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    COM/68000 Search Results

    COM/68000 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SSM10N961L
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 Datasheet
    68000-103HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail PDF
    68000-201HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail PDF
    68000-210HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail PDF
    68000-115HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail PDF