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Catalog Datasheet	Type	Document Tags	PDF
BGA 15X15 Abstract: CMBA024949 T725 Contextual Info: Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :	Original	CMBA024949 CMBA024949 UL94-V0) 15x15 BGA 15X15 T725	PDF

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BGA 15X15

Abstract: CMBA024949 T725
Contextual Info: Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :

Original

CMBA024949 CMBA024949 UL94-V0) 15x15 BGA 15X15 T725

PDF