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    chip die pnp transistor

    Contextual Info: PROCESS CP763V Power Transistor PNP - High Current Transistor Chip PROCESS DETAILS Die Size 48.8 x 48.8 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 7.9 MILS Emitter Bonding Pad Area 9.1 x 18.1 MILS Top Side Metalization Al - 30,000Å Back Side Metalization


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    CP763V CZT955 chip die pnp transistor PDF