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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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67292-009
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
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10121002-009LF
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Amphenol Communications Solutions
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HPCE R/A Receptacle 16P12S |
PDF
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61082-142009LF
|
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Amphenol Communications Solutions
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BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions. |
PDF
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59112-T40-20-090LF
|
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions. |
PDF
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