CODE MARKING CIJ Search Results

Contextual Info: WILLAS General Purpose Transistors 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE FM120-M+ THRU MMBT3906TT1 FM1200-M+ Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.

ATSAMR21G18A

Abstract: 2540AT
Contextual Info: USER GUIDE Atmel SAM R21 Xplained Pro Preface The Atmel SAM R21 Xplained Pro evaluation kit is a hardware platform to evaluate the ATSAMR21G18A microcontroller. Supported by the Atmel Studio integrated development platform, the kit provides easy access to the features of the Atmel ATSAMR21G18A and explains how to

Contextual Info: I I I I T PRODUCT NUMBER 8 5 6 4 9 —XYY 34.5 ref 8 REF. 2 REF. RECOMMENDED PCB LAYOUT HOLE PATTERN AT COMPONENT SIDE NOTES: 1 BODY MAT’L: LIQUID CRYSTAL POLYMER 30% GLASS FLAME RETARDANT ACC. UL 94-V O COLOR NATURAL. 2 PIN MAT’ L: PHOSPHOR BRONZE. 3 PLATING ON PRESS FIT AREA SnPb

RCB256RFR2-XPRO User Guide

Abstract: User Guides
Contextual Info: USER GUIDE RCB256RFR2-XPRO User Guide Introduction This user guide describes how to get started with the Atmel RCB256RFR2XPRO extension board. The extension boards is targeted for evaluating the features of the Atmel ATmega256RFR2 wireless SoC with PCB antenna.

Contextual Info: • p w r t f af M akrnl CofparaBon t r i b dritoarad on _ • S w ift to Mt ta ba rtirlrm f. iwraduead or uaad. - *-* •-“- y - -*-* to g m M to M o a t to • or In part tar Manufatto» ar aaia to anwana amar M i tmptoial — I 4

xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

xilinx part marking

Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

XILINX/part marking Hot

Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

IRF2525

Abstract: 91641
Contextual Info: PD 9.1641 International Iö R Rectifier IRF2525 PRELIMINARY HEXFET Power MOSFET • • • • • Advanced Process Technology Dynamic dv/dt Rating 150°C Operating Temperature Fast Switching Fully Avalanche Rated V oss = 2 5 0 V RDS on = 0 .1 2 5 Q Description

diode sy 171 10

Abstract: "DIODE" SY 171 1 g
Contextual Info: PD - 9.12 64 C International IOR Rectifier IRF7606 HEXFET Power MOSFET Generation V Technology Ultra Low On-Resistance P-Channel MOSFET Very Small SOIC Package Low Profile <1.1 mm Available in Tape & Reel Fast Switching V qss = -30V f^DS(on) = 0.09Î2

Contextual Info: S ta n d a rd P r o d u c t PM I I PMC-Sierra, Inc. / PREUMINARY INFORMATION PM5361 TUPP SONET/SDH TRIBUTARY UNIT PAYLOAD PROCESSOR FEA TU RES • Configurable, multi-channel, payload processor for alignment of SONET virtual tributaries VTs or SDH tributary units (TUs). Processes an STS-3 or STM-1 byte

P600L-72

Abstract: P600E-12 P600L fuse MIL-F-12456 P600L-R 70720 MIL-F-23419 P600L-72-5
Contextual Info: fì€ M , INC 11525 Sorrento Valley Rd. San Diego, California 92121 858 481-0210 SPECIFICATION SHEET P600L CURRENT LIMITING FUSE REVISION: DATE: DRAWN: CHECKED: APPROVED: ECN: A B C D E F G H 11/87 5/90 5/92 7/94 6/95 12/95 6/96 1/97 Jeff Montgomery Yan Ma

qml-38535

Abstract: 87C51 T0D47Q 5962-87684 ccpm
Contextual Info: REVISIONS LTR DESCRIPTION DATE APPROVED YR-M0-DA A Add case outline U. Add vendor cage 18325. Add programming method B. Changes 4.3.1c and 4.3.1e. Editorial changes throughout. 89-03-01 W. Heckman B Add device type 02, editorial changes throughout. Add test

