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    CERAMIC PIN GRID ARRAY WIRE LEAD FRAME Search Results

    CERAMIC PIN GRID ARRAY WIRE LEAD FRAME Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ101KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KB4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ102MN4A
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ472MA4B
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF

    CERAMIC PIN GRID ARRAY WIRE LEAD FRAME Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Contextual Info: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste PDF

    BTS4020

    Abstract: BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200
    Contextual Info: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials


    Original     		S-WN0815M608-R BTS4020 BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200 PDF

    capacitor 630v

    Abstract: make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0
    Contextual Info: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials


    Original     		S-WN0610M1006-R capacitor 630v make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0 PDF

    XC68307

    Abstract: toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604
    Contextual Info: High-Performance Internal Product Portfolio Overview Issue 10 Fourth Quarter, 1995 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and


    Original     		MOS11 MOS13 BR729/D, XC68307 toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604 PDF

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: IPC-SM-780 nickel corrosion electroplating
    Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


    Original     		Glossary-11 CERAMIC PIN GRID ARRAY wire lead frame IPC-SM-780 nickel corrosion electroplating PDF

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Contextual Info: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    a5657

    Abstract: DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology
    Contextual Info: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD


    Original     		yo980. a5657 DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology PDF

    a5657

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame EOS ESD S 61.1 ZIF socket design guidelines
    Contextual Info: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD


    Original     		PDF

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Contextual Info: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight PDF

    electronic design

    Contextual Info: 7 GHz RF Reed Relay MEDER electronic Characterization of Reed Relays Capable of Handling Frequencies up to 10 GHz Introduction the signal to shield capacitance has dropped to 0.5 pf when the reed is in the open state. For years engineers had thought the best way to switch


    Original     		PDF

    Reed relay pin connections

    Contextual Info: MEDER electronic 7 GHz RF Reed Relay Characterization of Reed Relays Capable of Handling Frequencies up to 10 GHz Introduction the signal to shield capacitance has dropped to 0.5 pf when the reed is in the open state. For years engineers had thought the best way to switch


    Original     		PDF

    smema

    Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
    Contextual Info: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    solid solubility

    Abstract: chemical control process block diagram
    Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm PDF

    PLESSEY CLA

    Abstract: gh160 FG48
    Contextual Info: FEBRUARY 1996 PRELIMINARY INFORMATION DS4375-1.1 CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION BENEFITS The CLA90000 series is the latest family of gate arrays from GEC Plessey Semiconductors GPS . It consists of 14 fixedsize arrays with the option of building larger optimized arrays


    Original     		DS4375-1 CLA90000 PLESSEY CLA gh160 FG48 PDF

    BR931

    Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512
    Contextual Info: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,


    Original     		PDF

    hot wire anemometer

    Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
    Contextual Info: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance


    Original     		PDF

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    microprocessors interface 8086 to 8251

    Abstract: USART 8251 interfacing with 8051 microcontroller to design a full 18*16 barrel shifter design USART 8251 18*16 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design
    Contextual Info: CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS4375 - 2.0 April 1997 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Mitel Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This


    Original     		CLA90000 DS4375 microprocessors interface 8086 to 8251 USART 8251 interfacing with 8051 microcontroller to design a full 18*16 barrel shifter design USART 8251 18*16 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    USART 8251 interfacing with 8051 microcontroller

    Abstract: full 18*16 barrel shifter design 18*16 barrel shifter design USART 8251 USART 8251 expanded block diagram 8251 UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER P4QFP100-GH-1420 interfacing 8051 with ppi USART 8251 interfacing M8490 scsi
    Contextual Info: CLA90000 Series High Density CMOS Gate Arrays DS5500 ISSUE 2.0 INTRODUCTZarlinkION BENEFITS The CLA90000 family of gate arrays from Zarlink Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This


    Original     		CLA90000 DS5500 USART 8251 interfacing with 8051 microcontroller full 18*16 barrel shifter design 18*16 barrel shifter design USART 8251 USART 8251 expanded block diagram 8251 UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER P4QFP100-GH-1420 interfacing 8051 with ppi USART 8251 interfacing M8490 scsi PDF