CHIP DIE Search Results

Contextual Info: Microwave Components Isolators Chip Multilayer Hybrid Couplers Chip Multilayer Hybrid Baiuns Field-Effect Transistors MESFET Chip Multilayer Antennas Chip Dielectric Antennas Dielectric Resonators (RESOMICS ) High-Frequency Monolithic Ceramic Capacitors

Contextual Info: SIGC42T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling This chip is used for: • IGBT-Modules G Applications: • drives Chip Type VCE ICn Die Size Package SIGC42T60SNC

code CFK

Abstract: HP41952A 40mhz ceramic FILTER
Contextual Info: Cal-Chip Electronics, Incorporated CFK SERIES Multi-layer Chip EMI Suppression Filter OUTLINE • Cal-Chip’s multi-layer chip EMI suppression filter is suitable as a noise filter counteracting personal computer and other highspeed digital signal line noise. Dielectric material and ferrite

Contextual Info: GPP CHIP GPP DIE CONSTRUCTION SMX CROSS SECTION 4/98 MOLDING COMPOUND CHIP

SIGC42T60SNC

Abstract: 7272-S
Contextual Info: SIGC42T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling This chip is used for: • IGBT-Modules G Applications: • drives Chip Type VCE ICn Die Size Package SIGC42T60SNC

SIGC42T60SNC

Abstract: A001 BSM50GD60DLCE3226
Contextual Info: Preliminary SIGC42T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE This chip is used for: • IGBT-Modules G Applications: • drives ICn Die Size

Contextual Info: SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE SIGC07T60NC 600V This chip is used for: • IGBT-Modules G Applications: • drives ICn 6A Die Size

BUP213

Abstract: SIGC25T120C
Contextual Info: SIGC25T120C IGBT Chip in NPT-technology FEATURES: • 1200V NPT technology • 200µm chip • positive temperature coefficient • easy paralleling This chip is used for: • BUP 213 C Applications: • drives Chip Type SIGC25T120C VCE ICn 1200V 15A G Die Size

bup213

Abstract: BUP21
Contextual Info: SIGC25T120C IGBT Chip in NPT-technology FEATURES: • 1200V NPT technology • 200µm chip • positive temperature coefficient • easy paralleling This chip is used for: • BUP 213 C Applications: • drives Chip Type SIGC25T120C VCE ICn 1200V 15A G Die Size

SIGC07T60NC

Contextual Info: SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE SIGC07T60NC 600V This chip is used for: • IGBT-Modules G Applications: • drives ICn 6A Die Size

SIGC07T60NC

Contextual Info: SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE SIGC07T60NC 600V This chip is used for: • IGBT-Modules G Applications: • drives ICn 6A Die Size

Contextual Info: SIGC25T120C IGBT Chip in NPT-technology FEATURES: • 1200V NPT technology • 200µm chip • positive temperature coefficient • easy paralleling This chip is used for: • BUP 213 C Applications: • drives Chip Type SIGC25T120C VCE ICn 1200V 15A G Die Size

Contextual Info: 8 Microwave Components Isolators Chip Multilayer Hybrid Couplers Field-Effect Transistors MESFET Chip Multilayer Antennas Chip Dielectric Antennas Dielectric Resonators (RESOMICS ) High-Frequency Monolithic Ceramic Capacitors High-Frequency Microchip Capacitors

CR32 Resistor

Abstract: CR10 resistor CR32 kyocera marking code r010 surface mount diode cr21 resistor 100k resistor network 0.25w resistor 1/4 diode 400V 4A cr21 kyocera 1K Ohm resistor 1/8W
Contextual Info: chip resistors • chip resistor arrays • chip resistor networks Chip Resistors Thick Film Chip Resistors CR05/CR10/CR21/CR32 Series . 3-4 CR63 .5

CR32 kyocera

Abstract: resistor kyocera CR10J CR32 avx crc avx CR32 Resistor CRB2 kyocera cr resistor CR32 resistor kyocera 102
Contextual Info: KYOCERA Chip Resistors • Chip Resistor Arrays • Chip Resistor Networks Chip Resistors Thick Film Chip Resistors CR05/CR10/CR21/CR32 Series .1-2 CR63 Series .3

Contextual Info: 8-BIT SINGLE CHIP MICROCONTROLLER Under Development LC868B64A/48A/32A LC868B64A 8-bit single chip microcontroller with on chip 64K-byte ROM and on chip 1.5K -byte RAM LC868B48A 8-bit single chip microcontroller with on chip 48K-byte ROM and on chip 1.5K -byte RAM

ocr7

Abstract: EVA86000 LC868B32A LC868B48A LC868B64A LC8680 CSA12.0MTZ MURATA irc274
Contextual Info: 8-BIT SINGLE CHIP MICROCONTROLLER Under Development LC868B64A/48A/32A LC868B64A 8-bit single chip microcontroller with on chip 64K-byte ROM and on chip 1.5K -byte RAM LC868B48A 8-bit single chip microcontroller with on chip 48K-byte ROM and on chip 1.5K -byte RAM

Contextual Info: rev.2.0 08.05.15 DUV325-CHIP • • • • • Deep Ultraviolet Light Emission Source 325 nm, 1.5 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV325-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different

Contextual Info: rev.2.0 07.05.15 DUV310-CHIP • • • • • Deep Ultraviolet Light Emission Source 310 nm, 1.6 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV310-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different

10 micro farad 16V capacitor

Abstract: capacitor 100nf 100v 0603 x7r capacitor 220nf 50v 0805 datasheet by avx Silver mica capacitor 68pf 100V lt 6249 3 pf Silver Dipped Mica Capacitor capacitor 10nf surface mount 1812 ceramic capacitor 100nF 104 CAP 100nF 50V 0603 2.2nf 2000v
Contextual Info: AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents MLC Chip Capacitors General Description How to Order - AVX Part Number Explanation C0G NP0 Dielectric General Specifications Typical Characteristic Curves Capacitance Range X7R Dielectric

Contextual Info: rev.2.0 07.05.15 DUV265-CHIP • • • • • Deep Ultraviolet Light Emission Source 265 nm, 0.9 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV265-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different

Contextual Info: rev.2.0 08.05.15 DUV280-CHIP • • • • • Deep Ultraviolet Light Emission Source 280 nm, 2.0 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV280-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different

Contextual Info: rev.2.0 08.05.15 DUV340-CHIP • • • • • Deep Ultraviolet Light Emission Source 340 nm, 1.5 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV340-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different

chip antennas

Abstract: MMC Electronics America Mitsubishi Materials Antenna AHD1403 AHD1403-244ST25 surface mount bluetooth antenna
Contextual Info: Surface Mountable Dielectric Chip Antennas AHD1403-244ST Series Surface Mountable Dielectric Chip Antennas AHD1403-244ST Series 1. Features We have developed high performance dielectric chip antennas suitable for mobile information devices, especially suitable for BluetoothTM. They