COPPER HEATSINK Search Results

Contextual Info: 1 2 3 No Heatsink L 2.0 oz. Copper

Sanyo Denki dc fan 109P4412H8016

Abstract: 109X4412H6016 109P4405H8016 109p4412h8016 109X6512H1196 109P5405H8016 Sanyo Denki dc fan 109X7612H1106 109P5405H2016 109P5412H2016
Contextual Info: CPU Active Heatsinks SANYO DENKI San Ace MC Brushless DC Motor with Plastic Fan Housing and Impeller with 100% Copper, Aluminium/Copper Hybrid or 100% Aluminium Heatsink Permanently Lubricated Dual Ball Bearing System Current Limiting System with Reverse Polarity Protection

Contextual Info: TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 96% Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nuts: American standard 303 stainless steel 0.473" ±0.008 (12.0mm ±0.2)

TGHHVR100JE

Contextual Info: TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 96% Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nuts: American standard 303 stainless steel 0.473" ±0.008 (12.0mm ±0.2)

Contextual Info: TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 96% Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nuts: American standard 303 stainless steel 120 and 200 Watt SOT227Package

Contextual Info: MCMA200P1600SA tentative Thyristor Module T = Phase leg Part number Backside: isolated 1 Features / Advantages: Thyristor for line frequency Planar passivated chip Long-term stability Copper base plate with Direct Copper Bonded Al2O3-ceramic Spring contacts for solder-free dirver connection

Contextual Info: MCMA200PD1600SA tentative Thyristor Module T = Phase leg Part number Backside: isolated 1 Features / Advantages: Thyristor for line frequency Planar passivated chip Long-term stability Copper base plate with Direct Copper Bonded Al2O3-ceramic Spring contacts for solder-free dirver connection

LM2596T

Contextual Info: Component Side L Heatsink COUT + Copper side LM2596T pin 1 D1 CIN REGULATED OUTPUT VOLTAGE + ON/OFF - Ground DC INPUT VOLTAGE + +

LM2596T

Abstract: LM2596
Contextual Info: Copper side Component Side L REGULATED OUTPUT VOLTAGE + + COUT ON/OFF - LM2596T Ground pin 1 D1 Heatsink CIN + DC INPUT VOLTAGE +

RGMII to MII

Abstract: BCM5461S BCM5248 BCM5646 BCM5248 100 fbga Broadcom 5461 BCM5404 RGMII to SGMII BCM5461
Contextual Info: BCM5461S 10/100/1000BASE-T GIGABIT COPPER TRANSCEIVER SUMMARY OF BENEFITS FEATURES • Fully-integrated 10BASE-T/100BASE-TX/1000BASE-T Gigabit Ethernet transceiver • GMII, RGMII, SGMII, SerDes, RTBI and MII MAC Interface options • Line-side copper and fiber interfaces

LM2596T

Contextual Info: Copper side Component Side L Cff + R2 REGULATED OUTPUT VOLTAGE + COUT ON/OFF - R1 LM2596T Ground pin 1 D1 Heatsink CIN + DC INPUT VOLTAGE +

LM2596T

Abstract: LM2596
Contextual Info: L Heatsink Component Side Cff R1 COUT + Copper side R2 LM2596T pin 1 D1 CIN REGULATED OUTPUT VOLTAGE + ON/OFF - Ground DC INPUT VOLTAGE + +

Contextual Info: DCB Module Technology Based on new technologies IXYS is using a patented method which allows bonding of thick copper circuit-board conductors directly on both sides to ceramic aluminium oxide Al20 3 or aluminium nitride (AIN) materials. This DCB (Direct-Copper-Bonding) technology is the basis for

JFM38

Abstract: hx 740
Contextual Info: Intel Ethernet Controller I210 Datasheet LAN Access Division LAD Features: • • • • • • • • Small package: 9 x 9 mm PCIe v2.1 (2.5 GT/s) x1, with Switching Voltage Regulator (iSVR) Integrated Non-Volatile Memory (iNVM) Three single port SKUs: SerDes, Copper, Copper IT

