C7025 STRIP SPECIFICATION Search Results

Contextual Info: 1 , 5 t ° 05 s^g 0.3 3.3to 1 9.0 CIRCUIT DIAGRAM _r | (|) tu . to co ^ © © d) HOLE LAYOUT, TOP VIEW ^ 0 05 I 6x 00.9 C: COMMON PIN Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:

Contextual Info: 9.0 _r “L CO CO 1 = _ !_ _ = [ o ,1 .5 T csi oo +1 LO 3 ^ CO CO / ,0 .8 P.C.B. LAND DIMENSION Viewed from the switch mounting face CIRCUIT DIAGRAM C Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength:

Contextual Info: 9.0 HOLE LAYOUT 0.05 TOP VIEW 6x 0 O.9 r 1.5 t 0 . 05 -x.y -x 2.5 b . 2.5 a 2.0 LO 0.3 L 3.3 . CIRCUIT DIAGRAM Vr// -q C: COMMON PIN 0.25 Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:

104480-9

Abstract: 567297-2
Contextual Info: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—

Contextual Info: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability

567297-2

Contextual Info: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,

Tyco 108-25007

Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Contextual Info: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold

tyco 108-25034

Abstract: 6-104909-5 103672-3 tyco 114-25026 103957-1 1-103688-3 5-103634-1 5-103735-9 5-103908-4 C7025
Contextual Info: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold

2032b

Abstract: 085002 6-103958-1 amp quality crimping handbook 87733-1 UL 2896 11027 UL 94v-2 mt 4407 1-87666-6
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

244252

Abstract: 86016-2 crimp tool 16500-3 1307819
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

AMPMODU I

Abstract: amp quality crimping handbook 244252 1-87666-6
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

326 004 mte

Abstract: 5-147278-1 93 pin connector 534974-4 102387-3 1-87666-6 86016-2 102387-1 534204-5 534974-4 1-102536-1
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

220v AC voltage stabilizer schematic diagram

Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585

A23 780-4

Abstract: vhdl code for 8-bit BCD adder star delta wiring diagram with timer CI 7448 XC6200 XC4013XL PIN BG256 100352 The 555 Timer Applications Sourcebook schemat xilinx xc3000a MARKING CODE
Contextual Info: The Programmable Logic Data Book April 1998 R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc.

7448 bcd to seven segment decoder

Abstract: 7448 seven segment display data sheet datasheet 7448 BCD to Seven Segment display CI 7448 The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard SERVICE MANUAL OF FLUKE 175 100352 The Transistor Manual Japanese 1993 xc95144 pinout
Contextual Info: The Programmable Logic Data Book July 1998 R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc.

SERVICE MANUAL OF FLUKE 175

Abstract: SHARP IC 701 I X11 dot led display large size with circuit diagram IR power mosfet switching power supply The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard distributed control system of power plant 100352 XC3090-100PG175 xc95144 pinout
Contextual Info: R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, XACTstep, XACTstep Advanced, XACTstep Foundry, XACT-Floorplanner,