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    DAEWON TRAY 10 X 9 Search Results

    DAEWON TRAY 10 X 9 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10067847-001TLF
    		Amphenol Communications Solutions 10067847-001TLF-SD CARD TRAY PACKAGING PDF
    U77A11282021
    		Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY PDF
    U77A11282001
    		Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY PDF
    U77A11181001
    		Amphenol Communications Solutions SFP CAGE 1X1 TIN TRAY PDF
    U77A61042001
    		Amphenol Communications Solutions SFP 1X6 CAGE NI TRAY PDF

    DAEWON TRAY 10 X 9 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    daewon

    Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1


    Original     		26048i 3412-2a 26396f FBD63 12F-0814-D19 3412-2b daewon TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19 PDF

    daewon

    Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"


    Original     		3472b 26946h f27839b-opt2 daewon 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11 PDF

    12B-0608-F19

    Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
    Contextual Info: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X


    Original     		0X45M 3466b 26022i 12B-0608-F19 DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A PDF

    DAEWON tray drawing

    Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
    Contextual Info: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN


    OCR Scan     		12C-0707 JCL-0707-1 DAEWON tray drawing daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA PDF

    daewon

    Abstract: DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLB 044, VDA 044, VDD 044, NLB 056, NSB 056 3416 \ f27328a \ 12-13-07 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 17 Oct 2008 5-63


    Original     		f27328a f29719a f29858a daewon DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO PDF

    daewon

    Abstract: FMC 150 DAEWON FBGA daewon tray FBGA 12 x 12 14B-0912-119 daewon* fbga TSG103 FBGA 137 tld084
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: TLD 064, FEA 084, FED 084, FMC 084, TLD 084, TSD 084, FWA 084, FMC 107, FMC 115, FOA 115, FWA 115, FEA 137, FMC 137, FTF 137, TLD 137, TSD 137 322.6 315.0 * 2.54 R. 4 PLACES 5.62 * X SEE DETAIL "D" VACUUM PICKUP CELLS


    Original     		31ext 28391a 28806a daewon FMC 150 DAEWON FBGA daewon tray FBGA 12 x 12 14B-0912-119 daewon* fbga TSG103 FBGA 137 tld084 PDF

    DAEWON JEDEC TRAY 10 X 10

    Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
    Contextual Info: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*


    OCR Scan     		30\MH 0X45\M DAEWON JEDEC TRAY 10 X 10 DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10 PDF

    daewon

    Abstract: DAEWON FBGA LAA064 FBGA 137 DAEWON LAA
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: LAA 064, LSA 064, LSE 064, LAA 080, LSB 080, MMB 112, FTM 115, FTM 137, FVE 137, FWC 137, FWD 137 3694 \ f27326 \ 5.21.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook


    Original     		f27326 3474b 27327d daewon DAEWON FBGA LAA064 FBGA 137 DAEWON LAA PDF

    daewon

    Abstract: DAEWON tray 48 3471A daewon tray DAEWON FBGA
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLA 048, NSA 048, VDC 048, NLA 060, MTA 133, NLC 133 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 10 PLACES BUMPS 8 PLACES Y (2 CENTER CELLS, 8 SIDE CELLS) 6.35 * SEE DETAIL "D" X 7.62 Z SEE DETAIL "E"


    Original     		29718b 29716a daewon DAEWON tray 48 3471A daewon tray DAEWON FBGA PDF

    daewon

    Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044


    Original     		f28384b VDJ044 28805c 3477b 27776c daewon VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA PDF

    3469b

    Abstract: daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU
    Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048 3535 \ 28809b \ 1.5.5 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-35 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048


    Original     		28809b 3469b 26637c daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU PDF

    KS-886H

    Abstract: Kostat tray
    Contextual Info: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		AN-657-1 KS-886H Kostat tray PDF

    DAEWON JEDEC TRAY 10 X 10

    Abstract: DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing JEDEC TRAY 10 X 10
    Contextual Info: 12_I_ U _ I_ 10_ I_ 9_ I_ 8_ I_ 7_ I_ 6_ I_ 5_ I_ 4_ I_ 3_ I_ 2_ I_ 1


    OCR Scan     		0X45NM JCL-0795-1 DAEWON JEDEC TRAY 10 X 10 DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing JEDEC TRAY 10 X 10 PDF

    DAEWON JEDEC TRAY 10 X 10

    Abstract: daewon MPSU 140 LEI-4 DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
    Contextual Info: <322.65 — 6.35 • 315.0 - VACUUM PICKUP CELLS 14 PLACES 12 CENTER CELLS, 2 SIDE CELI — 7.62 V BBUMPS l 7 PLACES = 1 E jE E T ilB D ii] mo.20(H iAiz(n>i - 311.15-+0.25 -0.13 - 132.08-+0.25 -0.13 Vj r a X H* Da +0.25 -0.13 - 132.59-M0.20(H)IAIZ<H>


    OCR Scan     		59----M0 0X45\M JCL-6575-0 DAEWON JEDEC TRAY 10 X 10 daewon MPSU 140 LEI-4 DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10 PDF

    IPC-J-STD-001

    Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
    Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures


    Original     		PDF

    Intel StrataFlash Memory j3

    Abstract: BGA 6x6 tray daewon 273416 Intel 80321
    Contextual Info: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface


    Original     		64-bit/66MHz --64-bit/133MHz 32-bit 64-bit --PC200 VCC33 Intel StrataFlash Memory j3 BGA 6x6 tray daewon 273416 Intel 80321 PDF