C4545 Search Results

LAD66A4

Abstract: PGA zif socket 478 electroless nickel MIL-STD-810 TX0547 TX0522ND 8815 k cts ocxo CTS ocxo 125 ocxo cts 03 transistor c4040
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS 6 CLIP AND TAPE STYLES 7 ZIF STANDARD CIRCUIT BOARD RETAINERS

Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES

bga 7x7

Abstract: BDN21-3CB C2121M cts T412 0.3mm qfp
Contextual Info: CTS Series BDN Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

panasonic c5904

Abstract: L9741 H9730 h9745 H-9730 l9742 D790011 H9718 h9723 SLG84435
Contextual Info: 8 6 7 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 5 2 3 4 1 CK APPD SANTANA - M51 MLB REV ZONE ECN H ENG APPD DESCRIPTION OF CHANGE 468168 PRODUCTION RELEASED

zif rod

Contextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS

0.3mm pitch BGA

Abstract: vme 3u board standards 4-40 Kapton Washer led matrix 16X16 c2929 rod 456 LAT03B5U PGA zif socket 478 t410 TRANSISTOR up3-to3-b
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS CTS Electronic Components - California CTS ® TABLE OF CONTENTS PAGE CORPORATE PROFILE 2 ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS

PS8121E

Abstract: f2116te20v c4589 AN12946 PS8121 C4574 SLG8SP568V cx20561-15z schematic diagram lcd monitor lenovo lenovo
Contextual Info: Intel Penryn DC, QC, Extream Processor 3,5 June 18 ' 08 AGTL+ FSB UNBUFFERED DDR3 SODIMM Normal/Reverse Socket N-note Block Diagram ITP Conn. UNBUFFERED DDR3 SODIMM Normal/Reverse Socket Channel B 1067/800MHz Keyboard Light LVDS Intel Cantiga-PM DDR3 1067/800MHz

ALC889DSD

Abstract: WPCE775L SL28648BLC transistor c4544 NS682403P wpce775 c2097 transistor transistor C4770 UPEK transistor C4046
Contextual Info: 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date D C B Page 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Rev. Title of Schematics Page Index page BLOCK DIAGRAM CLOCK GEN (SL28648BLC)

R61517

Abstract: AS0B32 MXM spec pp601 40 AS0B326 126S0086 FST 172 U7200 Apple K23 MLB J9402
Contextual Info: 8 6 7 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 5 2 3 4 1 CK APPD SANTANA - M51 MLB REV ZONE ECN 17 ENG APPD DESCRIPTION OF CHANGE 440406 ENGINEERING RELEASED

AER19-19-12CB

Abstract: AER19-19-15CB APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB
Contextual Info: Series AER Forged Heat Sinks CTS FORGED HEAT SINKS WITH PLATE FINS ELECTRONIC COMPONENTS Technical Data DESIGN FEATURES • Precision forging technology for high power applications • Designed A forluminum BGA and other surface mount with packages Forged

C2121M cts

Abstract: bdn10-3cba01 BDN21-3CB
Contextual Info: CTS Series BND Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

AER25-25-12CB

Abstract: AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M
Contextual Info: Series AER Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

PS8121E

Abstract: USB2507-ADT cx20561-15z TS3DV421RUAR-GP AN12946A AN12946 R7121 f2116te20v lenovo schematic diagram lcd monitor lenovo
Contextual Info: Intel Penryn DC, QC, Extream Processor 3,5 June 18 ' 08 AGTL+ FSB UNBUFFERED DDR3 SODIMM Normal/Reverse Socket N-note Block Diagram ITP Conn. Channel B UNBUFFERED DDR3 SODIMM Normal/Reverse Socket 1067/800MHz Keyboard Light LVDS Intel Cantiga-PM DDR3 1067/800MHz

C4040T

Abstract: APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB APR27-27-12CB APR35 C2323M
Contextual Info: CTS Series APR Forged Heat Sinks FORGED HEAT SINKS WITH PIN FINS Technical Data DESIGN FEATURES ELECTRONIC COMPONENTS • Precision forging technology for high power applications Forged Aluminum Heat Sinks with Pin Fins • Omnidirectional pins F•eatures

C2929

Abstract: Chomerics Thermattach C2121 C2121M APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB C4040T C2121M cts
Contextual Info: Series APF Forged Heat Sinks ELECTRONIC COMPONENTS Technical Data Low Height Thin-Fin Forged Aluminum Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select From Multiple Fin Heights

CU1100

Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
Contextual Info: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

C2121M

Abstract: APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S
Contextual Info: Series APR Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights