CDA 194 Search Results

CDA 194

Abstract: CDA194 k711 k7110 transistor 9751 DS1259 DS1260
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 11/25/97 Subject: PRODUCT CHANGE NOTICE - K71101 Description: Qualification of 16L PDIP lead frame with CDA194 (Cu Alloy) Description of Change: The lead frame material for some 16 lead PDIP devices is being changed from Alloy 42 to CDA

ASD103

Contextual Info: DATE: 9th April, 2014 PCN #: 2140 PCN Title: Leadframe material change for SOT-25, SOT-26 and TSOT25 packages Dear Customer: This is an announcement of change s to products that are currently being

CDA 194

Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Contextual Info: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.

Hitachi 64180

Abstract: pam 8304 HD64180 HD64570F16 CRC-16 HD64570 HD64570CP HD64570CP16 HD64570CP8I HD64570F
Contextual Info: HD64570 SCA Serial Communications Adaptor User’s Manual ADE-602-035B Rev. 3.0 August 28, 1998 Hitachi Company or Division Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this

Infineon SLB 9665

Abstract: 77CFX1360P 97CNFX1M00PE infineon m2M RSA 4096 78CFX3000P 14MCO480 76CF2561P emv certification 14MCO256
Contextual Info: Infineon Chip Card & Security ICs Portfolio Security for the connected world www.infineon.com/ccs The Integrity Guard concept marks the dawn of the Digital Security Era. The SLE 78 controller family with Integrity Guard radicalizes design-in by easing software

HD64572

Abstract: ADE-602-127A HD64572AFL33 intel 80386 block diagram 1S2074H TRB20 receiver eft 317 transistor TRB20 CDA 10.7 MC 40 Hitachi DSA00211
Contextual Info: HD64572 SCA-II User’s Manual ADE-602-127A Rev. 2.0 October 19, 1998 Hitachi, Ltd. MC-Setsu Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in

l0616

Abstract: UL486c L0616R16TB L0618 1601628-1 L061D18TB P125 L0456R16B UL 486C aluminum 2219 alloy
Contextual Info: Catalog 82221 Magnet Wire Terminals and Termination Systems Revised 10-02 MTM Crimpband Splices Product Facts • Made from a continuous coil of “Ribbon Connector” material ■ Magnet wires MTM Crimpband splices have machine-piercing serrations designed for displacing

MOLEX 5556 T drawing

Abstract: I8-24 5556-PBGS4P 5556 MOLEX 5556-GSPL 39-00-0197 5556-GS3P 5556-GS2P 39-00-0163 molex 5556
Contextual Info: 13 10 NOTES; 1. PART DESIGNED IN METRIC. 2. TERMINAL FOR USE WITH 5557 SERIES HOUSINGS. 3. MATES WITH 5558, 5566 AND 5569 SERIES CONNECTORS. 4. REFER TO DWG. NO. CS-5556*/5558* FOR CRIMP SPECIFICATIONS. .075 5. PRODUCT SPECIFICATION AND PROCESSING PARAMETERS SEE: PS-5556-001,

MO-166

Abstract: CDA 194 MP8000AN PSOP MO166 JEDEC MO 086 r.46 t 056 009j CDA194
Contextual Info: •^■00 ^■CSI .90 [.084] REF. CM CM I—L J oo tN °o din CtL ^ o I co CO in CN O ^ 1_ j CM i - l i 1*0 13.00 ■9.00 OJ [J m ] — CN in Is * o ro • CO l PIN 1 L DETAIL B SCALE: 8X 1.00 [.039] -.56 [.022] TYP. B 1.42 ~T [.056] 1.47 [.058] — - 3.18 [.125] TYP.

siemens b 58 468 la intel 80

Abstract: infineon b 58 468 la intel 80 ISAC-SX - PEB 3086 EA1 SMD siemens b 58 468 la intel SOCRATES isac-s isac-sx compare smd code EA2 tic 223 ITS02315
Contextual Info: D at a Sh e e t , D S 1 , Ja n . 2 00 3 ISAC-SX ISDN Subscriber Access Controller PEB 3086, V 1.4 Wired Communications N e v e r s t o p t h i n k i n g . ABM , ACE®, AOP®, ARCOFI®, ASM®, ASP®, DigiTape®, DuSLIC®, EPIC®, ELIC®, FALC®, GEMINAX®, IDEC®, INCA®, IOM®, IPAT®-2, ISAC®, ITAC®, IWE®, IWORX®,

