CHAMFER DESIGNATION Search Results

FAA-PMA

Abstract: M39029/1-101 102TL2164-70 3 POSITION TOGGLE SWITCH 6 pin 102TL
Contextual Info: F O - 5 5 1 1 1 -A HONEYWELL PART NUMBER 102TL2164-70 FAA-PMA -CHAMFER AS REQUIRED FOR MOUNTING HARDWARE A S S E M B L Y /7 A A CIRCUIT MADE WITH TOGGLE LEVER NATURAL ALUMINUM FINISH CLEAR ANODIZED KEYW AY SIDE CENTER REV DOCUMENT 11 0008691 —A 3 *2 A

68L SOT 353

Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
Contextual Info: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58

Contextual Info: ! NEW TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • I electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of

RS-186E

Abstract: TDP08H0SBD1
Contextual Info: TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • H electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of

RG5 coaxial cable size

Abstract: RG5 coaxial cable RG-402 RG-405 Chamfer Designation
Contextual Info: Instruction Sheet 408-9333 Blind Mate 3.5 mm Connectors for Semi-Rigid RG-402 and RG-405 Coaxial Cables was IS 9333 10 MAR 09 Rev A PROPER USE GUIDELINES Cumulative Trauma Disorders can result from the prolonged use of manually powered hand tools. Hand tools are intended for occasional use and low volume

Contextual Info: REV. | A j UNLES5 OTHERWISE NOTED TITLE: DIMENSIONS ARE IN INCHES No OF MOLDED MAX BOW ALIGNMENT PINS ALLOWED .003 2 -1 4 .004 1 5 -2 8 .006 2 9 -3 6 .008 - ONE PLACE DECIMALS ±.1 [2.54]TH R EE PLACE DECIMALS ± . 0 0 5 [.1 3 ] ANGLES TWO PLACE DECIMALS ±.01 [.2 5 ]F 0 U R PLACE DECIMALS ± . 0 0 2 0

kester sn96.5

Abstract: Tyco G13 Connector IPC-S-815 DIODE MSDS L012 Kester
Contextual Info: Application Specification 114-13255 Surface Mount Technology SMT End Cap Connector Assembly and Cover 26 MAR 09 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 .

Contextual Info: 3 PRODUCT SEE 4 NUMBER SHEET 16 A A EVEN C O L U M N C O N T A C T ROW ID HOUSING ODD COLUMN C O N T A C T ROW ID O D D AND EVEN C O L U M N S ARE O F F S E T B C C 13.10 t ROW A EVEN COLUMNS GND CENTERS D I . 25 <£. ROW A O D D COLUMNS ROW A TO FIRST GROUND

AAAM

Abstract: ceramic pin grid array package MS-017 10CT CERAMIC PIN GRID ARRAY 144 pins AK 1040
Contextual Info: A .145 100 A .008 1 .100 SECTIDN A -A ALL SPACES A .0215 .0165 ^ f — A — A .150 .090 L lì .030 .010 A <0 B c c / iX .125 .070 Al — 1 —A A A Q \ •A- D A ®®®®©©©©©© ®®®©©©©©®® ®®©© ® ® ©© ©©© © © ® SEATING PLANE

S71VS

Abstract: S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R
Contextual Info: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet

20L-28L

Abstract: ics1720
Contextual Info: INTEGRATED CIRCUIT Sb E J> m MÛ2575Ô D00Q330 T7ê • IGS ICS1720 I [ K l Integrated Circuit Systems, Inc. Advance Information QuickSaver1 Controller for Nlckel-Metal Hydride Batteries Features Applications • • • • • • • • • • • •

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing V416.27x27 416 PLASTIC BALL GRID ARRAY PACKAGE CAVITY DOWN Rev 0, 9/11 Ø0.100 M C Ø0.250 M C A B 3 PIN A1 CORNER EPOXY ENCAPSULANT Ø1.00(3X). REF Ø0.5-0.7(416 X) 1.00 A B C D E F G H J

TQFP 100 PACKAGE footprint

Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
Contextual Info: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness

