CBB PACKAGING CAPACITOR Search Results

CBB, CBC

Abstract: CBB CAPACITOR
Contextual Info: CBB, CBC Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • User value selection Product may not be to scale CHIP CAPACITORS • Five capacitors on a 0.019 x 0.048 inches CBB or 0.044 inches square (CBC) chip The CBB and CBC MOS capacitor chips each contain five

CBB CAPACITOR

Abstract: CBB, CBC chip capacitor vishay
Contextual Info: CBB, CBC Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • User value selection Product may not be to scale • Five capacitors on a 0.019 x 0.048 inches CBB or 0.044 inches square (CBC) chip CHIP CAPACITORS • Capacitance range: 1.0pF to 93pF in binary increments

Contextual Info: CBB, CBC Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • User value selection Product may not be to scale • Five capacitors on a 0.019 x 0.048 inches CBB or 0.044 inches square (CBC) chip CHIP CAPACITORS • Capacitance range: 1.0pF to 93pF in binary increments

Contextual Info: CBB, CBC www.vishay.com Vishay Electro-Films Thin Film Binary MOS Capacitors FEATURES • Wire bondable • User value selection • Five capacitors on a 0.019" x 0.048" CBB or 0.044" x 0.044" (CBC) chip • Case size: 0402, 0404 Product may not be to scale

Contextual Info: Hybrid and HDI Chip Components “CBA, CBC & CBC” Series Capacitors CBA Series Binary MOS/Features These chips each contain four binary value MOS capacitors and are intended to be used for functionally trimming microwave circuits after attachment. Silicon dioxide dielectric provides for low insertion loss.

Contextual Info: CBB 161 IL Series Polypropylene Film Capacitors for Snubber Applications Features Very low dissipation factor - Highest peak pulse capability - Double-sided metallized electrodes - Internal series connection - Metal sprayed contacts for low ESL - Plates for direct IGBT connection

CBB CAPACITOR

Contextual Info: CBB 165 IS Series Polypropylene Film Capacitors for Snubber Applications Features Very low dissipation factor CBB 161 IL - High peak pulse capability - Internal series connection - Metal sprayed contacts for low ESL - Plates for direct IGBT connection - Self-healing

Contextual Info: CBB 136 DP Series Polypropylene Film Capacitors for DC-Link Applications Features Very low dissipation factor - High ripple current capability - Self-healing - Long lifetime - Plastic case - RoHS compliant 2011/65/EU CBB 131 DL Plastic case CBB 136 DP Applications

Contextual Info: CBB 131 DL Series Polypropylene Film Capacitors for DC-Link Applications Features Very low dissipation factor - High ripple current capability - Self-healing - Long lifetime - Aluminum case - RoHS compliant 2011/65/EU CBB 131 DL Plastic case CBB 136 DP Applications

Contextual Info: FEATURES The CBB and CBC MOS cap acitor chips each contain five different cap acitors in binary increm ents allowing user many ch oices in value selection. T h ese chips are m anufactured using state-of-the-art thin-film tech ­ niques, are 100% electrically tested and visually inspected to MILSTD-883.

RMG 30

Contextual Info: Hybrid and HDI Chip Components Chip Capacitors Features EFT produces a line o f thin-film capacitors w hich have the advantages of sm aller size, increased perform ance, and com patible chip and w ire assem bly when com pared to their thick-film counter­

Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

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Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

powervr

Abstract: GPMC OMAP NAND JESD22-C101D
Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

GPMC OMAP NAND

Abstract: XOMAP3530FCUS IR P 648 H w2 p1 XOMAP3530BCBBE
Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

OMAP3525

Abstract: OMAP3530 SPRS507F t2d44 Jazelle v1 Architecture Reference Manual
Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core

t2d44

Abstract: 09 03 296 6421 SDRC GPMC OMAP NAND A7W15 OMAP3503 OMAP3515 ITU-R BT.656 to jpeg TIP 36 transistor
Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core