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87901-114HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail. |
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L17TF3701114
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 37 Socket, Bright Tin Shell, 0.38um (15 in) Gold, M3 Threaded Boardlock |
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59112-T40-11-143LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 22 Positions. |
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L17TF2501114
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Socket, Bright Tin Shell, 0.38um (15 in) Gold, M3 Threaded Boardlock |
PDF
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68001-114HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 14 Positions, 2.54 mm (0.100in) Pitch. |
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