CASCADE MICROTECH Search Results
CASCADE MICROTECH Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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LM5041SD/NOPB |
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Cascaded PWM Controller 16-WSON -40 to 125 |
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LM5041ASD/NOPB |
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Cascaded PWM Controller 16-WSON -40 to 125 |
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LM5041SDX/NOPB |
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Cascaded PWM Controller 16-WSON -40 to 125 |
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LM5041SD |
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Cascaded PWM Controller 16-WSON -40 to 125 |
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LMK04110SQ/NOPB |
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Clock Jitter Cleaner with Cascaded PLLs 48-WQFN -40 to 85 |
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CASCADE MICROTECH Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: PyramidMW High-performance mmW Pyramid Probe card DATA SHEET For robust, lower cost and long-life production testing of 57 GHz to 81 GHz RFICs, Cascade Microtech’s Pyramid-MW Probe is the world’s only mm-wave mmW RF production probe card that ensures reliable and repeatable measurement results critical for high-yield testing. Cascade |
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PYRAMIDMW-DS-0212 | |
e5070Contextual Info: WinCalXE High-performance RF calibration software DATA SHEET Cascade Microtech’s WinCalXE software is a comprehensive and intuitive on-wafer RF measurement calibration tool to achieve accurate and repeatable S-parameter measurement, which is crucial for precision device modeling/characterization and engineering RFIC test. |
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WinCalXE-DS-1213 e5070 | |
Contextual Info: PyramidPDC50 High-performance DC parametric Pyramid Probe card DATA SHEET Cascade Microtech has developed its next-generation PDC50 DC parametric Pyramid Probe cards as the higher-performance, lower-cost alternative to existing industry solutions. Designed to enable the accurate monitoring of 65 nm and 45 nm parametric test structures, the |
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PyramidPDC50 PDC50 PDC50-DS-0212 PDC50 | |
Contextual Info: SiP/SoCSeries High-performance SiP/SoC Pyramid Probe card DATA SHEET Cascade Microtech’s high-performance SiP/SoC Pyramid Probe cards reduce your cost of ownership through enhanced throughput, reduced maintenance and increased yields — enabled by large multi-DUT probe surfaces, permanent probe alignment, superior electrical |
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PyramidSiPSoC-DS-0212 | |
Contextual Info: RFSeries High-performance RF Pyramid Probe cards DATA SHEET Cascade Microtech’s high-performance RF Pyramid Probe cards provide state-of-the-art signal integrity for wireless RF and microwave production test. Microstrip transmission lines maintain impedance control all the way to the bond pad. Patented ground and power planes |
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PyramidRF-DS-0212 | |
Contextual Info: QuadCard Cost-effective, versatile probe card solution DATA SHEET The QuadCard probe card is the industry’s irst conigurable, multi-quadrant probe adapter that employs innovative ine probe aligners - individual miniature positioners - to mount up to four Cascade Microtech probes on a single probe card. It is designed to accommodate |
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QuadCard-DS-0612 | |
MitutoyoContextual Info: eVue Digital Imaging System DATA SHEET The eVue digital imaging system is optimized for on-wafer test with Cascade Microtech’s probe stations. The revolutionary multi-optical path, multi-camera design of eVue offers the perfect balance of optical resolution, digital zoom and live-motion video. The eVue utilizes 3MP |
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EVUE-DS-1013 Mitutoyo | |
Contextual Info: CM300 300 mm semi-/fully-automated probe system DATA SHEET In device and process development, the right solution helps you handle test requirements that change from day to day. That’s why Cascade Microtech developed the CM300, a lexible on-wafer probe system that scales to meet your evolving needs. By capturing the |
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CM300 CM300, CM300 CM300-DS-0713 | |
Contextual Info: PyramidAccel Wafer-less Debug Fixture for Rapid Test Program Development DATA SHEET Cascade Microtech’s Pyramid Accel debug fixture provides a unique and innovative approach for accelerating the development of test programs for System-on-Chip SoC and RF devices by up to 30%. Comprised of a PCB containing customer-supplied packaged parts mounted |
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PYRAMIDACCEL-DS-0212 | |
Cascade MicrotechContextual Info: High-stable HF wafer contact ideal for automated wafer testing Z Probe High-Frequency Wafer Probe GS/SG 10 GHz A Ground-Signal (GS) coniguration is the most cost-effective RF design as less wafer space is taken up with contact pads. Cascade Microtech’s |Z| Probe in a GS/SG coniguration enables wafer-level testing with the highest accuracy and throughput available while |
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ZProbe10-ss-0310 Cascade Microtech | |
Contextual Info: The revolutionary high-resolution digital video microscope for failure analysis applications iVista LC Digital Video Microscope The iVista high-resolution digital video microscope is an intelligent microscopy tool, that goes far beyond simple visualisation, providing |
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iVista-LC-SS-0310 | |
