CU 257 Search Results

4032 k460 epcos

Abstract: 4032 k460 VARISTOR k460 k150 varistor k40 4032 CU 4032 K 275 G2 smd k460 K40 varistor EPCOS SIOV-S10K385 4032 k150
Contextual Info: SIOV Metal Oxide Varistors SMD Varistors, Monolithic Automotive Series, CU Automotive Construction • Cylindrical varistor element, encapsulated ■ Encapsulation: thermoplast, flame-retardant to UL 94 V-0 ■ Termination: tinned copper alloy Features ■

CU4032K460

Abstract: cu3225K275 4032 k460 CU3225K175 Varistor 4032 4032 k150 4032 k460 epcos CU3225K275G k460 4032 CU4032K140G
Contextual Info: SIOV Metal Oxide Varistors SMD Varistors, Monolithic Standard Series Monolithic (CU) Standard Construction • Cylindrical varistor element, encapsulated ■ Encapsulation: thermoplast, flame-retardant to UL 94 V-0 ■ Termination: tinned copper alloy Features

QP-10T

Contextual Info: Features General Description • H ig h slew rate — 3000 V /ju s T h e E L 2 0 0 9 is a p aten ted h ig h speed b ip o lar m o n olith ic b u ffer am p lifier designed to provide cu rren ts over 1 am p a t high fre­ quencies, w hile d raw ing 40 m A o f q u iescen t supply cu rren t. T h e

dlop 06

Abstract: 80ET 314905
Contextual Info: Red Laser Diode DL-3149-057/-257 Features • • • • Tolerance : ± 0 .2 Unit : mm Package Short wavelength : 670 nm Typ. Low threshold cu rren t: Ith = 25 mA (Typ.) High operating temperature : 5mW at 60°C Small package : 0 5.6mm Applications • Laser beam printer

hgm ieh

Contextual Info: HGM SERIES MATERIALS: Pin Contacts: Pin Diameter: Socket Contacts: Contact Wires: Termination: Support Elements: SMT Leads: Hardware: Insulator: Pin Shields: FINISHES: Pin Contacts: SPECIFICATIONS PhBr per ASTM B139, BeCu per ASTM B196 or B197, or Cu alloy

B197

Abstract: TC-240-NMH AMS 2418 LMR-240-FR TC-240-NMH-D TC-240-NMH-RA-D EZ-240-TM LOCTITE L 428 TC-240-NMC TC-240-NF-BH
Contextual Info: HRM SERIES SPECIFICATIONS MATERIALS: Pin Contacts: Socket Contacts: Contact Wires: Termination: Support Elements: SMT Leads: Hardware: Insulator: FINISHES: Pin Contacts: PhBr per ASTM B139, BeCu per ASTM B196 or B197, or CU alloy BeCu per ASTM B196, or B197

AMS 2418

Abstract: EIA-364-31 method iv MIL-STD-55302 ASTM b734 ASTM b196 ams YEAR DATE CODE B-197 LOCTITE 454 EIA-364-28 EIA-364-06
Contextual Info: HRM SERIES SPECIFICATIONS MATERIALS: Pin Contacts: Socket Contacts: Contact Wires: Termination: Support Elements: SMT Leads: Hardware: Insulator: FINISHES: Pin Contacts: PhBr per ASTM B139, BeCu per ASTM B196 or B197, or CU alloy BeCu per ASTM B196, or B197

FGG676

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3/-3A FGG676 Cu Wire Package PK530 (v1.3) March 19, 2012 Average Weight: 2.9810 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

spartan 3e

Abstract: 40378
Contextual Info: 100% Material Declaration Data Sheet for Spartan -3E/-3A FG400 Cu Wire Package PK518 (v1.1) March 19, 2012 Average Weight: 1.9857 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

FGG484

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3E/-3A FGG484 Cu Wire Package PK504 (v1.1) March 19, 2012 Average Weight: 2.292 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

cas number

Abstract: spartan 3e FT256
Contextual Info: 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FT256 Cu Wire PK520 (v1.1) December 27, 2011 Average Weight: 0.7690g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00

PK500

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3 FG900 Cu Wire Package PK500 (v1.1) March 19, 2012 Average Weight: 3.949 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3

cas number

Abstract: FTG256 PK522 FTG256
Contextual Info: 100% Material Declaration Data Sheet for Spartan -3/-3E FTG256 Cu Wire PK522 (v1.2) March 19, 2012 Average Weight: 0.7530g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Die Attach

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3 FGG900 Cu Wire Package PK492 (v1.2) July 11, 2012 Average Weight: 3.9490 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FGG1156 Cu Wire Package PK538 (v1.1) January 11, 2011 Average Weight: 5.600 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FG1156 Cu Wire Package PK536 (v1.1) January 11, 2012 Average Weight: 5.6764 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

Contextual Info: PK540 v1.1 January 11, 2012 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FG456 (Cu Wire) Package Average Weight: 2.3521 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

icl 2822

Abstract: 1004CL 0398C BW002 CCGA 472 device dimensional details diode marking B4Z 0844C 4046 PLL Designers Guide AOI2222 2-bit comparator
Contextual Info: Preliminary ASIC Cu-11 Databook Notices: Before using this information and the product it supports, be sure to read the general information on the back cover of this book. Trademarks: The following are trademarks or registered trademarks of International Business Machines

Contextual Info: PK542 v1.1 January 11, 2012 100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FGG456 (Cu Wire) Package Average Weight: 2.3000 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound

lb 1622

Contextual Info: QwikConnect SERIES 103 Aircraft Utilization Analysis Comparison of ArmorLite Composite to standard A-A-59569 Ni/Cu Braid Length and Weight of NiCu Braid in Typical Commercial Carrier Diameter in Weight (Lb/ft) Length (in) weight (Lb) 0 - 0.25 0.02

FG484

Abstract: PK512
Contextual Info: 100% Material Declaration Data Sheet for Spartan -3E/-3A FG484 Cu Wire Package PK512 (v1.1) March 19, 2012 Average Weight: 2.347 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3

SAE-AS31971

Contextual Info: Specifications "F" Series. 100" £ Material and Finish Molded Insulator: 40% Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302 Pin Contacts: Copper Alloy per MIL-DTL-55302. Socket Contacts: Contacts: Terminal: Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302.

Contextual Info: QwikConnect SERIES 103 Aircraft Utilization Analysis Comparison of AmberStrand Composite to 36 AWG A-A-59569 Ni/Cu Braid Length and Weight of NiCu Braid in Typical Commercial Carrier Diameter in Weight (Lb/ft) Length (in) Weight (Lb) 0 - 0.25 0.02 12564.8

EIA-364-26

Abstract: MS3197 EIA364-26 SAE-AS31971
Contextual Info: Specifications "F" Series .075" <£ Material and Finish Molded Insulator: Glass Filled Polyphenylene Sulfide, Per MIL-DTL-55302, Pin Contacts: Copper Alloy per MIL-DTL-55302. Socket Contacts: Contacts: Terminal: Be Cu per MIL-DTL-55302. Copper Alloy per MIL-DTL-55302.