| 2SA1162 |  | Toshiba Electronic Devices & Storage Corporation | PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346 | Datasheet |  | 
| 79821-162HLF |  | Amphenol Communications Solutions | BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail. | PDF |  | 
| 131-5116-21D |  | Amphenol Communications Solutions | Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. | PDF |  | 
| 131-4116-21H |  | Amphenol Communications Solutions | Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. | PDF |  | 
| 77311-162-36LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch. | PDF |  |