CHAMFER DESIGNATION Search Results

Chamfer Designation

Abstract: CuZn36Pb3
Contextual Info: REV 702B3625 c .750 ± .010 MATERIALS: 1 TERMINAL - BRASS, BS EN12164, CuZn36Pb3, HALF HARD GOLD PLATED .00003 OVER NICKEL .00005 OVER COPPER OR TIN PLATED 2 BOARD - FR4 .3 0 0 .4 5 0 .075 6 PLACES .0 5 0 X 4 5 ° CHAMFER . 032. CODE* ADD APPROPRIATE DESIGNATION FOR TERM. FINISH

Contextual Info: REVISION K No OF POS x .050 + .015) .002 .005 FIG. 1 (No OF POS x .050) - .050 (TOL NON-ACCUM) R.001 "A" DO NOT SCALE FROM THIS PRINT .250 .180 CL .025 (TYP) CL NOTCH SPECIFICATION LEAVE BLANK: NO NOTCH -C: CHAMFER (SEE SHEET 2, FIG 2) (7 POSITION ONLY)

FAA-PMA

Abstract: M39029/1-101 102TL2164-70 3 POSITION TOGGLE SWITCH 6 pin 102TL
Contextual Info: F O - 5 5 1 1 1 -A HONEYWELL PART NUMBER 102TL2164-70 FAA-PMA -CHAMFER AS REQUIRED FOR MOUNTING HARDWARE A S S E M B L Y /7 A A CIRCUIT MADE WITH TOGGLE LEVER NATURAL ALUMINUM FINISH CLEAR ANODIZED KEYW AY SIDE CENTER REV DOCUMENT 11 0008691 —A 3 *2 A

SPP-010

Abstract: Chamfer Designation MO-222
Contextual Info: LGA Package 81-Lead 11.25mm x 11.25mm × 2.32mm aaa Z (Reference LTC DWG# 05-08-1809 Rev Ø) 11.250 BSC X Y 10.160 BSC 0.605 – 0.665 0.25 × 45° CHAMFER ×3 2.17 – 2.47 9 8 7 0.605 – 0.665 MOLD CAP 11.250 BSC SUBSTRATE 0.27 – 0.37 Z 1.90 – 2.10

SPP-010

Abstract: Chamfer Designation
Contextual Info: LGA Package 108-Lead 15mm x 11.25mm × 2.32mm (Reference LTC DWG # 05-08-1757 Rev Ø) DETAIL A aaa Z 15 BSC X 13.97 BSC 2.22 – 2.42 Y 0.22 × 45° CHAMFER J H G MOLD CAP 11.25 BSC SUBSTRATE F 10.16 BSC E 0.27 – 0.37 PAD 1 CORNER D 1.27 BSC Z // bbb Z

Contextual Info: REVISION R No OF POS x .050 + .015) .002 .005 (No OF POS x .050) - .050 (TOL NON-ACCUM) R.001 DO NOT SCALE FROM THIS PRINT "A" .250 .180 CL SEE NOTE 2 R OPTIONS LEAVE BLANK: NO KEY R -C: CHAMFER (SEE SHEET 2, FIG 2) (7 POSITION ONLY) -L: FRICTION LOCK R

Contextual Info: REVISION W No OF POS x .050 + .015) .002 .005 (No OF POS x .050) - .050 (TOL NON-ACCUM) R.001 DO NOT SCALE FROM THIS PRINT "A" .250 .180 CL SEE NOTE 2 OPTIONS LEAVE BLANK: NO KEY -C: CHAMFER (SEE SHEET 2, FIG 2) (7 POSITION ONLY) -L: FRICTION LOCK (SEE SHEET 2, FIG 3)

MO-193 footprint

Abstract: CA 4570 QCI-39000
Contextual Info: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Microcontroller Products

vsop 18

Contextual Info: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products

28CXX

Abstract: 1117 TO92
Contextual Info: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products

tip 3035 transistor

Abstract: K04-064 28CXX flash memory 28CXX eprom 28cxx Ic 7423 K04-104 K04-049 tip 222 TRANSISTOR tip 147 TRANSISTOR equivalent
Contextual Info: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products

Ic 7423

Abstract: tip 3035 transistor ic SL 1626 31.76 DS00049 R0026
Contextual Info: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products

QCI-39000

Contextual Info: SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 11-52

QCI-39000

Abstract: C04090 C04-067
Contextual Info: SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 11-52

c1651

Abstract: 200B 28CXX CLCC footprint 14047 Packaging Diagrams HA 1100 soic
Contextual Info: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products

tip 3035 transistor

Abstract: QCI-39000 44l 400 mil Tsop 2 II
Contextual Info: M SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 59

238 pin PGA socket

Contextual Info: LIF PGA Series Description Applications PGA socket for all purposes in electronic area • This highly accommodating socket is designed with many valuable features. It is constructed of high temperature, glass-filled Thermoplastic so it will withstand both I.R.

burndy 12 pin

Abstract: 238 pin PGA socket
Contextual Info: BURNDY LIF PGA Series Description Applications • This highly accommodating socket is designed with many valuable features. It is constructed of high temperature, glass-filled Thermoplastic so it will withstand both I.R. and vapor phase solder reflow temperatures

RS-186E

Abstract: TDP08H0SB1 TDP08H0SBD1
Contextual Info: ! NEW TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • I electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of

Contextual Info: ! NEW TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • I electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of

RS-186E

Abstract: TDP08H0SBD1
Contextual Info: TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • H electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of

RG5 coaxial cable size

Abstract: RG5 coaxial cable RG-402 RG-405 Chamfer Designation
Contextual Info: Instruction Sheet 408-9333 Blind Mate 3.5 mm Connectors for Semi-Rigid RG-402 and RG-405 Coaxial Cables was IS 9333 10 MAR 09 Rev A PROPER USE GUIDELINES Cumulative Trauma Disorders can result from the prolonged use of manually powered hand tools. Hand tools are intended for occasional use and low volume

Contextual Info: REV. | A j UNLES5 OTHERWISE NOTED TITLE: DIMENSIONS ARE IN INCHES No OF MOLDED MAX BOW ALIGNMENT PINS ALLOWED .003 2 -1 4 .004 1 5 -2 8 .006 2 9 -3 6 .008 - ONE PLACE DECIMALS ±.1 [2.54]TH R EE PLACE DECIMALS ± . 0 0 5 [.1 3 ] ANGLES TWO PLACE DECIMALS ±.01 [.2 5 ]F 0 U R PLACE DECIMALS ± . 0 0 2 0

Contextual Info: Optical Encoders SERIES 62P Low Cost, PC Mount APPLICATIONS • Automotive Controls • White Goods • Audio FEATURES • Low Cost • Compact Size • PC Mount • No De-Bouncing Required • Reliable, Up to 2 Million Cycles • Choice of Detent and Pushbutton Force