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    COMPONENT DATA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    AM79C961AVC\\W
    		Rochester Electronics LLC Full Duplex 10/100 MBPS ETHERNET Controller for PCI Local Bus, PCNET- ISA II jumperless PDF Buy
    AM79C961AVI
    		Rochester Electronics LLC Full Duplex 10/100 MBPS ETHERNET Controller for PCI Local Bus, PCNET- ISA II jumperless PDF Buy
    54HC152J/B
    		Rochester Electronics LLC 54HC152 - 8 to 1 Line Data Selectors/Multiplexers PDF Buy
    54LS298/BEA
    		Rochester Electronics LLC 54LS298 - DATA SEL/MULTIPLEXER, QUAD 2-INPUT, WITH STORAGE - Dual marked (M38510/30909BEA) PDF Buy
    54S153/BEA
    		Rochester Electronics LLC 54S153 - DATA SEL/MULTIPLEXER, DUAL 4-INPUT - Dual marked (M38510/07902BEA) PDF Buy

    COMPONENT DATA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    xilinx 1200

    Abstract: cas number 14808-60-7
    Contextual Info: 100% Material Declaration Data Sheet FT64 PK232 v1.1 March 19, 2012 Average Weight: 0.2450g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Component Weight/ Substance Weight (grams) Component Percent of Total


    Original     		pk2322450g1333-86-inxxilinx 1200+2cas number14808-60-7 PDF

    peak atlas DCA55

    Abstract: ATLAS dca55 DCA55 thyristor-triac specifications A 103 TRANSISTOR pinout 220MV ATLAS III pinout all type of triac how to test transistor SK17
    Contextual Info: atlas component analyser PRODUCT BRIEF Model: DCA55 The Peak Atlas A fresh approach to component analysis has resulted in the fantastic Peak Atlas, an intelligent, slim and invaluable tool. A world of detailed component data has never been so accessible. Just connect your component any way round and


    Original     		dca55gp23apeak atlas dca55atlas dca55+7thyristor-triac specificationsa 103 transistor pinout220mvatlas iiipinout all type of triachow to test transistorsk17 PDF

    E317132

    Abstract: ELECTROMAGNETIC Underwriters Laboratories
    Contextual Info: FOKY2.E317132 - Electromagnetic Interference Filters - Component Page 1 of 1 FOKY2.E317132 Electromagnetic Interference Filters - Component Page Bottom Electromagnetic Interference Filters - Component See General Information for Electromagnetic Interference Filters - Component


    Original     		e317132electromagneticunderwriters laboratories PDF

    QII54005-10

    Contextual Info: 6. Component Editor QII54005-10.0.0 The SOPC Builder component editor provides a GUI to support the creation and editing of the Hardware Component Description File _hw.tcl file that describes a component to SOPC Builder. You use the component editor to do the following:


    Original     		qii54005-10 PDF

    material declaration

    Abstract: VO48
    Contextual Info: 100% Material Declaration Data Sheet VO48 PK176 v2.0 February 12, 2008 Material Declaration Data Sheet Average Weight: 0.543 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight


    Original     		pk176material declarationvo48 PDF

    1747-CP3 CABLE CONFIGURATION

    Abstract: 2711C-CBL-AB03 2711-CBL-PM05 1761-CBL-PM02 siemens mpi RS232 interface cable 2711C-T6T 2711C-T6C 2711C-CBL-UU02 2711C-K3M 2711C-T10C
    Contextual Info: Technical Data PanelView Component Specifications Catalog Numbers 2711C-F2M, 2711C-K2M, 2711C-T3M, 2711C-K3M, 2711C-T6M, 2711C-T6C, 2711C-T6T, 2711C-T10C PanelView Component Family Topic Page PanelView Component Family 1 Environmental Specifications 2 Certifications


    Original     		2711c-f2m2711c-k2m2711c-t3m2711c-k3m+122711c-t6m2711c-t6c2711c-t6t2711c-t10cmicro800ra-du0021747-cp3 cable configuration2711c-cbl-ab032711-cbl-pm051761-cbl-pm02siemens mpi rs232 interface cable2711c-cbl-uu02 PDF

    pl232

    Abstract: PL-232 34590-94-8 silver sulfate 14808-60-7 epoxy resin PK232
    Contextual Info: 100% Material Declaration Data Sheet FT64 PK232 v1.0 May 6, 2008 100% Material Declaration Data Sheet Average Weight: 0.245 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight


