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    CERAMIC PIN GRID ARRAY CPGA Search Results

    CERAMIC PIN GRID ARRAY CPGA Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MM-015
    Amphenol Cables on Demand Amphenol CS-DSDMDB09MM-015 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Male 15ft PDF
    CS-DSDMDB15MM-002.5
    Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft PDF
    CS-DSDMDB25MF-025
    Amphenol Cables on Demand Amphenol CS-DSDMDB25MF-025 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Female 25ft PDF
    CS-DSDMDB37MF-010
    Amphenol Cables on Demand Amphenol CS-DSDMDB37MF-010 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft PDF

    CERAMIC PIN GRID ARRAY CPGA Datasheets (1)

    National Semiconductor
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    CERAMIC PIN GRID ARRAY CPGA
    National Semiconductor Ceramic Pin Grid Array (CPGA) Original PDF 1.84MB 24

    CERAMIC PIN GRID ARRAY CPGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CERAMIC PIN GRID ARRAY 120 pins

    Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
    Contextual Info: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array


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    MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A PDF

    ceramic pin grid array package

    Abstract: CMGA7-P145C G145 CMGA7-P145
    Contextual Info: Ceramic Package Ceramic Pin Grid Array Packages CPGA S1 G145.A MIL-STD-1835 CMGA7-P145C (P-AG) –A– D 145 LEAD CERAMIC PIN GRID ARRAY PACKAGE INCHES D1 –B– S E1 E SYMBOL MIN MAX MIN MAX NOTES A 0.215 0.345 5.46 8.76 - A1 0.070 0.145 1.78 3.68 3 b


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    MIL-STD-1835 CMGA7-P145C 5M-1982. ceramic pin grid array package CMGA7-P145C G145 CMGA7-P145 PDF

    p68d

    Abstract: led matrix circuits CMGA3-P68 G68 Package CMGA3-P68D
    Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Packages CPGA S1 G68.B MIL-STD-1835 CMGA3-P68D (P-AC) –A– D 68 LEAD CERAMIC PIN GRID ARRAY PACKAGE INCHES D1 –B– S E1 E MIN MAX MIN MAX A 0.215 0.345 5.46 8.76 - 0.070 0.145 1.78 3.68


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    MIL-STD-1835 CMGA3-P68D 5M-1982. p68d led matrix circuits CMGA3-P68 G68 Package CMGA3-P68D PDF

    cpga dimensions

    Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Package CPGA G36.760x760A 36 LEAD CERAMIC PIN GRID ARRAY PACKAGE 15 17 19 21 22 A 0.008 (0.20) 13 14 12 11 16 18 20 23 24 25 26 0.050 (1.27) A 10 9 27 28 8 7 29 30 NOTE: Leads 5, 14, 23, & 32


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    760x760A cpga dimensions PDF

    ceramic pin grid array package

    Abstract: cpga dimensions
    Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Package CPGA G28.550x650A 28 LEAD CERAMIC PIN GRID ARRAY PACKAGE 12 13 15 17 18 11 10 14 16 19 A 0.008 (0.20) 9 8 20 21 7 6 22 23 0.050 (1.27) A 5 2 28 24 25 4 3 1 27 26 Typ. 0.100 (2.54) All Leads


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    550x650A 12/kages ceramic pin grid array package cpga dimensions PDF

    CPGA

    Abstract: amkor "ceramic frit" CPGA Package design
    Contextual Info: data sheet CERAMIC / HERMETIC CPGA Ceramic Pin Grid Array Package CPGA Amkor Technology is committed to continuing to service this long established standard industry package. This thru-hole package consists of a co-fired ceramic base that has a matrix of pins


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    DS805 CPGA amkor "ceramic frit" CPGA Package design PDF

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit PDF

    documentation for 32 bit alu in vlsi

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame SMJ320C25 D1057 5962-8861902XA SMJ320C25-50
    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 68-Pin 100-ns 80-ns documentation for 32 bit alu in vlsi CERAMIC PIN GRID ARRAY CPGA lead frame SMJ320C25 D1057 5962-8861902XA SMJ320C25-50 PDF

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit PDF

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit PDF

    k534

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit k534 PDF

    SMJ320C25GBM

    Abstract: smj320c25
    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit SMJ320C25GBM smj320c25 PDF

    smj320c25

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C25Ä SGUS007D 68-Pin 100-ns 80-ns smj320c25 PDF

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit PDF

    pkg 4015

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit pkg 4015 PDF

    LACT

    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit LACT PDF

    SMJ320C25

    Abstract: SMJ320C25-50 0006H rfid
    Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


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    SMJ320C25, SMJ320C2550 SGUS007D 68-Pin 100-ns 80-ns SMJ320C25 SMJ320C25-50 0006H rfid PDF

    Contextual Info: Nomenclature Guide HMU/HMA Types H MU 16 J C - PREFIX FAMILY MU: Multiplier MA: Multiplier/ Accumulator DEVICE TYPE 16, 17, 510 PACKAGE DESIGNATOR J: Plastic Leaded Chip Carrier PLCC G: Ceramic Pin Grid Array (CPGA) 1 35 /883 HIGH RELIABILITY DESIGNATOR


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    MIL-STD-883, 1-888-INTERSIL PDF

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Contextual Info: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


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    84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch PDF

    oki cross

    Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
    Contextual Info: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)


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    82CXXX 80CXXX: 82CXXX: 80C86 10MHz 12MHz oki cross CERAMIC LEADLESS CHIP CARRIER CLCC PDF

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


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    A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package PDF

    ms-029

    Abstract: FBGA1152
    Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


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    CPGA

    Abstract: cpga dimensions
    Contextual Info: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed


    OCR Scan
    PDF

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


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