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    COMPONENT DATA Search Results

    COMPONENT DATA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NFMJMPC226R0G3D
    		Murata Manufacturing Co Ltd Data Line Filter, PDF
    NFM15PC755R0G3D
    		Murata Manufacturing Co Ltd Feed Through Capacitor, PDF
    NFM15PC435R0G3D
    		Murata Manufacturing Co Ltd Feed Through Capacitor, PDF
    NFM15PC915R0G3D
    		Murata Manufacturing Co Ltd Feed Through Capacitor, PDF
    GCM033C71A104KE02J
    		Murata Manufacturing Co Ltd 0201 (0603M) X7S (EIA) 10Vdc 0.1μF±10% PDF

    COMPONENT DATA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    xilinx 1200

    Abstract: cas number 14808-60-7
    Contextual Info: 100% Material Declaration Data Sheet FT64 PK232 v1.1 March 19, 2012 Average Weight: 0.2450g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Component Weight/ Substance Weight (grams) Component Percent of Total


    Original     		PK232 2450g 1333-86-inx xilinx 1200 cas number 14808-60-7 PDF

    peak atlas DCA55

    Abstract: ATLAS dca55 DCA55 thyristor-triac specifications A 103 TRANSISTOR pinout 220MV ATLAS III pinout all type of triac how to test transistor SK17
    Contextual Info: atlas component analyser PRODUCT BRIEF Model: DCA55 The Peak Atlas A fresh approach to component analysis has resulted in the fantastic Peak Atlas, an intelligent, slim and invaluable tool. A world of detailed component data has never been so accessible. Just connect your component any way round and


    Original     		DCA55 GP23A peak atlas DCA55 ATLAS dca55 DCA55 thyristor-triac specifications A 103 TRANSISTOR pinout 220MV ATLAS III pinout all type of triac how to test transistor SK17 PDF

    E317132

    Abstract: ELECTROMAGNETIC Underwriters Laboratories
    Contextual Info: FOKY2.E317132 - Electromagnetic Interference Filters - Component Page 1 of 1 FOKY2.E317132 Electromagnetic Interference Filters - Component Page Bottom Electromagnetic Interference Filters - Component See General Information for Electromagnetic Interference Filters - Component


    Original     		E317132 E317132 ELECTROMAGNETIC Underwriters Laboratories PDF

    QII54005-10

    Contextual Info: 6. Component Editor QII54005-10.0.0 The SOPC Builder component editor provides a GUI to support the creation and editing of the Hardware Component Description File _hw.tcl file that describes a component to SOPC Builder. You use the component editor to do the following:


    Original     		QII54005-10 PDF

    material declaration

    Abstract: VO48
    Contextual Info: 100% Material Declaration Data Sheet VO48 PK176 v2.0 February 12, 2008 Material Declaration Data Sheet Average Weight: 0.543 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight


    Original     		PK176 material declaration VO48 PDF

    1747-CP3 CABLE CONFIGURATION

    Abstract: 2711C-CBL-AB03 2711-CBL-PM05 1761-CBL-PM02 siemens mpi RS232 interface cable 2711C-T6T 2711C-T6C 2711C-CBL-UU02 2711C-K3M 2711C-T10C
    Contextual Info: Technical Data PanelView Component Specifications Catalog Numbers 2711C-F2M, 2711C-K2M, 2711C-T3M, 2711C-K3M, 2711C-T6M, 2711C-T6C, 2711C-T6T, 2711C-T10C PanelView Component Family Topic Page PanelView Component Family 1 Environmental Specifications 2 Certifications


    Original     		2711C-F2M, 2711C-K2M, 2711C-T3M, 2711C-K3M, 2711C-T6M, 2711C-T6C, 2711C-T6T, 2711C-T10C Micro800 RA-DU002, 1747-CP3 CABLE CONFIGURATION 2711C-CBL-AB03 2711-CBL-PM05 1761-CBL-PM02 siemens mpi RS232 interface cable 2711C-T6T 2711C-T6C 2711C-CBL-UU02 2711C-K3M 2711C-T10C PDF

    pl232

    Abstract: PL-232 34590-94-8 silver sulfate 14808-60-7 epoxy resin PK232
    Contextual Info: 100% Material Declaration Data Sheet FT64 PK232 v1.0 May 6, 2008 100% Material Declaration Data Sheet Average Weight: 0.245 g Component Substance Description CAS# or Description % of Component Silicon Die Use in Product Component Weight/ Substance Weight


