COPPER 22MM Search Results

Contextual Info: 10 ;± e CONFIDENTIAL NO TES MATERIAL /'A Tv A ij&6# LOP ] U L92V -0 ( * ] HOUSINC:LIQUID C RYSTA L POLYMER UL9AV-0 (COLOR:BLACK 7 - y ±/l TERMINAL COPPER ALLOY FITTING NAIL COPPER ALLOY 2 7y PLATING A - $ i ^ TERMINAL . y>T #7 • EE GOLD (PITCH) UNDER PLATING : NICKEL

Contextual Info: ISOMETRIC VIEW 8mm 0.31in TYP 2 THRU HOLES O 600mm 23.62in 22mm 0.88in 25mm 1in O 4mm 0.16in TYP(9) DRILLED AND TAPPED 10-32 THRU HOLES TOP VIEW 17mm 0.69in 3mm 0.12in REAR VIEW 21mm 0.81in L.S VIEW FRONT VIEW GRDBAR800 PART NUMBERS 1"X0.125" Solid Copper

Contextual Info: ISOMETRIC VIEW 400mm 15.75in 8mm 0.31in TYP 2 THRU HOLES O 25mm 1in TOP VIEW 3mm 0.12in 17mm 0.69in REAR VIEW 22mm 0.88in O 4mm 0.16in TYP(9) DRILLED AND TAPPED 10-32 THRU HOLES 21mm 0.81in L.S VIEW FRONT VIEW GRDBAR600 PART NUMBERS 1"X0.125" Solid Copper

INFORMATION OF IC 7424

Abstract: 9C1S DIM200MKS12-A000 GP200MKS12
Contextual Info: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Preliminary Information Replaces GP200MKS12 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.1 November 2002 KEY PARAMETERS VCES typ VCE(sat)*

INFORMATION OF IC 7424

Abstract: IC 4560 CIRCUIT DIAGRAM DIM200MLS12-A000 GP200MLS12
Contextual Info: DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Preliminary Information Replaces GP200MLS12 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5553-1.1 November 2002 KEY PARAMETERS VCES typ VCE(sat)*

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PBT FLAMMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: 500 MATING CYCLES

INFORMATION OF IC 7424

Contextual Info: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Preliminary Information Replaces GP200MKS12 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.2 November 2002 KEY PARAMETERS VCES typ VCE(sat)*

Contextual Info: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Advance Information Replaces November 2002, issue DS5552-1.2 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.2 November 2002 KEY PARAMETERS

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PBT FLAMMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: 500 MATING CYCLES

M6831

Abstract: IC 7424
Contextual Info: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue August 2003, version DS5543-3.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5545-4.0 September 2003 KEY PARAMETERS

INFORMATION OF IC 7424

Abstract: M6831
Contextual Info: DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Advance Information Replaces November 2002, version DS5553-1.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5553-2 March 2003 KEY PARAMETERS VCES

DIM200MBS12-A000

Abstract: DS55452
Contextual Info: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Preliminary Information Replaces issue May 2002, version DS5543-1.3 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5545-2.1 June 2002

Contextual Info: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue July 2003, version DS5543-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5545-3.1 August 2003 KEY PARAMETERS VDRM

INFORMATION OF IC 7424

Abstract: DIM200MLS12-A000
Contextual Info: DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Replaces November 2002, version DS5553-1.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5553-2 March 2003 KEY PARAMETERS VCES typ VCE(sat)*

Contextual Info: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue June 2002, version DS5543-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5545-3.0 July 2003 KEY PARAMETERS VDRM

DIM200MHS12-A000

Contextual Info: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Preliminary Information Replaces issue May 2002, version DS5535-1.4 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-2.1 June 2002 KEY PARAMETERS

DIM200MKS12-A000

Abstract: DS-5552
Contextual Info: DIM200MKS12-A000 DIM200MKS12-A000 IGBT Chopper Module Replaces November 2002, issue DS5552-1.2 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5552-1.2 November 2002 KEY PARAMETERS VCES typ VCE(sat)*

was dual transistor

Abstract: DIM200MBS12-A000
Contextual Info: DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Replaces issue May 2002, version DS5543-1.3 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5545-2.1 June 2002 KEY PARAMETERS VDRM

Contextual Info: Metallized Polypropylene Capacitor PPSA PPSA are non-inductively wound polypropylene capacitors with metal foil electrodes, internally series - connected using copper - clad steel leads and epoxy resin coating. They are ideal for applications as damping and commutating capacitors in power

bi-directional switches IGBT

Abstract: M6 transistor DIM200MHS12-A000 half bridge circuit diagram INFORMATION OF IC 7424
Contextual Info: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Replaces June 2002, version DS5535-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*

Contextual Info: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces March 2003, version DS5534-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate FDS5534-4.0 July 2003 KEY PARAMETERS VCES typ VCE(sat)*

12v to 1000v inverters circuit diagrams

Abstract: bi-directional switches IGBT DIM400LSS12-A000 6x55 diode IC LM 2003
Contextual Info: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*

DIM400LSS12-A000

Abstract: IC 4560 CIRCUIT DIAGRAM
Contextual Info: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*

transistor 9003

Abstract: DIM200MHS12-A000
Contextual Info: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Replaces June 2002, version DS5535-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*