54ACTS85

Abstract: HL6 smd qml-38535 CDFP4-F16 GDIP1-T16 CDFP4-F16 comparator
Contextual Info: REVISIONS LTR DESCRIPTION APPROVED DATE YR-MO-DA REV SHEET REV SHEET REV REV STATUS OF SHEETS SHEET PREPARED BY Thanh V . Nguyen PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE

PC410L

Abstract: PC410LENIP mark code t4 X3 diode PC410LEN E64380 transistor uxr phototransistor TIL 51 5911UG uxr transistor
Contextual Info: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATIONFOR PHOTOCOUPLER. MODEL No. PC410L o Business dealing name PC410LENIP Business dealing name PC410LEYIP Specified for Enclosed please find copies of the Specifications which consists of 15 pages including cover.

Contextual Info: PRELIM1 PRELIMINARY l i PIONEER ” S E M IC O N D U C T O R PI74FCT16500T PI74FCT162500T CORPO OR R AA TT II O O N II 11 I 11 I I I I 11 11 I 11 11 I I I I I 11 11 I I I 11 11 11 11 11 I I I I 11 I I I II II 11 I I Fast CMOS 18-Bit Registered Transceivers

pj 929 diode picture

Abstract: bf471 A7R SMD Transistor TDA8391 transistor f488 tda8351 pin-compatible tda1000 Germanium drift transistor marking 3U 3T 3C diode germanium transistor
Contextual Info: Philips Sem iconductors Semiconductors for Television and Video Systems Contents PART A page SELECTION GUIDE Functional index 5 Numerical index 17 Maintainance list 27 GENERAL Quality 31 Pro Electron type numbering system for Discrete Semiconductors 31 Pro Electron type numbering system for Integrated Circuits

D51820

Abstract: ds1820 1 wire temperature sensor termometer control circuit diagram
Contextual Info: DS1820 P R E L IM IN A R Y DALLAS SEMICONDUCTOR DS1820 1-W ire Digital Thermometer PIN ASSIGNMENT FEATURES • U n iq u e 1- W ir e in te rfa c e re q u ire s o n ly o n e p o rt pit for c o m m u n ic a tio n • M u ltid ro p c a p a b ility s im p lifie s d is trib u te d te m p e ra iu re

ATS 16Mhz

Abstract: 80C51 MSU2958 MSU2958C16 MSU2958C25 MSU2958C40 ZD 103 ma
Contextual Info: •■ MSU2958 Preliminary MOSEL VITEUC INC. Ü September 1999 8 - Bit Micro-controller Product List with 3P.KB Hash embedded MSU2958 C l 6 ,16 MHz 32 KB internal memory MCU MSU2958 C25, 25 MHz 32 KB internal memory MCU MSU2958 C40,40 MHz 32 KB internal memory MCU

Contextual Info: DS1820 PRELIMINARY DALLAS SEMICONDUCTOR FEATURES DS1820 One-Wire Digital Thermometer PIN ASSIGNMENT • Unique 1-W ire interface requires only one port pin for comm unication • M ultidrop capability sim plifies distributed temperature sensing applications

A 4506 Optocoupler

Abstract: optocoupler HP 450 f 8 pin ic A 4506 HP 450 opto coupler CUB MARKING CODE HCNW4506 4506 mosfet inverter optocoupler 450
Contextual Info: 1 T JnM H E W L E T T * 1 SUM PA C K A R D Intelligent Power Module and Gate Drive Interface Optocouplers T e c h n ic a l D a ta h c pl -4 5 0 6 HCPL-0466 HCNW4506 F ea tu res Applications • Perform ance Specified for Common IPM A pplications over Industrial Tem perature

HCTS541

Abstract: qml-38535 qml38535
Contextual Info: REVISIONS LTR DATE DESCRIPTION APPROVED Y R -M O -D A REV SHEET REV SHEET 15 16 REV STATUS OF SHEETS PM IC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE REV SHEET 1 2 3 4