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LFB185G54CGLD602
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Murata Manufacturing Co Ltd
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Ceramic BPF, 1 Section(s) Min, 1 Section(s) Max, 5425MHz |
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10114830-10107LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 7 Positions |
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55500-107LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Stacking Header,Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.. |
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10131930-107ULF
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Amphenol Communications Solutions
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Minitek®, Board to Board, Receptacle, Through Mount, Single row, 7 Positions, 2mm (0.079inch), horizontal. |
PDF
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77311-801-07LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 07 Positions, 2.54 mm Pitch. |
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