CP324X Search Results
CP324X Price and Stock
Central Semiconductor Corp
Central Semiconductor Corp CP324X-H2N7002A-CM- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: CP324X-H2N7002A-CM) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CP324X-H2N7002A-CM | Waffle Pack | 22 Weeks | 800 |
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CP324X Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: PROCESS CP324X Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.6 x 21.6 MILS Die Thickness 5.9 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS |
Original |
CP324X 2N7002 30-August |