D*M STANDARD DENSITY Search Results

Contextual Info: Standard-D How to Order D B M E 25 P V K87 Series D - D-Sub Shell Size Fits Contacts Shell Size Standard 20 High Density (22) E A B C D 9 15 25 37 50 15 26 44 62 78 Class Omit M MM MA MAM C U - Original D* Series - one piece insulator - solder - One piece insulator - commercial - solder

DDM78P

Abstract: 6111 subminiature DD-78 5532 dd 2079152 CIET-22D 030-2042-000
Contextual Info: H igh Density D How to Order — D *M A Crim p Connectors Receptacles Includes Socket Contacts With .120' Through-Mounting Holes Number of Contacts Standard (Shell Size) Version 78 (D) D D M A 78 S - D D M A M 7 8S Plugs (Includes Pin Contacts)* With .120" Through Mounting Holes

gsfc 311 d-sub connector

Abstract: esa scc 3401 d-sub 8635-NMB esa 3401 S-311-P10 8635 p s-311-p-4 S-311-P-10 MIL-DTL-24308 3401/001
Contextual Info: D-Sub D*M-NMB Standard density D-Sub, Non Removable Contacts Space Grade Applications Satellite Launcher Space station Shuttle hardware Probe D*M-NMB non-magnetic connectors use the same components as the 3401/001 ESA/SCC and S311-P-10 GSFC connectors. However they

Contextual Info: Micro D Plastic Shell - .050" Contact Spacing M D *B-P C B M D *B -PC B connectors use standard M D *B all plas­ tic shells and are designed for use w ith flex circuitry, printed circuit and m ulti-layer boards. They are easily mounted and soldered and provide

GG1Q

Abstract: GG1Q171
Contextual Info: INTEGRATE» DEVICE m 47E D Mâ2S7?l GG1Q171 b • IDT IDT7M4068 IDT7MB40G8 256K x 8 BiCMOS/CMOS STATIC RAM MODULE Integrated D evice T ech no logy, Inc. FEATURES: DESCRIPTION: • High density 2 megabit C M O S static RAM module • Equivalent to the JE D E C standard for future monolithic

USART 6402

Abstract: advantages of master slave jk flip flop verilog code for 8254 timer
Contextual Info: Si GEC P L E S S E Y NOVEM BER 1997 S E M I C O N D U C T O R S D S 4830 - 3.0 GSC200 SERIES 0.35|a CMOS STANDARD CELL ASICs INTRODUCTION The GSC200 standard cell ASIC family from GEC Plessey Semiconductors GPS is a standard cell product combining low power, mixed voltage capability with a very high density

Contextual Info: 16 Megabyte CMOS DRAM DENSE-PAC DP3ED4MX32PSW DESCRIPTION: The D P 3 E D 4 M X 3 2 P S W is the 4 M eg x 32 D ynam ic R A M S O D iM M module. The module is constructed of eight 4 M eg x 4 D ynam ic R A M 's w h ich are surface mounted on an industry standard 72-pin S O D IM M substrate.

Contextual Info: IBM11M16730B IBM11M16730C 16M x 72 DRAM MODULE Features • 16 8 Pin J E D E C Standard, 8 Byte D ual In-line M em ory M odule • 1 6 M x 7 2 Fast P age M ode D IM M s • Perform ance: • S ystem P erform ance B enefits: - Buffered inputs except R A S , D ata

Contextual Info: High Density D D *M A Crimp Printed Circuit See page 342 (See page 343) Performance and Material Specifications MATERIALS AND FINISHES Standard Military Material Shell Finish Steel per A ST M A -6 20 1 ^ Insulator Yellow chromate over cadmium QQ -P-416 Type II Class 2

SJ 38

Contextual Info: ADVANCE M IC R O N 2 MEG X M T4LD232 X (S) 32 D R A M M O D U LE 2 MEG x 32 _ _ _ _ _ _ _ _ 8 MEGABYTE, 3.3V, OPTIONAL SELF M m o d e ESH’ O D U L E FAST PAGE ° R ED° PAGE FEATURES PIN A SSIG N M E N T (Front View) • JEDEC-standard pinout in a 72-pin single-in-line

Contextual Info: HB56UW873E-6A/7A Preliminary 8,388,608-Word x 72-Bit High Density Dynamic RAM Module 168-pin JE D E C Standard Outline Buffered 8B YTE DIM M HITACHI The H B56U W 873E belongs to 8 Byte D IM M Dual In-line Memory M odule fam ily, and has been developed as an optim ized main memory solution