PEF 7071

Abstract: C166CBC siemens microprocessor c161 C161U siemens b 58 295 bd intel 80 C161 C165 C166 FE4A V24-interface
Contextual Info: L IA T N E ID F N ICs for Communications O Embedded C166 with USB, IOM-2 Interface and HDLC Support C165 UTAH/C161U Version 1.0 C Last modified 12/14/98 Target Specification 12.98 DS 1 C165 UTAH/C161 U CONFIDENTIAL Revision History: Current Version: Version 1.0

Contextual Info: 1.0 1.1 1.2 1.3 1.4 1.5 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 3.0 3.1 3.2 4.0 4.1 PERFORMANCE FREQUENCY RANGE: DC-4GHz VOLTAGE RATING: 500V RMS sea level NOMINAL IMPEDANCE: 50 OHMS DWV: 1500 V RMS @ 60 Hz (sea level) TEMPERATURE RANGE: - 6 5 ‘C TO +165’C MATERIALS

JESD201

Abstract: A700 equivalent A700
Contextual Info: KEMET Surface Mount Aluminum Revision D, 12 March 07 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

panasonic inverter manual vf 200

Abstract: panasonic inverter manual vf 100 sony 369-42 murata filter cfw 455 ht murata filter cfj455 CFWM 450 HT TA8864N cfw 455 murata CFW 455 HT mitsubishi inverter fr service manual
Contextual Info: The Piezoelectric Effect Piezoelectric Effect Basics A piezoelectric substance is one that produces an electric charge when a mechanical stress is applied the substance is squeezed or stretched . Conversely, a mechanical deformation (the substance shrinks or expands) is produced

DIODE SMD S44

Abstract: TE 2161 motorola tic 122 C510 C768 ITS04492 MQFP44 TQFP48 uc 3081 IOM-2 Handler
Contextual Info: Dat a Sh eet , DS 1, S ept . 20 00 SBCX-X S / T B u s I n t e r f a c e C ir c u i t E x t e n d e d PEB/PEF 3081 Version 1.3 W ir e d C o m mu n i ca t io n s N e v e r s t o p t h i n k i n g . Edition 2000-09-27 Published by Infineon Technologies AG, St.-Martin-Strasse 53,

CDA 194

Abstract: tantalum nitride g 995
Contextual Info: ECONOMICAL TANFILM CONFORMALLY COATED SIP NETWORK ISO-9001 Registered SMXX SERIES • • • • • • • Sputtered tantalum nitride with passivation oxide layer High precision Low profile High component density Superior TCR tracking 3 standard sizes

OC-106 94V0 C

Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Contextual Info: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in

1670 SM

Contextual Info: Economical TaNFilm Conformal Coated SIP Network Welwyn Components SMXX Series • High precision • Low profile • High component density • Superior TCR tracking • 3 standard sizes • Proven reliability • Custom pin counts available Electrical Data

Contextual Info: Economical TaNFilm Conformal Coated SIP Network Welwyn S M X X SERIES • H igh p re c isio n • Low profile • High component density • Superior TCR tracking • 3 standard sizes • Proven reliability • Custom pin counts available Electrical Data

olin 7025

Abstract: 7025 alloy lead frame CDA 194 X10-4 eftec-64t Eftec 64t resistivity table sn 8400 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

3186

Abstract: siemens C510 isac-s isac-sx compare smd code EA2 C768 ITS05407 TQFP-64 IOM-2 Handler MQFP64 ISAC-SX TE - PSB 3186
Contextual Info: Da ta Sh ee t, DS 1 , Aug . 20 00 ISAC-SX TE ISDN Subscriber Access Controller for Terminals PSB/PSF 3186 Version 1.3 W ir e d C o m mu n i ca t io n s N e v e r s t o p t h i n k i n g . Edition 2000-08-23 Published by Infineon Technologies AG, St.-Martin-Strasse 53,

olin 7025

Abstract: Tamac4 TAMAC-4 7025 alloy lead frame CDA 194 sn 8400 eftec eftec-64t C10B4 tamac
Contextual Info: CHAPTER 5 SELECTED PROPERTIES OF IC PACKAGE MATERIALS The following tables list typical values for selected properties of materials used in IC packages Table 5-1 Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

RESISTOR SIP 9

Contextual Info: owe ECONOMICAL TANFILM CONFORMALLY COATED SIP NETWORK SIP SMXX SERIES High precision Low profile High com ponent density Superior TC R tracking 3 standard sizes Proven reliability Custom pin counts available The solution to increasing precision resistor component den­

Contextual Info: s im THE RESISTOR PEOPLE ECONOMICAL TANFILM CONFORMALLY COATED SIP NETWORK SIP S9XX High precision Low profile High component density Superior TCR tracking 3 standard sizes Proven reliability Custom pin counts available The solution to increasing precision