Contextual Info: Intel Ethernet Controller I210 Datasheet Networking Division ND Features: • • • • • • • • Small package: 9 x 9 mm PCIe v2.1 (2.5 GT/s) x1, with Switching Voltage Regulator (iSVR) Integrated Non-Volatile Memory (iNVM) Three single port SKUs: SerDes, Copper, Copper IT

BCM5464S

Abstract: BCM569
Contextual Info: BCM5464S PRODUCT Brief QUAD-PORT GIGABIT COPPER TRANSCEIVER WITH COPPER/FIBER MEDIA INTERFACE B C M 5 4 6 4 S S U M M A R Y F E AT U R E S Four fully integrated 10BASE-T/100BASE-TX/ • 1000BASE-T Gigabit Ethernet transceivers RGMII, SGMII and SerDes MAC interface

RUJ 17 33

Abstract: 3145
Contextual Info: AMI A M I S E M IC O N D U C T O R %s PQ2 Packaging Capabilities . . Description Surface Mount The Power Quad II is a molded plastic quad flatpack with improved thermal performance. The Power Quad II isconstruced using a copper lead frame which is directly attached to a copper heat slug. The heat slup increases the thermal

TOP3 package

Abstract: TO220 HEATSINK Heatsinks TO220 HEATSINK DATASHEET Heatsinks TO247 to247 package 0747 FCH020WT SFV019NA DMC018D
Contextual Info: HEATSINKS & MOUNTINGS HEATSINKS DPAK package SMH008D A range of high quality heatsinks from Calinar offering excellent thermal performance but at lower cost. Finish is black anodised throughout unless otherwise stated. A compact surface mount copper heatsink, with

Contextual Info: BetaTHERM Sensors Custom and Standard Instrumentation Probes Style: H080 Economical Tinned Copper Surface Mount "Ring Tongue" Terminal Probe: Applications: ¥ Instrumentation heatsink temperatures. ¥ Over-temperature protection in power supplies and other heat sensitive equipment and instruments.

AC53a

Abstract: RJT3A23D25 AC51 RJT3A23D20 RJT3A60D20 RJT3A60D25 of relay Anti-Parallel Thyristor 1L13L25L3
Contextual Info: Solid State Relays 3 Independently Switched Poles Integrated heatsink Type RJT3A - Trio • 3 in 1 semiconductor contactor • Three control inputs - three independently switched poles • Direct copper bonding DCB technology • LED indication for each pole

RJ1A60D50U

Abstract: RJ1A60D45E RJ1A23A45E RJ1A23A45U RJ1A23D45E RJ1A23D45U RJ1A23D50E RJ1A23D50U RJ1A60A45E RJ1A60A45U
Contextual Info: Solid State Relays SOLITRON MIDI - With Integrated Heatsink Types RJ1A, RJ1B • AC semiconductor contactor • Zero switching RJ1A or instant-on switching (RJ1B) • Direct copper bonding (DCB) technology • LED-indication • Cage clamp output terminals

RJ1A60A50U

Abstract: RJ145 RJ1A60A50E RJ1A60A50EP RJ1A60D45E RJ1A69D45U RJ1A23 RJ1A60D50U RJ1A23D50E RJ1A60A45E
Contextual Info: Solid State Relays SOLITRON MIDI - With Integrated Heatsink Types RJ1A, RJ1B • AC semiconductor contactor • Zero switching RJ1A or instant-on switching (RJ1B) • Direct copper bonding (DCB) technology • LED-indication • Cage clamp output terminals

2 Wavelength Laser Diode

Abstract: CT15-975 CT15-915 SPT-110 10 watt laser diode
Contextual Info: Product Summary Pump Semiconductor Laser Chip on CT Heatsink CT15-915 CT15-975 The Copper/Tungsten CT Features Semiconductor Lasers are a compact, ▲ Economical and easily integrated ▲ High brightness source ▲ Includes bypass (protection) diode ▲

varistor 103 2kv

Contextual Info: Solid State Relays SOLITRON MIDI - With Integrated Heatsink Types RJ1A, RJ1B • AC semiconductor contactor • Zero switching RJ1A or instant-on switching (RJ1B) • Direct copper bonding (DCB) technology • LED-indication • Cage clamp output terminals