CS 630 F Search Results
CS 630 F Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| TC78H630FNG | Toshiba Electronic Devices & Storage Corporation | Brushed Motor Driver/1ch/Vout(V)=18/Iout(A)=2.1 | Datasheet | ||
| DEO2V2P500M40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 200 Cycles, Front: Threaded Insert UNC 4.40, Back: Metal Brackets. | |||
| GSB4111312HR | Amphenol Communications Solutions | USB 3.2 GEN 2, Type A, Receptacle, Right Angle, 9 Pins, Shell with Nickel Plating, 30u\\ Gold, Dip 2.4mm, Blue High Temperature Housing, Tray Packaging | |||
| 54112-105160850LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch. | |||
| 76384-314LF | Amphenol Communications Solutions | Dubox®2.54mm, Board to Board Connector, Shrouded Header, Single Row, Straight. |
CS 630 F Price and Stock
STMicroelectronics STPS630CSFYSchottky Diodes & Rectifiers Automotive 30V, dual 3A Power Schottky Rectifier |
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STPS630CSFY | 4,049 |
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JST Manufacturing 30RF-JMCS-GAN-1-TFBoard to Board & Mezzanine Connectors JMC RECEPTACLE (SMT/TOP/ ABSORPTION MISA |
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30RF-JMCS-GAN-1-TF | 3,050 |
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JST Manufacturing 30PS-JMCS-GAN-1-A-TFBoard to Board & Mezzanine Connectors JMC PLUG (SMT/SIDE TYPE) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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30PS-JMCS-GAN-1-A-TF | 2,000 |
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JST Manufacturing 30R-JMCS-GAN-TFBoard to Board & Mezzanine Connectors JMC RECEPTACLE (SMT/TOP TYPE) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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30R-JMCS-GAN-TF | 732 |
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Amphenol Corporation 302W2CSXX72F40XD-Sub Standard Connectors 2W2C F PC 40A POWER 4-40 TH.LCK SPCR/CLP |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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302W2CSXX72F40X | 58 |
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CS 630 F Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: PIXYS Phase Control Thyristor CS 630 ITRM Ss =1400A I' = 630 A VRRM = 1200-1600 V tavm Type 3 4 1200 1400 1600 1200 1400 1600 Symbol CS 630-12io1 CS 630-14io1 CS 630-16io1 Maximum Ratings Test Conditions 1400 630 A A 10 ms 50 Hz , sine 8.3 ms (60 Hz), sine |
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630-12io1630-14io1630-16io1 | |
CR thyristor
Abstract: CS thyristor D-68623 thyristor cs 630
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630-12io1630-14io1630-16io1cr thyristor+3 | |
1794A
Abstract: Belden 7855A
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en90ns120mm1794abelden+1 | |
R107
Abstract: R220
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110ns100mhzcameng-1-1-98r107+1 | |
IGCT thyristor ABB
Abstract: IGCT thyristor current max VT115 A115 B115 HFBR-1528 HFBR-2528 MTA-156 igct abb Pressure transmitter TBD
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08f45105sya1223-06ch-5600igct thyristor abb+9 | |
K4T1G044QQContextual Info: RDIMM DDR2 SDRAM DDR2 Registered SDRAM MODULE 240pin Registered Module based on 1Gb Q-die 72-bit ECC 60FBGA and 63DDP with Lead-Free and Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. |
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240pin72-bit60fbga63ddp+1 | |
DDR3 jedec 21-c
Abstract: MT41J256M4 micron quad die ddr3 MICRON ddr3
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240-pinmt18jdf25672pzmt18jdf51272pzpc3-12800+9 | |
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Contextual Info: 2GB, 4GB, 8GB x72, ECC, DR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT18JSF25672AZ – 2GB MT18JSF51272AZ – 4GB MT18JSF1G72AZ – 8GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C E) Module height: 30.0mm (1.181in) • DDR3 functionality and operations supported as |
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240-pinmt18jsf25672azmt18jsf51272azmt18jsf1g72az+5 | |
