|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
95278-802-72LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 72 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
71602-720LF
|
|
Amphenol Communications Solutions
|
Quickie® IDC Receptacle, Wire To Board, Double Row, 20 Positions, 2.54mm (0.100in) Pitch |
PDF
|
|
|
68020-272H
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
77313-102-72LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions |
PDF
|
|