CPD104R Search Results
CPD104R Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
CFSH2-3LContextual Info: PROCESS CPD104R Schottky Diode Low VF Schottky Diode Chip PROCESS DETAILS Die Size 14.6 x 14.6 MILS Die Thickness 3.9 MILS Anode Bonding Pad Area 11.8 x 11.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER |
Original |
CPD104R CFSH2-3L |