UGE3126AY4

Abstract: si-e9000
Contextual Info: UGE 3126 AY4 High Voltage Rectifiers Hochspannungsgleichrichter VRRM VV RMS VdT V V V 24000 9000 4000 Standard VRRM = 24000 V VdT = 4000 V IF(AV)M = 2.0 A Power Designation Anode Types UGE 1112 AY4 Si-E 9000 / 4000-0.7 Kathode Symbol Test Conditions IF(RMS)

7472 ci

Abstract: uge 1112 AY4
Contextual Info: UGE 1112 AY4 High Voltage Rectifiers Hochspannungsgleichrichter VRRM VV RMS VdT V V V 8000 3000 1300 Standard VRRM = 8000 V VdT = 1300 V IF(AV)M = 4.2 A Power Designation Anode Types UGE 1112 AY4 Si-E 3000 / 1300-2.5 Kathode Symbol Test Conditions IF(RMS)

S25FL256* spansion

Abstract: S25FL256 S70FL01GS S25FL128* spansion SPI flash PCB LAYOUT GUIDE S70FL01 S25FL512 S25FL128S S25FL256S S29FL128
Contextual Info: Spansion Serial Peripheral Interface SPI FL Flash Layout Guide Application Note 1. Introduction The Spansion serial peripheral interface (SPI) flash devices are high speed synchronous access non-volatile memory devices. Standard high speed layout practices should be followed when performing printed circuit

Contextual Info: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet

ball 128 mcp

Abstract: MCP NAND, DRAM, NOR LJ512 S29NS-P S72NS128PD0 S72NS256PD0 S72NS512PD0 S72NS-P MCP NAND D3-D16
Contextual Info: S72NS-P MCP/PoP Memory System Solutions MirrorBit Flash Memory and DRAM 128/256/512 Mb 8/16/32 M x 16 bit , 1.8 Volt-only, Multiplexed Simultaneous Read/Write, Burst Mode Flash Memory 128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus S72NS-P MCP/PoP Memory System Solutions Cover Sheet

L1-L10

Abstract: MD-12 WS128N dc m7 footprint JESD 95-1, SPP-010 top mark e5 S71WS-N S29WS128N S29WS256N S71WS128NB0
Contextual Info: S71WS-N Stacked Multi-Chip Product MCP 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with CellularRAM S71WS-N Cover Sheet Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information,

20L-28L

Abstract: ALL LAPTOP MOTHERBOARD CIRCUIT DIAGRAM
Contextual Info: INTEGRATE] CIRCUIT SbE D • U&2 5 7 5 & DQ003 02 DOB m i G S ICS2628 Integrated Circuit Systems, Inc. Advance Information 3 Volt Motherboard Frequency Generator 'T - z o - z y Features Description • • Operates from a single 3V to 5V supply Two standard parts, ICS2628-022 and ICS2628-034

S29WS128N

Abstract: S29WS256N S71WS128NB0 S71WS128NC0 S71WS256NC0 S71WS256ND0 S71WS512N S71WS-N marking YJ AM
Contextual Info: S71WS-N Stacked Multi-Chip Product MCP 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with CellularRAM S71WS-N Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion

S72NS256PD0

Abstract: S72NS512PD0 S72NS-P S29NS-P S72NS128PD0
Contextual Info: S72NS-P Based MCPs/PoPs MirrorBit Flash Memory and DRAM 128/256/512 Mb 8/16/32 M x 16 bit , 1.8 Volt-only, Multiplexed Simultaneous Read/Write, Burst Mode Flash Memory 128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus S72NS-P Based MCPs/PoPs Cover Sheet

S71VS256RD0AHK3M

Contextual Info: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet

Contextual Info: Instruction Sheet 408-6788 Hand Crimping Tool and Cable Preparation Kit 59981-1 23 AUG 13 Rev L Cumulative Trauma Disorders can result from the prolonged use of manually powered hand tools. Hand tools are intended for occasional use and low volume applications. A wide selection of powered application equipment for extended-use, production operations is available.