Contextual Info: CurveTracer CT-3100/3200 For High-Power Semiconductor Device Characterization DATA SHEET Emerging energy standards and increasing power consumption demand additional performance capabilities. As such, pressure has been placed on manufacturers to rapidly design, develop and characterize new power devices to develop innovative chipset designs to provide more eficiency. |
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CT-3100/3200 CT-DS-0212 CT3100/3200 | |
Contextual Info: PAC200 200 mm Semi-automatic Cryogenic Probe System DATA SHEET The PAC200 is the ideal solution for automatic testing of wafers and substrates up to 200 mm in a cryogenic environment down to 77 K with liquid nitrogen or below 20 K with liquid helium. It supports a wide range of applications, including DC and RF measurements of the latest silicon, compound semiconductor and |
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PAC200 PAC200 PAC200-DS-1212 | |
Contextual Info: PAV200 200 mm Semi-automatic Vacuum Probe System DATA SHEET The PAV200 is the ideal solution for automatic testing of wafers and substrates up to 200 mm in a high vacuum environment up to 10-5 mbar. It supports a wide temperature range from -60°C to 300°C. |
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PAV200 PAV200 PAV200-DS-0412 | |
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Contextual Info: PA200DS-BR 200 mm Semi-automatic Probe System with Blue Ray DATA SHEET The PA200DS-BR was speciically designed for measurements requiring backside access to the wafer. The design allows you free access to both sides of the wafer, as well as high throughput due to a lightweight chuck design. The wafer itself can be ixed by vacuum or mechanically clamped to allow testing |
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PA200DS-BR PA200DS-BR s-7482 PA200DSBR-DS-0911 | |
Contextual Info: PA200BlueRay 200 mm Semi-Automatic Probe System with BlueRay Technology DATA SHEET The PA200 BlueRay sets a new standard for high-speed accuracy. Its precision ensures smooth probe landing with safe, repeatable electrical contact. In combination with the unique Z-profiling function, even extreme variation in height, such as the case with warped wafers, can be compensated. This test |
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PA200BlueRay PA200 PA200BR-DS-0412 | |
Contextual Info: PM300WLR 300 mm Manual Probe System DATA SHEET The PM300WLR is the world’s only dedicated probe system for wafer-level reliability WLR test of substrates up to 300 mm. The PM300WLR delivers accurate measurement results before the device is packaged, minimizing the time and cost to collect critical |
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PM300WLR PM300WLR PM300WLR-DS-0212 | |
Contextual Info: Edge Flicker noise Measurement System and Module DATA SHEET By addressing the entire measurement path — from probe tip to data acquisition — the Edge is the world’s irst and only measurement solution that delivers accurate licker noise measurements from 1 Hz up to 40 MHz. As a module or a complete system, the |
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Elite300, EDGE-DS-0612 | |
Contextual Info: PA200 200 mm Semi-automatic Probe System DATA SHEET The PA200 was designed to be the most precise and flexible semi-automatic test solution for wafers and substrates up to 200 mm. The PA200 gives you reliable probing and precise measurements on decreasing pad and feature sizes down to the submicron range. It is ideal for failure analysis FA , |
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PA200 PA200 PA200-DS-0913 | |
Contextual Info: PA200DSP 200 mm Semi-automatic Double-sided Probe System DATA SHEET The PA200DSP is the most precise and lexible semi-automatic double-sided test solution for wafers and substrates up to 200 mm. It is ideal for all applications requiring access from both the front and back sides of the wafer, such as failure analysis with |
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PA200DSP PA200DSP PA200DSP-DS-0412 | |
Contextual Info: PA300 300 mm Semi-automatic Probe System DATA SHEET The PA300 is a precise and lexible semi-automatic test solution for wafers and substrates up to 300 mm. It is ideal for failure analysis FA , device characterization and modeling from DC to 500 GHz. The PA300 utilizes precisely machined components to ensure the highest accuracy and stability. The ground slides and ball-screw |
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PA300 PA300 PA300-DS-0912 | |
scfm 50 10 kvContextual Info: APS/SPS200TESLA 200 mm Fully-Automated On-Wafer Probing Solution for High-Power Devices DATA SHEET The APS/SPS200TESLA is the industry’s irst fully-automated on-wafer probing solution focused on production performance for high-power semiconductors. The APS/SPS200TESLA improves productivity and yield at inal test by enabling production wafer |
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APS/SPS200TESLA APS/SPS200TESLA APS/SPS200TESLA-DS-1113 scfm 50 10 kv | |
Contextual Info: PM8DSP 200 mm Manual Double-sided Probe System DATA SHEET The PM8DSP is the most precise and lexible manual double-sided test solution for wafers and substrates up to 200 mm. It is ideal for all applications requiring access from both the top and back sides of the wafer, such as failure analysis with emission microscopes, |
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PM8DSP-DS-0312 | |
Contextual Info: PM300 300 mm Manual Probe System DATA SHEET The PM300 probe system is the ideal solution for engineering tests of 300 mm wafers and substrates. Whatever your application, the versatility of the PM300 meets all requirements from failure analysis FA to device and wafer characterization (DWC) to |
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PM300 PM300 PM300-DS-0212 |