CERDIP Z PACKAGE Search Results

Lattice Semiconductor Package Diagrams 256-Ball fpBGA

Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
Contextual Info: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

d1684

Abstract: 84-Pin QFN FCBGA304 1704B MachXO2 Family Lattice Semiconductor Package Diagrams 256-Ball fpBGA 132-ball 284-BA x45e2
Contextual Info: Package Diagrams November 2012 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

XL2816A

Abstract: XLS2816 XLS2816A
Contextual Info: w MICROELECTRONICS, INC. O Q i C A A L Z O ! UM 2 K X 8 Electrically E rasab le P R O M FEATURES PIN CONFIGURATION • Fast Read Access Times — 250ns, 300ns, 350ns, 450ns 24 Pin CERDIP Type "C" Package ■ 5 Volt-only Operation — Including Write A 7[ 1

27C400 eprom

Abstract: 27C400 AU-AIS intel i5 27C400-150V10 27C400-200V10 intel 2802 D814 diagram BY524 D814
Contextual Info: 27C400 4M 256K x 16 or 512K x 8 CHMOS EPROM • . • Word-Wide or Byte-Wide Configurable ■ 4M 40-Pin Mask ROM Compatible -4 0 -L e a d CERDIP Package ■ Low Power Dissipation — 50 m A M ax A c tiv e @ 5 M H z — 100 ju.A Max Standby ■ High Performance

CDFP3-F28

Abstract: GDIP1-T28 HS1-1840RH-8 HS1-1840RH-Q HS-1840RH HS9-1840RH-Q 1840RH HS1840RH
Contextual Info: HS-1840RH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection March 1995 Features Pinouts • Radiation Environment - Gamma Rate γ 1 x 108 RAD(Si)/s - Gamma Dose (γ) 2 x 105 RAD(Si) HS1-1840RH 28 LEAD SIDEBRAZE CERDIP

Contextual Info: PACKAGE DIAGRAM O U T L I N E S CERDIP C o n t in u e d REV DCN 04 17521 _ DESCRIPTION_ U PD A TE D 05 I8089 REVI SED 06 ? ? ' TO S T A N D A R D I Z E A, CHA NGED — — rh r~ i >=zp— ^ Q, & S DIMENSIONS b1 MIN DATE APPROVED 06/20/90

14.5M 1982

Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
Contextual Info: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

Contextual Info: HS-1840RH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection March 1995 Features • Pinouts Radiation Environment - Gamma Rate ^ 1 x 108 RAD(Si)/s - Gamma Dose (y) 2 x 105 RAD(Si) HS1-1840RH 28 LEAD SIDEBRAZE CERDIP

Contextual Info: *S Y N E R G Y L 0 G IC ORDERIN G INFORMATION S E M IC O N D U C T O R SY XXX XXX XXX H SPECIAL PROCESSING if any B = Burn-In TR= Tape and Reel H TEM PERATURE RANGE C= I= Commercial Industrial H PACKAGE IDENTIFIER D= F= J= P= Z= X= H Cerdip Cerpack PLCC (Plastic Leaded Chip Carrier)

Contextual Info: *SYNERGY lo g ic o r d e r in g in fo rm a tio n S E M IC O N D U C T O R SY XXX XXX XXX SPECIAL PROCESSING if any B = Burn-In TR = Tape and Reel TEM PERATURE RANGE C= I= Commercial Industrial PACKAGE IDENTIFIER D= F= J= P= Z= X= Cerdip Cerpack PLCC (Plastic Leaded Chip Carrier)

IC LM 7812

Contextual Info: THOM SO N MIL ET S P A T I A U X SSE D • =102bô72 DDD 0 4^ S 3ai ■ THCM LINEAR COMPONENTS DESCRIPTION PRODUCT PACKAGE en o_ CO GO c o LU 1— "O CN a L l_ Z ït ; • £ <r> <=> O ' « w '• KJ LU s 5 c o LU COMPARATORS - SINGLE LM 111 TO 99 CERDIP 8

OP42

Abstract: TL072 AD712 LT1057 MC34082 OP215 OP249 pm7545 c3999
Contextual Info: a Dual, Precision JFET High-Speed Operational Amplifier OP249 PIN CONNECTIONS +IN A 3 A B – + + – 4 V– 8 V+ 7 OUT B 2 1 20 19 NC 3 V+ NC OUT A 1 –IN A 2 NC 20-Terminal LCC RC Suffix 8-Lead Cerdip (Z Suffix), 8-Lead Plastic Mini-DIP (P Suffix) OUT A

Contextual Info: PACKAGE DIAGRAM OUTLIN ES CERDIP C o n tin u e d R EV DON 06 175 17 _DESCRIPTION_ U P D A TE D TO S T A N D A R D I Z E DATE APPROVED DWG e " ü cz? cz? mp czp ü ü ü Ü Ü Ü cz? S1 ill A -SEATING P L A N E NOTES: ( U N L E S S OTHERWISE SPECI FI ED)

