CERAMIC PIN GRID ARRAY CPGA Search Results

p68d

Abstract: led matrix circuits CMGA3-P68 G68 Package CMGA3-P68D
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Packages CPGA S1 G68.B MIL-STD-1835 CMGA3-P68D (P-AC) –A– D 68 LEAD CERAMIC PIN GRID ARRAY PACKAGE INCHES D1 –B– S E1 E MIN MAX MIN MAX A 0.215 0.345 5.46 8.76 - 0.070 0.145 1.78 3.68

cpga dimensions

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Package CPGA G36.760x760A 36 LEAD CERAMIC PIN GRID ARRAY PACKAGE 15 17 19 21 22 A 0.008 (0.20) 13 14 12 11 16 18 20 23 24 25 26 0.050 (1.27) A 10 9 27 28 8 7 29 30 NOTE: Leads 5, 14, 23, & 32

ceramic pin grid array package

Abstract: cpga dimensions
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Package CPGA G28.550x650A 28 LEAD CERAMIC PIN GRID ARRAY PACKAGE 12 13 15 17 18 11 10 14 16 19 A 0.008 (0.20) 9 8 20 21 7 6 22 23 0.050 (1.27) A 5 2 28 24 25 4 3 1 27 26 Typ. 0.100 (2.54) All Leads

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

k534

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

smj320c25

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

Contextual Info: Nomenclature Guide HMU/HMA Types H MU 16 J C - PREFIX FAMILY MU: Multiplier MA: Multiplier/ Accumulator DEVICE TYPE 16, 17, 510 PACKAGE DESIGNATOR J: Plastic Leaded Chip Carrier PLCC G: Ceramic Pin Grid Array (CPGA) 1 35 /883 HIGH RELIABILITY DESIGNATOR

oki cross

Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
Contextual Info: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)

CPGA

Abstract: cpga dimensions
Contextual Info: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed

ME 1117

Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
Contextual Info: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6

Contextual Info: MECHANICAL DATA MCPG016 – NOVEMBER 1995 GK S-CPGA-P168 CERAMIC PIN GRID ARRAY 1.765 (44,83) SQ 1.759 (44,68) 1.600 (40,64) TYP 0.100 (2,54) TYP S R Q P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Ceramic Lid 0.121 (3,07) 0.099 (2,51)

Contextual Info: MECHANICAL DATA MCPG017 – NOVEMBER 1995 GL S-CPGA-P168 CERAMIC PIN GRID ARRAY (CAVITY-DOWN) 1.765 (44,83) SQ 1.759 (44,68) 1.600 (40,64) TYP 0.100 (2,54) TYP S R Q P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Ceramic Lid 0.121 (3,07)

Contextual Info: MECHANICAL DATA MCPG023 – OCTOBER 1997 GB S-CPGA-P68 CERAMIC PIN GRID ARRAY PACKAGE 0.970 (24,63) 0.950 (24,13) 0.536 (13,61) 0.800 (20,32) TYP 0.524 (13,31) J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.088 (2,23) 0.072 (1,83) 0.100 (2,54) 0.194 (4,98) 0.166 (4,16)

MCPG022

Contextual Info: MECHANICAL DATA MCPG022 – JANUARY 1997 GLA S-CPGA-P68 CERAMIC PIN GRID ARRAY 1.050 (26,67) SQ 0.850 (21,59) 0.800 (20,32) TYP 0.100 (2,54) TYP J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.055 (1,40) 0.045 (1,14) 0.086 (2,18) 0.074 (1,88) 0.011 (0,28) 0.005 (0,13)

MO-067-AC

Abstract: CMGA15-PN
Contextual Info: MECHANICAL DATA MCPG003A – JANUARY 1997 GA-GB S-CPGA-P11 X 11 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.000 (25,40) TYP L K J H G F E D C B A 1 B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55) 0.016 (0,41) 0.140 (3,56) 0.120 (3,05) 0.100 (2,54)

Contextual Info: Package outline SOT257-2 CPGA68: ceramic pin grid array package; 68 pins; body 27.9 x 27.9 x 2.4 mm D D1 pin 1 index mark location A2 E1 A1 E L detail X b e L K J e H G F E index pin D C B A 1 2 3 4 5 6 7 8 9 10 11 X seating plane DIMENSIONS mm dimensions are derived from the original inch dimensions

Contextual Info: Package outline SOT258-2 CPGA84: ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm D D1 pin 1 index mark location A2 E1 A1 E L detail X b e L K J e H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 X seating plane DIMENSIONS mm dimensions are derived from the original inch dimensions

Contextual Info: SMJ320C26 DIGITAL SIGNAL PROCESSOR SGUS 016A – AUGUST 1990 – REVISED AUGUST 2001 68-PIN GB PIN GRID ARRAY CERAMIC PACKAGE† TOP VIEW D 100-ns Instruction Cycle Time D 1568 Words of Configurable On-Chip D D D D D D D D D D D D D D D D D D D D D Data/Program RAM

Contextual Info: Package outline SOT259-2 CPGA120: ceramic pin grid array package; 120 pins; body 33.5 x 33.5 x 2.6 mm D D1 pin 1 index mark location A2 E1 E A1 L detail X b e N e M L K J H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 X seating plane DIMENSIONS mm dimensions are derived from the original inch dimensions

Contextual Info: MECHANICAL DATA MCPG015A – SEPTEMBER 1996 GFA S-CPGA-P141 CERAMIC PIN GRID ARRAY 1.080 (27,43) SQ 1.040 (26,42) 0.900 (22,86) TYP 0.100 (2,54) TYP 0.050 (1,27) TYP W V U T R P N M L K J H G F E D C B A 1 3 2 0.026 (0,66) 0.006 (0,15) 5 4 7 6 9 8 11 10

p181 gb

Abstract: S-CPGA-P181 p181 P181 pdf datasheet
Contextual Info: MECHANICAL DATA MCPG014 – OCTOBER 1995 GB S-CPGA-P181 CERAMIC PIN GRID ARRAY 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.055 (1,40) 0.045 (1,14)

Contextual Info: MECHANICAL DATA MCPG014 – OCTOBER 1995 GB S-CPGA-P181 CERAMIC PIN GRID ARRAY 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.055 (1,40) 0.045 (1,14)

Contextual Info: MECHANICAL DATA MCPG001A – JANUARY 1997 GA-GB S-CPGA-P9 X 9 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 0.800 (20,32) TYP J H G F E D C B A 1 2 DIM 0.100 (2,54) 0.050 (1,27) DIA 4 Places 0.016 (0,41) 4 MIN 5 6 7 8 9 MAX A 0.940 (23,88) 0.980 (24,89) A1 0.880 (22,35)