micron ddr3Contextual Info: 2GB, 4GB x72, ECC, SR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT18JDF25672PZ – 2GB MT18JDF51272PZ – 4GB Features Figure 1: 240-Pin VLP RDIMM (R/C M) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, very low-profile registered dual in-line |
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240-pinmt18jdf25672pzmt18jdf51272pzpc3-12800+6 | |
MT41J256M8
Abstract: 2403 GB 123 DDR3 UDIMM SPD JEDEC MT41J512M8
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240-pinmt18jsf25672azmt18jsf51272azmt18jsf1g72az+9 | |
MT18JSF25672PZ
Abstract: MT18JSF51272PZ-1G9
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240-pinmt18jsf25672pzmt18jsf51272pzpc3-14900+6 | |
max 1782
Abstract: DDR3-1866 RDIMM SPD JEDEC MT18JSF25672PZ
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240-pinmt18jsf25672pzmt18jsf51272pzpc3-14900+7 | |
MT18KSF1G72PZ-1G4
Abstract: MT18KSF1G72PZ-1G6 MT18KSF1G72 MT18KSF25672PZ MT41K1G4
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240-pinmt18ksf25672pzmt18ksf51272pzmt18ksf1g72pz+9 | |
M393T5663QZ3
Abstract: M393T5160QZA M393T5663QZA M393T5160QZA-CF7 M393T5660QZA
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240pin72-bit60fbga63ddp+5 | |
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Contextual Info: TOSHIBA MOS MEMORY PRODUCTS THM 91002S/L-85, 10 , 12 description! The THM91002S/L is a 1,048,576 words by 9 bits dynamic RAM module which assembled 9 pcs of TC511002J on the printed circuit board. The THM91002S/L is optimized for application to the systems which are required |
OCR Scan |
91002s/l-85thm91002s/ltc511002jthm91002s/l-85+4 | |
MT18JSF51272AZ
Abstract: MT18JSF25672AZ-1G6 MT18JSF1G72AZ-1G9 MT18JSF51272AZ-1G9
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240-pinmt18jsf25672azmt18jsf51272azmt18jsf1g72az+8 | |
MT18KSF1G72PZ-1G6
Abstract: MT18KSF25672PZ MT41K1G4
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240-pinmt18ksf25672pzmt18ksf51272pzmt18ksf1g72pz+7 | |
MT18KSF1G72PZ-1G6
Abstract: MT18KSF25672PZ MT41K1G4
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240-pinmt18ksf25672pzmt18ksf51272pzmt18ksf1g72pz+7 | |
MT41J256m8Contextual Info: 2GB, 4GB x72, ECC, DR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT18JDF25672PDZ – 2GB MT18JDF51272PDZ – 4GB Features Figure 1: 240-Pin VLP RDIMM (MO-269 R/C L) Module height: 18.75mm (0.738in) • DDR3 functionality and operations supported as defined in the component data sheet |
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240-pinmt18jdf25672pdzmt18jdf51272pdzpc3-12800+6 | |
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Contextual Info: 2GB, 4GB x72, ECC, DR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT18JDF25672PDZ – 2GB MT18JDF51272PDZ – 4GB Features Figure 1: 240-Pin VLP RDIMM (MO-269 R/C L) Module height: 18.75mm (0.738in) • DDR3 functionality and operations supported as defined in the component data sheet |
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240-pinmt18jdf25672pdzmt18jdf51272pdzpc3-12800+5 | |
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Contextual Info: 2GB, 4GB x72, ECC, SR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT18JDF25672PZ – 2GB MT18JDF51272PZ – 4GB Features Figure 1: 240-Pin VLP RDIMM (R/C M) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, low-profile registered dual in-line memory |
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240-pinmt18jdf25672pzmt18jdf51272pzpc3-12800+5 | |
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Contextual Info: DDR2 SDRAM VLP RDIMM DDR2 VLP Registered SDRAM MODULE 240pin VLP Registered Module based on 512Mb E-die 72-bit ECC 60FBGA with Lead-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE |
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240pin512mb72-bit60fbga | |
64KA15Contextual Info: 2GB, 4GB, 8GB x72, DR 240-Pin 1.35V DDR3L RDIMM Features 1.35V DDR3L SDRAM RDIMM MT18KSF25672PDZ – 2GB MT18KSF51272PDZ – 4GB MT18KSF1G72PDZ – 8GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C B, R/C B1) • DDR3L functionality and operations supported as |
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240-pinmt18ksf25672pdzmt18ksf51272pdzmt18ksf1g72pdz+6 | |
DDR200
Abstract: DDR266 DDR333 W3EG72126S-D3 DEVICE MARKING CODE T10C 13003 d
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w3eg72126s-d31gb-128mx72w3eg72126s128mx72+8 | |