C7025 STRIP SPECIFICATION Search Results

Contextual Info: 1 , 5 t ° 05 s^g 0.3 3.3to 1 9.0 CIRCUIT DIAGRAM _r | (|) tu . to co ^ © © d) HOLE LAYOUT, TOP VIEW ^ 0 05 I 6x 00.9 C: COMMON PIN Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:

Contextual Info: 9.0 _r “L CO CO 1 = _ !_ _ = [ o ,1 .5 T csi oo +1 LO 3 ^ CO CO / ,0 .8 P.C.B. LAND DIMENSION Viewed from the switch mounting face CIRCUIT DIAGRAM C Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength:

Contextual Info: 9.0 HOLE LAYOUT 0.05 TOP VIEW 6x 0 O.9 r 1.5 t 0 . 05 -x.y -x 2.5 b . 2.5 a 2.0 LO 0.3 L 3.3 . CIRCUIT DIAGRAM Vr// -q C: COMMON PIN 0.25 Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:

Contextual Info: Catalog 296642 Focused Product Guide ampm odu .025 [0 .64] Revised 7-98 Printed Circuit Board Connectors Continued Interconnection System - Mod. IV Wire-Applied Housings, Double-Row,

Contextual Info: AMPMODU Interconnection System Short Point Crimp Snap-In Receptacle Contacts Material and Finish .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp

567297-2

Contextual Info: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp

104480-9

Abstract: 567297-2
Contextual Info: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—

104480-9 crimp tool

Contextual Info: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish: Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A—Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin-lead in

Contextual Info: AMPMODU Interconnection System Short Point, Crimp Snap-In Wire-Applied Contacts and Housings Product Facts • Short point of contact mates with .169 [4.29] to .259 [6.58] long post ■ Double-row housings are end-to-end and side-to-side stackable ■ Terminates 32-20 AWG

Contextual Info: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability

567297-2

Contextual Info: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,

FLUX TYPE ROL0

Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Contextual Info: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract

C7025 strip specification

Abstract: 103960-1 tyco 108-25034 1307819 103672-3 103673-3 104480-9 crimp tool amp 20 pin shrouded header latches amp tyco applicator AMP Application Specification 114-25026
Contextual Info: Catalog 1307612 Revised 7-01 Product Facts • Receptacle assemblies mate with .025 [0.64] sq. posts; mating post length is .200 [5.08] min., .250 [6.35] max. ■ Proven AMPMODU receptacle contact design; dual cantilever beams, built-in antioverstress, completely

Tyco 108-25007

Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Contextual Info: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold

530902-8

Abstract: 102387-3 1039799 82007 1307819 1-103686-5 Tyco crimp tool 91517-1 104480-8 2-87175-1 Tyco 108-25007
Contextual Info: AMPMODU Interconnection System Locking Clip Contacts and Housings Product Facts • Self-retaining contacts provide permanent connection with quick connect and disconnect ■ Fast, easy installation with no additional locking hardware required ■ Mates with .025 [0.64]

2032b

Abstract: 085002 6-103958-1 amp quality crimping handbook 87733-1 UL 2896 11027 UL 94v-2 mt 4407 1-87666-6
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

244252

Abstract: 86016-2 crimp tool 16500-3 1307819
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

AMPMODU I

Abstract: amp quality crimping handbook 244252 1-87666-6
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

326 004 mte

Abstract: 5-147278-1 93 pin connector 534974-4 102387-3 1-87666-6 86016-2 102387-1 534204-5 534974-4 1-102536-1
Contextual Info: AMPMODU Interconnection System Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable Dual Entry, End Stackable, Low Profile, .100 x .100 [2.54 x 2.54] Centerline, .200 [5.08] Tine Spacing .125±.010

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

din 42802

Abstract: AMP,simel insulated crimp lugs raychem catalog termination kit and splicing kit cma 10024 531220-2 simel AMP 2-520128-2 7483 Raychem 55A CATALOG 42770-2
Contextual Info: Catalog 296642 Focused Product Guide Revised 3-99 Input/Output Connectors Index Table of Contents Section One: Input/Output Connector Click Below Subminiature D, HDP-20 Crimp, Snap-In Connector AMPLIMITE Crimp, Snap-In Contacts and Solder Contacts, Size 20 D

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or