    Original     		pk232pl232pl-23234590-94-8+3silver sulfate14808-60-7epoxy resin PDF

    pk205

    Contextual Info: 100% Material Declaration Data Sheet PC20 PK205 v1.1 January 16, 2012 Average Weight: 0.68189g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die attach material Mold Compound 7440-21-3 100.00 Component % of Total


    Original     		pk20568189g PDF

    pollution

    Contextual Info: Product catalogue | Electronics housings | Component housings for mounting on DIN rail | CH20M - modular component housing | CH20M6 - modular component housing, width of 6 mm General ordering data Order No. Part designation Version 2418600000 CH20M6 BP 4P-4P BK


    Original     		ch20mch20m6solidch20m6pollution PDF

    BT 8123

    Abstract: FF484
    Contextual Info: 100% Material Declaration Data Sheet FF484 PK402 v1.2 September 28, 2012 Average Weight: 4.1856g Component Substance Description CAS Number or Description Percentage of Component Silicon Die (FPGA) Doped silicon 7440-21-3 Use in Product Component Weight/


    Original     		ff484pk4021856gsecret19/10+1bt 8123 PDF

    Contextual Info: PK582 v1.0 September 21, 2012 100% Material Declaration Data Sheet FGG400 XC3S400AN Average Weight: 2.0000 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/


    Original     		pk582fgg400xc3s400an12visions PDF

    Contextual Info: PK225 v1.1 September 21, 2012 100% Material Declaration Data Sheet for FF1136 Package Average Weight: 9.9112 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon 7440-21-3 100.00 Solder Bump Component Weight/ Substance Weight


    Original     		pk225ff1136 PDF

    Contextual Info: PK584 v1.0 September 28, 2012 100% Material Declaration Data Sheet FG400 XC3S400AN Average Weight: 2.0455 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/


    Original     		pk584fg400xc3s400an PDF

    butyrolactone

    Abstract: xilinx so20
    Contextual Info: 100% Material Declaration Data Sheet SO20 PK209 v1.1 January 16, 2012 Average Weight: 0.5610 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Component % of Total


    Original     		pk209butyrolactonexilinx so20 PDF

    Contextual Info: PK394 v1.1 January 16, 2012 100% Material Declaration Data Sheet for XC3S1400AN FGG676 Package Average Weight: 3.188g Component Silicon Die (FPGA) Substance Description Silicon CAS# or Description 7440-21-3 % of Component 100.00 Silicon Die (PROM) Component Weight/


    Original     		pk394xc3s1400anfgg676 PDF

    E172884

    Abstract: Underwriters Laboratories
    Contextual Info: NKCR2.E172884 - Auxiliary Devices - Component Page 1 of 1 NKCR2.E172884 Auxiliary Devices - Component Page Bottom Print-friendly version Questions? Previous Page Auxiliary Devices - Component See General Information for Auxiliary Devices - Component E172884


    Original     		e172884underwriters laboratories PDF

    FF784

    Contextual Info: 100% Material Declaration Data Sheet FF784 PK404 v1.2 September 28, 2012 Average Weight: 5.5545 g Component Silicon Die (FPGA) Substance Description Doped silicon CAS Number or Description 7440-21-3 Percentage of Component Use in Product Component Weight/


    Original     		ff784pk404m30/10 PDF

    FT256

    Contextual Info: 100% Material Declaration Data Sheet FT256 PK158 v1.3 July 27, 2012 Average Weight: 0.7530g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon 7440-21-3 100.00 Die Attach Use in Product Component Weight/


    Original     		ft256pk1587530g7440-22-d PDF

    Contextual Info: Component Data


    OCR Scan     		PDF

    Contextual Info: 100% Material Declaration Data Sheet for VQG64 Package PK129 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		vqg64pk129 PDF

    Contextual Info: PK171 v1.3 November 18, 2011 100% Material Declaration Data Sheet for VQ44 Package Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		pk1717440-mponent PDF

    Contextual Info: PK130 v1.4 August 24, 2012 100% Material Declaration Data Sheet for VQG100 Package Average Weight: 0.5392 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Component Weight/


    Original     		pk130vqg100 PDF

    Contextual Info: 100% Material Declaration Data Sheet for VQ44 Package PK171 v1.4 August 24, 2012 Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		pk1717440-31-5ptions PDF

    Contextual Info: 100% Material Declaration Data Sheet for VQ64 Package PK172 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		pk1727440-31-5ptions PDF