Contextual Info: H igh D ensity D D*M A Crimp P rinted Circuit See page 342 (See page 343) Performance and M aterial Specifications MATERIALS AND FINISHES Standard Military M aterial Shell Finish Steel per A S T M A -6 2 0 1 ^ Insulator Yellow chromate over cadmium Q Q -P-416 Type II Class 2

pin diagram for IC 7476

Abstract: MT16D164 RWS300B-15/R
Contextual Info: M ir H D N 1 1 MEG 8 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT Front View • JE D E C - and industry-standard pinout in a 168-pin, dual-in-line m em ory m odule (D IM M ) • High-performance C M O S silicon-gate process • Single +5V ±10% pow er supply

5145154-4

Contextual Info: tifca M em ory & Socket Products M em ory / D IM M Sockets Electronics Standard Edge .0 5 0 Series PCI Connectors • High density .0 5 0 1.27m m centreline contact spacing ■ Easy m ating of high circuit count daughter boards ■ Polarising w eb for positive board-to-connector registration

Contextual Info: SEIKO/EPSON AUER-1 CMPNT S7E D • 33b413M DODDl^M bDb M EP S SIP TYPE HIGH FREQUENCY CRYSTAL OSCILLATOR SG-11 • Use of C -M O S IC allows low current consum ption • Small size high density mounting possible • M ountable on the standard printed board

Contextual Info: STANDARD MICROSYSTEMS bSE D STANDARD MICROSYSTEMS CORPORATION, COMPONENT PRODUCTS DIVISION 05b4bfib □ □ Ü 7 Ô D 3 5 4 3 « S M C FDC37C665 FDC37C666 80 Arkay Drive. Hauppauge, n y 11788 516 435 6000 Fax (516) 231 -6004 Advanced High-Performance Multi-Mode

Contextual Info: AK5321024WP 1,048,576 Word by 32 Bit CMOS Dynamic Random Access Memory T h e Accutek A K 5 3 2 1 0 2 4 W P high density m em ory module is a C M O S D ynam ic R A M organized in 1 0 24 K x 32 bit words. The module consists of eight standard 1 M eg x 4 D R A M s in plastic SOJ

Contextual Info: e m ic d n d u c t d r t m NM34W02 2K-Bit Standard 2-Wire Bus Interface Serial EEPROM with Full Array Write Protect Designed with Permanent Write-Protection for First 128 Bytes for Serial Presence Detect Application on Memory Modules PC100 Compliant General Description

Contextual Info: IB M 1 1 M 4 6 4 5 B IB M 1 1 M 4 6 4 5 C 4M x 64 D RAM M O D U LE Features • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module - Buffered inputs except RAS, Data • 4Mx64 Extended Data Out Page Mode DIMM - 4 Byte Interleave enabled • Performance:

trw 8040

Contextual Info: IBM11M16735B IBM11M16735C 16M x 72 DRAM MODULE Features • 168 Pin JE D E C Standard, 8 Byte Dual In-line M em ory M odule • O ptim ized for ECC applications • 16M x72 Extended Data O ut EDO M ode D IM M s • System Perform ance Benefits: - Buffered inputs (except RAS, Data)

IC Pin 7476

Abstract: XDM32
Contextual Info: PRELIMINARY MICRON MT8LD264 X 2 M EG x 64 DRAM M ODULE 1 DRAM MODULE 2 MEG x 64 16 MEGABYTE, 3.3V, FAST PAGE OR EDO PAGE MODE FEATURES PIN ASSIGNMENT (Front View) 168-Pin DIMM • JE D E C - and industry-standard pinout in a 168-pin, dual-in-line m em ory m odule (D IM M )

Contextual Info: D-Subminiatrure Connectors 240-066 D-Subminiature Connector, Right Angle Mount EMI Filtered MIL-DTL-24308 Type Footprint Type M = Mil-Spec E = European (See Table V) MIL-C-2483 Type Contact Density S = Standard H = High Filter Connector Product Code 240 - 066

Contextual Info: J A E ELECTRONICS INC bBC D • 4flc]34hS 000Q[]75~1 M ICROMINIATURE, DOUBLE DENSITY D TYPE RECTANGULAR CONNECTOR- D02 SERIES Dimensions are in inches Millimeters are in parentheses 63C 00075 489 346 5 J A E'ELECTRONICS INC D^y-7^5 STANDARD SHELL Af - s

J841A-15

Abstract: FM04 1841A 30 pin simm memory 9 bit SIMM pins CYM1841 CYM1841A CYM1851 1841A-30
Contextual Info: CYM1841 CYM1841A CYPRESS 256K x 32 Static RAM Module Features Functional Description • H igh-d en sity 8-m egabit SRAM m odule • 32-b it standard footprint supports d en sities from 16K x 32 through 1M x 32 T he CYM1841/1841A is a high-perfor­ m ance 8 -m egabit static RA M m odule o r­