: PAN132X
|
Original |
pan13xxds-13xx-2400-102b019784th00-102+2 | |
Panasonic ic "18-pin"
Abstract: panasonic marking Manufacturer Panasonic Industrial Devices Europe GmbH Hardware
|
Original |
enw89837a3kfpan1026ds-1026-2400-102recommendat-102+3 | |
PAN1323
Abstract: PAN1326 PAN1325A soil moisture sensor circuit diagram PAN132X panasonic date code CC2567 PAN13XX MSP-EXP430F5438 PAN1315A
|
Original |
ds-13xx-2400-102pan13xxb019784pan1323+8 | |
PAN1325AContextual Info: CLASSIFICATION PRODUCT SPECIFICATION SUBJECT CLASS 1 or 2 BLUETOOTH MODULE CUSTOMER’S CODE PAN13XX Core Specification PANASONIC’S CODE See Chapter 28. Ordering Information No. DS-13xx-2400-102 REV. 3.70 PAGE 1 of 60 DATE 31.05.2013 Specification for Production |
Original |
pan13xxds-13xx-2400-102b019784pan1325a | |
PAN1323
Abstract: PAN1325A panasonic dimension 74 television LDA212G3110K CC2560 command Example code for touch pad interface using msp430 lot date code panasonic chip resistor ENW89828A2JF PAN1323ETU PAN1316
|
Original |
ds-13xx-2400-102pan13xxpan1323pan1325a+8 | |
|
Contextual Info: SIP RESISTOR NETWORKS 1 RSL H = .200 Vsw RSCH = .256’/.w RSHH = .355'/*w MARKING: Pin 1 Location No. of Pins No. of Resistors Circuit Type Res. Value Code Tolerance Date Code Yr, Wk X-CIRCUIT— PARALLEL Y -C IR C U IT- DISCRETE pAAAn R 13 Elements Max. |
OCR Scan |
||
GRM1555C1H101JZ01B
Abstract: GRM1555C1H101JZ01D GRM1555C1H101JZ01J
|
Original |
grm1555c1h101jz01grm1555c1h101jz01dgrm1555c1h101jz01jgrm1555c1h101jz01c+3 | |
|
Contextual Info: GRM1555C1HR10BZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1555C1HR10BZ01D , GRM1555C1HR10BZ01J , GRM1555C1HR10BZ01C , GRM1555C1HR10BZ01B |
Original |
grm1555c1hr10bz01grm1555c1hr10bz01dgrm1555c1hr10bz01jgrm1555c1hr10bz01c+4 | |
88910-5204m
Abstract: ISL6251 AU-6433 AU6433B52-GBL-GR LTT-SS801U-13 AM4825P LG-2413S-2 apl3510a CN901 CN602
|
Original |
bap41/bxp41d-cs-1310a2271201-algcn3026012b0073301+15 | |
|
Contextual Info: GRM1885C1H1R5CZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1885C1H1R5CZ01D , GRM1885C1H1R5CZ01J Shape References Packaging L size 1.6 ±0.1mm |
Original |
grm1885c1h1r5cz01grm1885c1h1r5cz01dgrm1885c1h1r5cz01j330mm+3 | |
|
|
|||
|
Contextual Info: GRM1885C1H8R2DZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1885C1H8R2DZ01D , GRM1885C1H8R2DZ01J Shape References Packaging L size 1.6 ±0.1mm |
Original |
grm1885c1h8r2dz01grm1885c1h8r2dz01dgrm1885c1h8r2dz01j330mm+3 | |
|
Contextual Info: GRM1885C1H2R7CZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1885C1H2R7CZ01D , GRM1885C1H2R7CZ01J Shape References Packaging L size 1.6 ±0.1mm |
Original |
grm1885c1h2r7cz01grm1885c1h2r7cz01dgrm1885c1h2r7cz01j330mm+3 | |
|
Contextual Info: GRM1885C1H3R3CZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1885C1H3R3CZ01D , GRM1885C1H3R3CZ01J Shape References Packaging L size 1.6 ±0.1mm |
Original |
grm1885c1h3r3cz01grm1885c1h3r3cz01dgrm1885c1h3r3cz01j330mm+3 | |
|
Contextual Info: GRM1885C1H2R2CZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1885C1H2R2CZ01D , GRM1885C1H2R2CZ01J Shape References Packaging L size 1.6 ±0.1mm |
Original |
grm1885c1h2r2cz01grm1885c1h2r2cz01dgrm1885c1h2r2cz01j330mm+3 | |
|
Contextual Info: GRM1885C1H8R2BZ01# Deadline for last orders: 30 Sep 2013 # indicates a package specification code. Date of discontinuation: 31 Mar 2014 < List of part numbers with package codes > GRM1885C1H8R2BZ01D , GRM1885C1H8R2BZ01J Shape References Packaging L size 1.6 ±0.1mm |
Original |
grm1885c1h8r2bz01grm1885c1h8r2bz01dgrm1885c1h8r2bz01j330mm+3 | |
AU-6433
Abstract: ISL6251 AU6433-B52-GBL-GR am4825p CN603 CN701 d8107 1000-F50E-02R fdmc4435bz s104 85a
|
Original |
bap51/bap52d-cs-1310a2271201-algcn702clk32+14 | |
LBMA1BGUG2-TEMPContextual Info: Bluetooth TM HCI module Data Sheet Texas Instruments Chipset for Bluetooth 4.0 + FM Tx/Rx Tentative P/N : LBMA1BGUG2-TEMP Preliminary Specification Number: SP-BGUG P. 1 / 23 The revision history of the product specification Issued Date Revision Code 2012/Oct/16 |
Original |
2012/oct/16lbma1bgug2-temp | |
WL1271
Abstract: WL1271L TI WL1271L wl1271 application note Wl1271 specification Wl1271 WLAN specification 772C-LBTN TI 1271 fm wlan wl1271 PCM LBEE5ZSTNC-523
|
Original |
11b/g/nlbee5zstnc-52321augwl1271+8 | |
LBMA1BGUG2-TEMPContextual Info: Bluetooth TM HCI module Data Sheet Texas Instruments Chipset for Bluetooth 4.0 + FM Tx/Rx Tentative P/N : LBMA1BGUG2-TEMP Preliminary Specification Number: SP-BGUG P. 1 / 23 The revision history of the product specification Issued Date Revision Code 2012/Oct/16 |
Original |
2012/oct/16lbma1bgug2-temp | |
wl1271Contextual Info: Preliminary Specification Number: SP-ZSTN-C P. 1/34 W-LAN + Bluetooth Combo Module Data Sheet 802.11b/g/n and Bluetooth v4.0 module Product Part Number: LBEE5ZSTNC-523 Preliminary Specification Number: SP-ZSTN-C P. 2/34 Revision History Revision Code Date |
Original |
11b/g/nlbee5zstnc-52321augwl1271 | |