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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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68021-160HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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50642-1160ELF
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Amphenol Communications Solutions
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High Pin Count, Backplane Connectors, Receptacle, Right Angle, 4 Row, 0 Guide Pin, Solder-less Press-Fit, 160 Positions, 2.54mm (0.100in) Pitch |
PDF
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54122-116082000LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch |
PDF
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10137351-160000ALF
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Amphenol Communications Solutions
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HPCE VT Receptacle 16P |
PDF
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