|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
98401-801-28LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
98401-801A34LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
98401-801-50LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
98401-802-08LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 08 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
