CERAMIC FRIT Search Results

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-F01 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index FPT-24C-F01 24-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-24C-F01 24-pin ceramic SOP (FPT-24C-F01) INDEX

fujitsu

Abstract: F*24002
Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC FPT-24C-F01 24-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-24C-F01 24-pin ceramic SOP (FPT-24C-F01) INDEX 22.86(.900) 6.86±0.25 TYP (.270±.010)

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-F01 28-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05 7.62±1.27 (.300±.050) 12.70±0.25 25.60(1.008) (.500±.010) MIN 0.127 –0.03

ca0555

Abstract: CA555
Contextual Info: Nomenclature Guide CA Types CA3260 A T PART NUMBER CAXXXX ELECTRICAL OPTIONS A, B, C, Blank PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Metal-Seal SBDIP E: Dual-In-Line Plastic (PDIP) F: Ceramic Dual-In-Line Frit-Seal (CERDIP) J: Ceramic Leadless Chip Carrier (CLCC)

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C-F01 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05 0.127 –0.03 +.002 7.62±1.27 (.300±.050)

24-PIN

Abstract: 24PIN
Contextual Info: SMALL OUTLINE PACKAGE 24 PIN CERAMIC FPT-24C-F01 24-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Frit seal FPT-24C-F01 24-pin ceramic SOP (FPT-24C-F01) INDEX 22.86(.900) 6.86±0.25 TYP (.270±.010) +2.16 8.00 –1.09 +.085 .315 –.043

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Contextual Info: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)

CERAMIC LEADLESS CHIP CARRIER

Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
Contextual Info: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)

Contextual Info: Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Harris I: Intersil 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal-Seal (SBDIP) 2: Can 4: Ceramic Leadless Chip Carriers (CLCC)

QFN016-G-S250-1

Abstract: LCC-16C-F01 R030
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)

36 pin CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)

WQFN032-G-R450-1

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)

F24.6 Package

Abstract: GDIP1-T24
Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F24.6 MIL-STD-1835 GDIP1-T24 (D-3, CONFIGURATION A) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

GDIP1-T28

Abstract: D-10
Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F28.6 MIL-STD-1835 GDIP1-T28 (D-10, CONFIGURATION A) LEAD FINISH 28 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F20.3 MIL-STD-1835 GDIP1-T20 (D-8, CONFIGURATION A) LEAD FINISH 20 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

GDIP1-T16

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A) LEAD FINISH 16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

diode t40

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F40.6 MIL-STD-1835 GDIP1-T40 (D-5, CONFIGURATION A) LEAD FINISH 40 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

GDIP1-T14

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A) LEAD FINISH 14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

CSSOP

Contextual Info: data sheet CERAMIC / HERMETIC CSSOP Ceramic Shrink Small Outline Package CSSOP This is a ceramic version of the Plastic SSOP package. The CSSOP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. This

GDIP3-T24

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F24.3 MIL-STD-1835 GDIP3-T24 (D-9, CONFIGURATION A) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

GDIP1-T18

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F18.3 MIL-STD-1835 GDIP1-T18 (D-6, CONFIGURATION A) LEAD FINISH 18 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D

Contextual Info: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F22.4 MIL-STD-1835 GDIP1-T22 (D-7, CONFIGURATION A) LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D