|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
10137926-1212LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 12 Positions, Non GW Compatible LCP, Tape and Reel with cap. |
PDF
|
|
|
10137926-1631LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 16 Positions, GW Compatible LCP, Tape and Reel with cap. |
PDF
|
|
|
10137926-2011LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 20 Positions, GW Compatible LCP, Tape and Reel with cap. |
PDF
|
|
|
75844-379-26LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