    Original     		PK232 pl232 PL-232 34590-94-8 silver sulfate 14808-60-7 epoxy resin PK232 PDF

    pk205

    Contextual Info: 100% Material Declaration Data Sheet PC20 PK205 v1.1 January 16, 2012 Average Weight: 0.68189g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die attach material Mold Compound 7440-21-3 100.00 Component % of Total


    Original     		PK205 68189g pk205 PDF

    pollution

    Contextual Info: Product catalogue | Electronics housings | Component housings for mounting on DIN rail | CH20M - modular component housing | CH20M6 - modular component housing, width of 6 mm General ordering data Order No. Part designation Version 2418600000 CH20M6 BP 4P-4P BK


    Original     		CH20M CH20M6 SolidCH20M6 pollution PDF

    BT 8123

    Abstract: FF484
    Contextual Info: 100% Material Declaration Data Sheet FF484 PK402 v1.2 September 28, 2012 Average Weight: 4.1856g Component Substance Description CAS Number or Description Percentage of Component Silicon Die (FPGA) Doped silicon 7440-21-3 Use in Product Component Weight/


    Original     		FF484 PK402 1856g secret19/10 BT 8123 FF484 PDF

    Contextual Info: PK582 v1.0 September 21, 2012 100% Material Declaration Data Sheet FGG400 XC3S400AN Average Weight: 2.0000 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/


    Original     		PK582 FGG400 XC3S400AN 12visions PDF

    Contextual Info: PK225 v1.1 September 21, 2012 100% Material Declaration Data Sheet for FF1136 Package Average Weight: 9.9112 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon 7440-21-3 100.00 Solder Bump Component Weight/ Substance Weight


    Original     		PK225 FF1136 PDF

    Contextual Info: PK584 v1.0 September 28, 2012 100% Material Declaration Data Sheet FG400 XC3S400AN Average Weight: 2.0455 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/


    Original     		PK584 FG400 XC3S400AN PDF

    butyrolactone

    Abstract: xilinx so20
    Contextual Info: 100% Material Declaration Data Sheet SO20 PK209 v1.1 January 16, 2012 Average Weight: 0.5610 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Component % of Total


    Original     		PK209 butyrolactone xilinx so20 PDF

    Contextual Info: PK394 v1.1 January 16, 2012 100% Material Declaration Data Sheet for XC3S1400AN FGG676 Package Average Weight: 3.188g Component Silicon Die (FPGA) Substance Description Silicon CAS# or Description 7440-21-3 % of Component 100.00 Silicon Die (PROM) Component Weight/


    Original     		PK394 XC3S1400AN FGG676 PDF

    E172884

    Abstract: Underwriters Laboratories
    Contextual Info: NKCR2.E172884 - Auxiliary Devices - Component Page 1 of 1 NKCR2.E172884 Auxiliary Devices - Component Page Bottom Print-friendly version Questions? Previous Page Auxiliary Devices - Component See General Information for Auxiliary Devices - Component E172884


    Original     		E172884 E172884 Underwriters Laboratories PDF

    FF784

    Contextual Info: 100% Material Declaration Data Sheet FF784 PK404 v1.2 September 28, 2012 Average Weight: 5.5545 g Component Silicon Die (FPGA) Substance Description Doped silicon CAS Number or Description 7440-21-3 Percentage of Component Use in Product Component Weight/


    Original     		FF784 PK404 M30/10 FF784 PDF

    FT256

    Contextual Info: 100% Material Declaration Data Sheet FT256 PK158 v1.3 July 27, 2012 Average Weight: 0.7530g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon 7440-21-3 100.00 Die Attach Use in Product Component Weight/


    Original     		FT256 PK158 7530g 7440-22-d FT256 PDF

    Contextual Info: Component Data


    OCR Scan     		PDF

    Contextual Info: 100% Material Declaration Data Sheet for VQG64 Package PK129 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		VQG64 PK129 PDF

    Contextual Info: PK171 v1.3 November 18, 2011 100% Material Declaration Data Sheet for VQ44 Package Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PK171 7440-mponent PDF

    Contextual Info: PK130 v1.4 August 24, 2012 100% Material Declaration Data Sheet for VQG100 Package Average Weight: 0.5392 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Component Weight/


    Original     		PK130 VQG100 PDF

    Contextual Info: 100% Material Declaration Data Sheet for VQ44 Package PK171 v1.4 August 24, 2012 Average Weight: 0.2669 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PK171 7440-31-5ptions PDF

    Contextual Info: 100% Material Declaration Data Sheet for VQ64 Package PK172 v1.5 August 24, 2012 Average Weight: 0.2678 g Component Substance Description CAS Number or Description Percentage of Component Silicon Die Silicon (Si) 7440-21-3 100.00 Use in Product Component Weight/


    Original     		PK172 7440-31-5ptions PDF