D150 TRANSISTOR Search Results

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

53-78-1

Abstract: E58126 53-03-2AC 5300-6.000 D257 D149 D150 5300 1.500 astm D150 53-77-4
Contextual Info: Standard Products - Insulators Home | Contact Us | About Aavid | Sales Rep Log In -Useful Links- Search by part # Thermalsil III RoHS Compliant Thermally Conductive Silicone Rubber Insulators Check distributor part inventory Browse Heat sinks - By Device -

53-02-103G

Contextual Info: Hom e | Conta ct Us | About Aavid | Sale s R e p Log In Chinese -Useful Links- 6 Thermalsil III Search by part # RoHS Compliant Thermally Conductive Silicone Rubber Insulators Check distributor part inventory The newest Thermalsil™ III formula has improved thermal conductivity, providing

D149

Abstract: D150 D257
Contextual Info: Standard Products - Insulators Home | Contact Us | About Aavid -Useful Links- Search by part # Thermalsil III RoHS Compliant Check distributor part inventory Browse Heat sinks - By Device - By Product Line -Attachment Methods- Thermally Conductive Silicone Rubber

E58126

Abstract: 53-03-2AC 53-77-9g 53-77-4g
Contextual Info: Thermalsil III - heatsink interface material Page 1 of 4 Tel toll-free : +1-855-32-AAVID Register Log in Search Home Products Interface Materials Solutions Aavid Design Tools & Docs Contact Company Thermalsil III Online Store Check Stock Enter a part number for

MIL-C-47113

Abstract: SUPPRESSANT, FIRE LOW PH LIQUID, SAFETY FIRST ASTM D5470 NTE424 fan 6224 hr flyback tv transformer Ignition Transformer 400F D150 D257
Contextual Info: NTE424 Non−Silicone Thermal Compound 1 oz. Plunger Tube Description: NTE424 heat sink compound is a grease−like, non−silicone, non−migrating material heavily impregnated with heat−conductive metal oxides. This formulation provides high thermal conductivity, low bleed and

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

9502s

Abstract: 10H350 ria 15 IR 9501
Contextual Info: Video-Speed „ Shift Register or, R' s, J um Features/ Benefits • 250 MHz serial data rate 679501 679502 ? ? ;/ > '> Ordering Information PART NUMBER PACKAGE TEMP. DESCRIPTION 679501 24 JS Com S ingle-supply 679502 24JS Com Dual-supply • TTL-compatible parallel input data and control

D150 transistor

Abstract: E59150 D149 D150 D2240 D257 D374 QPAD
Contextual Info: Q-Pad 3 Easy to Handle, Greaseless Thermal Interface Features and Benefits • Thermal impedance 2 0.35°C-in /W @50 psi Typical Properties of Q-Pad 3 Property Imperial Value Metric Value Test Method Black Black Visual Color Reinforcement Carrier Fiberglass

bergquist

Contextual Info: Q-Pad II Foil-Format Grease Replacement for Maximum Heat Transfer Features and Benefits TYPICAL PROPERTIES OF Q-PAD II PROPERTY Color • Thermal impedance: 0.22°C-in2/W @50 psi • Maximum heat transfer • Aluminum foil coated both sides • Designed to replace thermal grease

PIC16C66

Abstract: 200B D005 D150 DK-2750
Contextual Info: PIC16C66 PIC16C66 Rev. A Silicon Errata Sheet The PIC16C66 Rev. A parts you have received conform functionally to the Device Data Sheet (DS30234D), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C66 silicon.

Contextual Info: Q-Pad II Foil-Format Grease Replacement for Maximum Heat Transfer Features and Benefits T YPICAL PROPERT IES OF Q-PAD II PROPERTY Color • Thermal impedance: 0.22°C-in 2/W @50 psi • Maximum heat transfer • Aluminum foil coated both sides • Designed to replace thermal grease

D150 transistor

Abstract: 200B D005 D150 DK-2750 PIC16C67
Contextual Info: PIC16C67 PIC16C67 Rev. A Silicon Errata Sheet The PIC16C67 Rev. A parts you have received conform functionally to the Device Data Sheet (DS30234D), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C67 silicon.

Contextual Info: Q-Pad 3 Glass-Reinforced Grease Replacement Thermal Interface Features and Benefits T YPICAL PROPERT IES OF Q-PAD 3 PROPERTY Color • Thermal impedance: 0.35°C-in 2/W @50 psi • Eliminates processing constraints typically associated with grease • Conforms to surface textures

bergquist

Contextual Info: Sil-Pad A2000 Higher Performance, High Reliability Insulator Features and Benefits • Thermal impedance: 0.32°C-in2/W @50 psi • Optimal heat transfer • High thermal conductivity: 3.0 W/m-K TYPICAL PROPERTIES OF SIL-PAD A2000 PROPERTY Color IMPERIAL VALUE

bergquist

Abstract: D150 transistor D149 D150 D2240 D257 D374
Contextual Info: Q-Pad 3 Glass-Reinforced Grease Replacement Thermal Interface Features and Benefits • Thermal impedance: 0.35°C-in2/W @50 psi • Eliminates processing constraints typically associated with grease • Conforms to surface textures • Easy handling

PIC16C77

Abstract: 200B D005 D150 DK-2750
Contextual Info: PIC16C77 PIC16C77 Rev. A Silicon Errata Sheet The PIC16C77 Rev. A parts you have received conform functionally to the Device Data Sheet (DS30390E), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C77 silicon.

PIC16C76

Abstract: 200B D005 D150 DK-2750 TMR1H
Contextual Info: PIC16C76 PIC16C76 Rev. A Silicon Errata Sheet The PIC16C76 Rev. A parts you have received conform functionally to the Device Data Sheet (DS30390E), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C76 silicon.

6DI50MA-050

Abstract: TFR3M AR4J
Contextual Info: D 6 I 5 M A - 5 5 a : Outline Drawings POWER TRANSISTOR MODULE • 4M : Features • f f i A h FE High D C Current Gain • K S W / f H i g h Speed Sw itching : Applications • if L f f l'O '*— $ General Purpose Inverter • Uninterruptible Power Supply

200B

Abstract: D005 D150 DK-2750 PIC16C64A
Contextual Info: PIC16C64A PIC16C64A Rev. A Silicon Errata Sheet The PIC16C64A Rev. A parts you have received conform functionally to the Device Data Sheet (DS30234D), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C64A silicon.

200B

Abstract: D005 D150 DK-2750 PIC16C65A D150 transistor
Contextual Info: PIC16C65A PIC16C65A Rev. A Silicon Errata Sheet The PIC16C65A Rev. A parts you have received conform functionally to the Device Data Sheet (DS30234D), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C65A silicon.

PIC16C63

Abstract: CCPR 200B D005 D150 DK-2750
Contextual Info: PIC16C63 PIC16C63 Rev. A Silicon Errata Sheet The PIC16C63 Rev. A parts you have received conform functionally to the Device Data Sheet (DS30234D), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C63 silicon.

200B

Abstract: D005 D150 DK-2750 PIC16C62A
Contextual Info: PIC16C62A PIC16C62A Rev. A Silicon Errata Sheet The PIC16C62A Rev. A parts you have received conform functionally to the Device Data Sheet (DS30234D), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C62A silicon.

PIC16C73A

Abstract: 200B D005 D150 DK-2750
Contextual Info: PIC16C73A PIC16C73A Rev. A Silicon Errata Sheet The PIC16C73A Rev. A parts you have received conform functionally to the Device Data Sheet (DS30390E), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16C73A silicon.