CPGA LARGE CAVITY Search Results

CPGA large cavity

Abstract: S-CPGA-P14
Contextual Info: MECHANICAL DATA MCPG006A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P14 X 14 CERAMIC PIN GRID ARRAY A or A1 SQ 1.300 (33,02) TYP P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DIM MIN MAX Notes Large Outline Small Outline Cavity

Contextual Info: MECHANICAL DATA MCPG006A – JANUARY 1997 GA-GB S-CPGA-P14 X 14 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.300 (33,02) TYP P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DIM MIN MAX Notes Large Outline Small Outline Cavity Up Cavity Down Cavity

Contextual Info: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)

CPGA large cavity

Contextual Info: MECHANICAL DATA MCPG004 – OCTOBER 1994 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)

P15 Package

Contextual Info: MECHANICAL DATA MCPG007A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P15 X 15 CERAMIC PIN GRID ARRAY A or A1 SQ 1.400 (35,56) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DIM MIN MAX A 1.540 (39,12) 1.590 (40,38) Large

MO-067-AJ

Contextual Info: MECHANICAL DATA MCPG009A – JANUARY 1995 – REVISED JANUARY 1997 GA-GB S-CPGA-P17 X 17 CERAMIC PIN GRID ARRAY A or A1 SQ 1.600 (40,64) TYP U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DIM B or B1 MIN MAX Notes Large Outline

Contextual Info: MECHANICAL DATA MCPG007A – SEPTEMBER 1996 GA-GB S-CPGA-P15 X 15 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.400 (35,56) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DIM MIN MAX A 1.540 (39,12) 1.590 (40,38) Large Outline A1 1.480 (37,59)

Contextual Info: MECHANICAL DATA MCPG009A – JANUARY 1997 GA-GB S-CPGA-P17 X 17 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.600 (40,64) TYP U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DIM B or B1 MIN MAX Notes Large Outline Small Outline

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

outline of the heat slug for JEDEC

Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

RC5000

Abstract: pipeline in core i3
Contextual Info: MULTI-ISSUE 64-BIT MICROPROCESSOR IDT RC5000 Integrate d Device Technology, Inc. FEATURES • • Dual issue super-scalar execution core, executing at high-frequency - 250 MHz frequency - Dual issue floating-point ALU operations with other instruction classes

88 lead cpga

Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

AA19

Abstract: IDT79RV5000 R4640 R4650 R4700 R5000
Contextual Info: IDT79RV5000 MULTI-ISSUE ORION 64-BIT MICROPROCESSOR Integrated Device Technology, Inc. FEATURES • Dual issue super-scalar execution core, executing at high-frequency - 200 MHz frequency - Dual issue floating-point ALU operations with other instruction classes

PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

Matthey

Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

tucker

Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

"64-Bit Microprocessor" features

Abstract: 79RC5000 RC32364 RC4640 RC4650 RC64474 RC64475
Contextual Info: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR Features Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis

"64-Bit Microprocessor"

Abstract: 600MF
Contextual Info: MULTI-ISSUE 64-BIT MICROPROCESSOR Features 79RC5000 ◆ Large, efficient on-chip caches 32KB Instruction Cache, 32KB Data Cache 2-set associative in each cach Virtually indexed and physically tagged to minimize cache flushes Write-back and write-through selectable on a per page

Contextual Info: FEATURES - - High-performance memory system - Large primary caches integrated on-chip - Secondary cache control interface on-chip - High-frequency 64-bit bus interface runs up to 100MHz - Aggregate bandwidth of on-chip caches, system interface of 5GB/s - High-performance write protocols for graphics and

Contextual Info: MULTI-ISSUE 64-BIT MICROPROCESSOR I I IDT FEATURES IDT RC5000 High-performance memory system - Large primary caches integrated on-chip - Secondary cache control interface on-chip - High-frequency 64-bit bus interface runs up to 100MHz - Aggregate bandwidth of on-chip caches, system

Contextual Info: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR HDWXU WXUHV ◆ Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis

A7647

Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Contextual Info: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package

STR A 6169

Abstract: RC64474 RC64475 79RC5000 RC32364 RC4640 RC4650
Contextual Info: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR HDWXUHV ◆ Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis

TDS-701

Abstract: dhrystone
Contextual Info: 79RC5000 MULTI-ISSUE 64-BIT MICROPROCESSOR HDWXU WXUHV ◆ Large, efficient on-chip caches – 32KB Instruction Cache, 32KB Data Cache – 2-set associative in each cach – Virtually indexed and physically tagged to minimize cache flushes – Write-back and write-through selectable on a per page basis