CODE UT Search Results

Contextual Info: A FLASH MCU SOLUTION 68HC908AB32 8-bit Microcontroller TARGET APPLICATIONS • • • • Appliances Data loggers Industrial equipment Automotive body electronics The 68HC908AB32 FLASH microcontroller utilizes Motorola’s highly successful 68HC08 architecture and is code compatible with

Contextual Info: Capacitors > Monolithic Ceramic Capacitors > Soldering Electrode GRM15/18/21/31 Data Sheet Monolithic Ceramic Capacitors GRM1885C1H680JA01p 0603, C0G, 68pF, 50Vdc p: packaging code g e T e L W (in mm) • Dimensions ■ Packaging Length L 1.60mm±0.10mm

inverter sla 1003

Abstract: ste ae c 642 P80CE559EFB P83CE559 80C51 P80CE559 P80CE559EBB sla 1003
Contextual Info: Philips Semiconductors Preliminary specification Single-chip 8-bit microcontroller P83CE559/P80CE559 1. FEATURES • 80C51 central processing unit • 48 K x 8 ROM, expandable externally to 64 Kbytes • ROM Code protection • 1536 × 8 RAM, expandable externally to 64 Kbytes

TMS320P14

Abstract: TMS320LC15
Contextual Info: TMS320C1x DIGITAL SIGNAL PROCESSORS SPRS009C – JANUARY 1987 – REVISED JULY 1991 • • • • • • • • • • • • • • • Performance Up to 8.77 MIPs • • All TMS320C1x Devices are Object Code Compatible 144/256-Word On-Chip Data RAM

BA100 diode

Abstract: BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode
Contextual Info: KADxx0300B - Txxx MCP MEMORY Document Title Multi-Chip Package MEMORY 128M Bit Two Dual Bank 64M Bit NOR Flash Memory / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark August 9, 2002 Preliminary 0.0 Initial Draft 0.1 Revised (UtRAM)

CY7C281A

Abstract: CY7C282A CERPACK K73 CY7C281A-45JC
Contextual Info: 1CY 7C28 2A CY7C281A CY7C282A 1K x 8 PROM Features tical, but are packaged in 300-mil and 600-mil-wide packages respectively. The CY7C281A is also available in a 28-pin leadless chip carrier. The memory cells utilize proven EPROM floating-gate technology and byte-wide intelligent programming algorithms.

Contextual Info: Formosa MS Surface Mount Bridge Rectifier DB151S THRU DB157S Glass passivated type Features DBS Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. .310 7.9 .290(7.4) + .255(6.5)

Contextual Info: Formosa MS Surface Mount Bridge Rectifier DB151S THRU DB157S Glass passivated type Features DBS Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. .310 7.9 .290(7.4) + For surface mounted applications.

Contextual Info: Formosa MS Surface Mount Bridge Rectifier DB151 THRU DB157 Glass passivated type Features DB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. + .255 6.5 .245(6.2) For surface mounted applications.

Contextual Info: Formosa MS Low VF Chip Schottky Barrier Diodes SL22 THRU SL24 Silicon epitaxial planer type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2) 0.012(0.3) Typ.

Contextual Info: Formosa MS Chip Silicon Rectifier FM201-L THRU FM207-L Glass passivated type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8) 0.012(0.3) Typ.

Contextual Info: Formosa MS SKFM2020-D2 THRU SKFM20200-D2 Chip Schottky Barrier Diodes Silicon epitaxial planer type Features D2PAK Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.402 10.20

Contextual Info: Formosa MS Chip Silicon Rectifier FM4001-L THRU FM4007-L Glass passivated type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8) 0.012(0.3) Typ.

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM0520-N THRU FM0560-N Silicon epitaxial planer type Features SOD-323 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.106 2.7 0.091 (2.3)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM120 THRU FM1100 Silicon epitaxial planer type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2) 0.012(0.3) Typ.

Contextual Info: Formosa MS MELF Silicon Rectifier FSM101 THRU FSM106 Fast recovery type Features MELF Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. .205 5.2

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM0520-M THRU FM05100-M Silicon epitaxial planer type SOD-123 Features Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.154 3.9 0.138(3.5)

Contextual Info: Formosa MS Chip Silicon Rectifier HFM101 THRU HFM107 Ultra fast recovery type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.185 4.8 0.173(4.4) 0.012(0.3) Typ.

Contextual Info: Formosa MS FFM101-MH THRU FFM107-MH Chip Silicon Rectifier Fast recovery type Features SOD-123H Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.146 3.7 0.130(3.3) 0.012(0.3) Typ.

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM320-AL THRU FM3100-AL Silicon epitaxial planer type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)

Contextual Info: Formosa MS Chip Silicon Rectifier HFM101-M THRU HFM107-M Ultra fast recovery type Features SOD-123 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.154 3.9 0.138(3.5) 0.012(0.3) Typ.

Contextual Info: Formosa MS Chip Silicon Rectifier FFM101-M THRU FFM107-M Fast recovery type Features SOD-123 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.161 4.1 0.146(3.7) 0.012(0.3) Typ.

Contextual Info: Formosa MS Chip Silicon Rectifier FFM201-L THRU FFM207-L Fast recovery type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8) 0.012(0.3) Typ.

Contextual Info: Formosa MS Chip Silicon Rectifier FFM101-M THRU FFM107-M Fast recovery type Features SOD-123 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.154 3.9 0.138(3.5) 0.012(0.3) Typ.