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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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54H78J/B
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Rochester Electronics LLC
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54H78 - Dual JK Flip-Flop w/pst, common clock/clear |
PDF
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10127720-241GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 24 Positions, 100u\\ Tin plating, GW Compatible LCP, With Pegs, Tray Packing. |
PDF
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68002-412HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68024-113HLF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail. |
PDF
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