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67996-716HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch |
PDF
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10117867-152TSLF
|
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Amphenol Communications Solutions
|
DDR2 SO-DIMM, Storage and Server Connector, Right Angle, Surface Mount, 200 Position, Standard Type, 0.60mm (0.024in) Pitch |
PDF
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|
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10117867-152FSLF
|
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Amphenol Communications Solutions
|
DDR2 SO-DIMM, Storage and Server Connector, Right Angle, Surface Mount, 200 Position, Standard Type, 0.60mm (0.024in) Pitch |
PDF
|
|
|
TPS826716SIPT
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Texas Instruments
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600-mA, High-Efficiency MicroSiP™ Step-Down Converter Module (Profile <1.0mm) 8-uSiP -40 to 85 |
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TPS826716SIPR
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|
Texas Instruments
|
600-mA, High-Efficiency MicroSiP™ Step-Down Converter Module (Profile <1.0mm) 8-uSiP -40 to 85 |
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