AD797

Contextual Info: 21 - • » 09 • A * i i i i :® E : 0 . 9 n V / / 'H z 61kHz ♦THD:-120dB («20kHz) I x - h :20V /ß n tt s m x tiV B . ♦ i Ü Ä S ü t :50mA a fé x?im-AW± v o n sm 'm V o w ssssgö AtlMTmS. • t.° V'SfUt® 8-Pin Plastic Mini-DIP (N), Cerdip (Q) and SOIC (R)

CERAMIC LEADLESS CHIP CARRIER

Abstract: cerdip z PACKAGE DIODE SMD A6 cy7c291 CY7C293A-30QMB PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC w14 smd transistor CY7C291A CY7C292A CY7C293A
Contextual Info: 1CY 7C29 2A CY7C291A CY7C292A/CY7C293A 2K x 8 Reprogrammable PROM Features identical, but are packaged in 300-mil 7C291A, 7C293A and 600-mil wide plastic and hermetic DIP packages (7C292A). The CY7C293A has an automatic power down feature which reduces the power consumption by over 70% when deselected. The 300-mil ceramic package may be equipped with an

diode U3J

Abstract: Smd diode u3j csi24 CY7C292A-20DC CY7C291A-35DMB
Contextual Info: CY7C291A CY7C292A/CY7C293A P Yi.PX : V«*1 2K X 8 Reprogrammable PROM identical, but are packaged in 300-mil 7C291A, 7C293A and 600-mil wide plastic and hermetic DIP packages (7C292A). The CY7C293A has an automatic power down feature which reduces the power consumption by over 70% when deselect­

C2716

Abstract: C2717 C2718 w16 SMD CY7C271-45WC cy7c271 cy7c271-45wmb
Contextual Info: CY7C271 CY7C274 32K x 8 Power Switched and Reprogrammable PROM Features HIGH , the 7C271/7C274 automatically powers down into a low-power stand-by mode. The CY7C271 is packaged in the 300-mil slim package. The CY7C274 is packaged in the industry standard 600-mil package. Both the 7C271 and 7C274 are

semiconductor c243

Abstract: transistor c243 CY7C243-45QMB c243 diode c2432 C2434 C2437 cerdip z PACKAGE DN2540N5-G CY7C243
Contextual Info: 1CY 7C24 4 CY7C243 CY7C244 4Kx8 Reprogrammable PROM Features Functional Description • CMOS for optimum speed/power The CY7C243 and CY7C244 are high-performance 4K x 8 CMOS PROMs. The CY7C243 and CY7C244 are packaged in 300-mil-wide and 600-mil-wide packages respectively. The reprogrammable packages are equipped with an erasure window. When exposed to UV light, these PROMs are erased and

7C271

Abstract: 7C274 CY7C271 CY7C274
Contextual Info: 74 CY7C271 CY7C274 32K x 8 Power Switched and Reprogrammable PROM HIGH , the 7C271/7C274 automatically powers down into a low-power stand-by mode. The CY7C271 is packaged in the 300-mil slim package. The CY7C274 is packaged in the industry standard 600-mil package. Both the 7C271 and 7C274 are

C2613

Abstract: C2614 c2615 C2611 C2617 7C261 7C264 CY7C261 CY7C263 CY7C264
Contextual Info: CY7C261 CY7C263/CY7C264 8K x 8 Power-Switched and Reprogrammable PROM Features Functional Description The CY7C261, CY7C263, and CY7C264 are high-performance 8192-word by 8-bit CMOS PROMs. When deselected, the 7C261 automatically powers down into a low-power standby mode. It is packaged in a 300-mil-wide package. The 7C263

semiconductor c243

Abstract: C2432
Contextual Info: CY7C243 CY7C244 4Kx8 Reprogrammable PROM Features Functional Description • The CY7C243 and CY7C244 are high-performance 4K x 8 CMOS PROMs. The CY7C 243 and CY7C244 are packaged in 300-m il-wide and 600-mil-wide packages respectively. The re­ programmable packages are equipped with an erasure w in­

C2716

Abstract: c2717 7C271 K74 2 GATE 7C274 CY7C271 CY7C274 MIL-STD-1835 CERPACK equivalent c271
Contextual Info: 1CY 7C27 4 CY7C271 CY7C274 32K x 8 Power Switched and Reprogrammable PROM HIGH , the 7C271/7C274 automatically powers down into a low-power stand-by mode. The CY7C271 is packaged in the 300-mil slim package. The CY7C274 is packaged in the industry standard 600-mil package. Both the 7C271 and 7C274 are

CY27C256

Abstract: 27C256-70 27C256 27C256-200 27C256-45 27C256 UV 27C256-150 27c256120
Contextual Info: fax id: 3013 1CY 27C2 56 CY27C256 32K x 8-Bit CMOS EPROM Features able in a CerDIP package equipped with an erasure window to provide for reprogrammability. When exposed to UV light, the EPROM is erased and can be reprogrammed. The memory cells utilize proven EPROM floating gate technology and

E4AB

Abstract: 2742C user guide DP-140
Contextual Info: * “> • " C Y 7C 271 C Y7C 274 p vi . pX :, 32K x 8 Power Switched and Reprogrammable PROM Features HIGH , the 7C271/7C274 autom atically powers down into a low-power stand-by mode. The CY7C271 is packaged in the 300-mil slim package. The CY7C274 is packaged in the indus­