|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
68015-607
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
|
75160-156-13LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,13 position, 2.54mm pitch |
PDF
|
|
|
75160-156-10LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch |
PDF
|
|
|
77313-801-56LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 56 Positions |
PDF
|
|