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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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77313-102-36LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 36 Positions |
PDF
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77313-102-30LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 30 Positions |
PDF
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75231-023LF
|
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Amphenol Communications Solutions
|
PV® Wire-to-Board Connector System, PV Terminal, Centerline Crimp-to-Wire Receptacle. |
PDF
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77313-102-38LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 38 Positions |
PDF
|
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