D*M STANDARD DENSITY Search Results

Contextual Info: Micro D Plastic Shell - .050" Contact Spacing M D *B-P C B M D *B -PC B connectors use standard M D *B all plas­ tic shells and are designed for use w ith flex circuitry, printed circuit and m ulti-layer boards. They are easily mounted and soldered and provide

GG1Q

Abstract: GG1Q171
Contextual Info: INTEGRATE» DEVICE m 47E D Mâ2S7?l GG1Q171 b • IDT IDT7M4068 IDT7MB40G8 256K x 8 BiCMOS/CMOS STATIC RAM MODULE Integrated D evice T ech no logy, Inc. FEATURES: DESCRIPTION: • High density 2 megabit C M O S static RAM module • Equivalent to the JE D E C standard for future monolithic

Contextual Info: IBM11M16730B IBM11M16730C 16M x 72 DRAM MODULE Features • 16 8 Pin J E D E C Standard, 8 Byte D ual In-line M em ory M odule • 1 6 M x 7 2 Fast P age M ode D IM M s • Perform ance: • S ystem P erform ance B enefits: - Buffered inputs except R A S , D ata

Contextual Info: High Density D D *M A Crimp Printed Circuit See page 342 (See page 343) Performance and Material Specifications MATERIALS AND FINISHES Standard Military Material Shell Finish Steel per A ST M A -6 20 1 ^ Insulator Yellow chromate over cadmium QQ -P-416 Type II Class 2

SJ 38

Contextual Info: ADVANCE M IC R O N 2 MEG X M T4LD232 X (S) 32 D R A M M O D U LE 2 MEG x 32 _ _ _ _ _ _ _ _ 8 MEGABYTE, 3.3V, OPTIONAL SELF M m o d e ESH’ O D U L E FAST PAGE ° R ED° PAGE FEATURES PIN A SSIG N M E N T (Front View) • JEDEC-standard pinout in a 72-pin single-in-line

Contextual Info: H igh D ensity D D*M A Crimp P rinted Circuit See page 342 (See page 343) Performance and M aterial Specifications MATERIALS AND FINISHES Standard Military M aterial Shell Finish Steel per A S T M A -6 2 0 1 ^ Insulator Yellow chromate over cadmium Q Q -P-416 Type II Class 2

5145154-4

Contextual Info: tifca M em ory & Socket Products M em ory / D IM M Sockets Electronics Standard Edge .0 5 0 Series PCI Connectors • High density .0 5 0 1.27m m centreline contact spacing ■ Easy m ating of high circuit count daughter boards ■ Polarising w eb for positive board-to-connector registration

Contextual Info: STANDARD MICROSYSTEMS bSE D STANDARD MICROSYSTEMS CORPORATION, COMPONENT PRODUCTS DIVISION 05b4bfib □ □ Ü 7 Ô D 3 5 4 3 « S M C FDC37C665 FDC37C666 80 Arkay Drive. Hauppauge, n y 11788 516 435 6000 Fax (516) 231 -6004 Advanced High-Performance Multi-Mode

trw 8040

Contextual Info: IBM11M16735B IBM11M16735C 16M x 72 DRAM MODULE Features • 168 Pin JE D E C Standard, 8 Byte Dual In-line M em ory M odule • O ptim ized for ECC applications • 16M x72 Extended Data O ut EDO M ode D IM M s • System Perform ance Benefits: - Buffered inputs (except RAS, Data)

Contextual Info: D-Subminiatrure Connectors 240-066 D-Subminiature Connector, Right Angle Mount EMI Filtered MIL-DTL-24308 Type Footprint Type M = Mil-Spec E = European (See Table V) MIL-C-2483 Type Contact Density S = Standard H = High Filter Connector Product Code 240 - 066

Contextual Info: J A E ELECTRONICS INC bBC D • 4flc]34hS 000Q[]75~1 M ICROMINIATURE, DOUBLE DENSITY D TYPE RECTANGULAR CONNECTOR- D02 SERIES Dimensions are in inches Millimeters are in parentheses 63C 00075 489 346 5 J A E'ELECTRONICS INC D^y-7^5 STANDARD SHELL Af - s

Contextual Info: IBM11M8735C IBM11M8735CB 8 M x 72 D R A M M O D U L E Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module -Buffered inputs except RAS, Data • 8Mx72 Dual Bank Extended Data Out Mode DIMM -Reduced noise (32 VSsA /cc P^s) • Performance:

Contextual Info: IN S ID E A M D ’S C M O S EPROM TECHNOLOGY TECHNOLOGY DESCRIPTION A M D ’s C M O S EPRO M memories use standard C M O S periphery with an n-channel floating-gate memory array. The output buffers of the devices are designed to be compatible with both TTL and C M O S circuits. An n-channel pull-down and a p-channel

DDMA78P

Abstract: ddma78s chn 605 DD-78
Contextual Info: 1 *MA H ig h D ensity D C rim p P r i n t e d C irc u it See page 342) (See page 343) Perfo rm a n ce and M a te ria l S pecific a tio n s M A T E R IA L S A N D F IN IS H E S Standard M ilita ry M aterial Finish M aterial S h e lf S teel pe t A S T M A -6 2 0

Contextual Info: PRELIMINARY IDT7M4084 2M X 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • • • • High-density 16 m egabit 2M x 8 Static RAM module Equivalent to the JE D E C standard for future monolithic Fast access time: 55ns (m ax.)

Contextual Info: IB M 1 1 M 8 6 4 5 H 8M x 64 D RAM M O D U LE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • 8Mx64 Extended Data Out Mode DIMM • Optimized for ECC applications • System Performance Benefits: -Buffered inputs except RAS, Data

Contextual Info: A -it - * i i - os M M 1 0 SERIES CONNECTORS 1.27mm (.050" Pitch, DIMM Socket Connectors MM10 Series socket connectors are designed fo r use w ith JEDEC standard Dual In-Line M em ory M odules (D IM M ) equipped w ith an 8 Byte data bus. GENERAL SPECIFICATIONS

UA317

Abstract: Fairchild dtl catalog free transistor equivalent book 2sc lm741 MA339PC MA725HM MA7805KM UA759 gi 9640 diod MA4136PC
Contextual Info: $9.9! •— r c m m pq, F A IR C H IL D A S chlum berger C om pany Linear Data Book Linear Division Introduction The Linear Data Book includes the standard linear product line plus our new W inchester Disk Drive circuits and CLASIC standard cells. For ease o f reference linear

Contextual Info: IBM11M2730H 2M x 72 D R A M M O D U LE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • Au contacts • Optimized for ECC applications • 2Mx72 Fast Page Mode DIMM • System Performance Benefits: - Buffered inputs except RAS, Data

TPS 4339

Contextual Info: IB M 1 1 D 4 3 2 0 B IB M 1 1 D 8 3 2 0 B 4M/8M x 32 DRAM Module Features • 72-Pin JE D E C Standard Single-ln-Line Memory Module • Performance: ! -60 tRAC i RAS Access Tim e i 60ns • High Performance C M O S process • Single 5V, ± 0.5V Power Supply.

Contextual Info: DUAL PHOTOTRANSISTOR OPTOCOUPLER OPTOELECTRONICS MCT9001 PACKAGE DIMENSIONS D ESCRIPTIO N The MCT9001 is a tw o channel optocoupler in a standard, end stackable, 8 pin dual-in-line package, This part offers the same packing density as 4 pin optocouplers, while m inim izing co m ponent count and

EN4165

Abstract: EN 4165 connector EN 4165 HE513
Contextual Info: “ S I M ” R ectangular C o n necto rs M etallic a n d / or C o m p o s i t e • STANDARD UTE C 93425 Model HE 513 - Pr EN 4165 ■ Sealing of module is assured by a patented overm oulded grommet. ■ High density of interconnections and several layouts.

g51a

Abstract: 1024X4
Contextual Info: HITACHI/ LOGIC/ARRAYS/HEfl SIE Lm i b E G 3 D D D IT BT I bll • H I T E HITACHI D G51A 1.0|xm Standard Cell Quick Reference Guide D IE/P LA STIC PACKAGE A VAILABILITY P A C K A G E TYPE D IP Body Size 3HJ 28mm P IN COUNTS 1 2m m 1 2mm 1 4m m » 28 2.9mm

Contextual Info: MOSEL VITELIC V 4 3642 R 02V T G 3 .3 VO LT 2 M x 6 4 H IG H P E R F O R M A N C E U N B U F F E R E D D IM M S D R A M M O D U L E P R E L IM IN A R Y Features Description • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line SDRAM Module ■ 2 banks 2M x 64 bit organization